Integrated circuits with metal-oxide-semiconductor transistors having enhanced gate depletion layers
    1.
    发明授权
    Integrated circuits with metal-oxide-semiconductor transistors having enhanced gate depletion layers 有权
    具有增强的栅耗尽层的金属氧化物半导体晶体管的集成电路

    公开(公告)号:US07812408B1

    公开(公告)日:2010-10-12

    申请号:US11975010

    申请日:2007-10-16

    IPC分类号: H01L27/088

    摘要: An integrated circuit is provided with groups of transistors that handle different maximum voltage levels. The transistors may be metal-oxide-semiconductor transistors having body, source, drain, and gate terminals. The gate of each transistor may have a gate insulator and a gate conductor. The gate conductor may be formed from a semiconductor such as polysilicon. Adjacent to the gate insulator, the polysilicon gate conductor may have a depletion layer. The depletion layer may have a thickness that is related to the doping level in the polysilicon gate conductor. By reducing the doping level in the polysilicon gates of some of the transistors, the equivalent oxide thickness of those transistors is increased, thereby enhancing their ability to withstand elevated voltages without experiencing gate oxide breakdown due to hot carrier injection effects.

    摘要翻译: 集成电路设置有处理不同最大电压电平的晶体管组。 晶体管可以是具有主体,源极,漏极和栅极端子的金属氧化物半导体晶体管。 每个晶体管的栅极可以具有栅极绝缘体和栅极导体。 栅极导体可以由诸如多晶硅的半导体形成。 与栅极绝缘体相邻,多晶硅栅极导体可以具有耗尽层。 耗尽层可以具有与多晶硅栅极导体中的掺杂水平相关的厚度。 通过降低一些晶体管的多晶硅栅极中的掺杂水平,这些晶体管的等效氧化物厚度增加,从而增强了其承受高电压的能力,而不会由于热载流子注入效应而经历栅极氧化物击穿。

    Process for making an EEPROM active area castling
    2.
    发明授权
    Process for making an EEPROM active area castling 失效
    制造EEPROM活动区域铸造的过程

    公开(公告)号:US06187634B1

    公开(公告)日:2001-02-13

    申请号:US09045737

    申请日:1998-03-19

    IPC分类号: H01L21336

    摘要: Provided is a “castled” active area mask. A castled active area mask is one which has been lengthened to extend beyond its intended intersection with a tunnel dielectric to form the tunnel window of an EEPROM cell, and has also been widened in at least a portion of the extension. For example, in one preferred embodiment, a castled extension may have a “T” shape. The castled active area generated by such a mask provides a buffer to absorb field oxide encroachment before it reaches the EEPROM cell's TD window. A mask in accordance with the present invention may be used to fabricate EEPROM cells which are not subject to TD window size variations due to field oxide encroachment, and EEPROM cell arrays of increased density.

    摘要翻译: 提供了一个“castled”活动区域面罩。 壁挂式有源区掩模是延长超过其与隧道电介质的预期交点的形式的有源区掩模,以形成EEPROM单元的隧道窗口,并且还在扩展的至少一部分中加宽。 例如,在一个优选实施例中,城堡延伸部可以具有“T”形状。 由这种掩模产生的拱形有源区域在到达EEPROM单元的TD窗口之前提供缓冲器以吸收场氧化物侵入。 根据本发明的掩模可以用于制造由于场氧化物侵入而不受TD窗口尺寸变化的EEPROM单元以及增加密度的EEPROM单元阵列。

    Field emission erasable programmable read-only memory
    3.
    发明授权
    Field emission erasable programmable read-only memory 失效
    场发射可擦除可编程只读存储器

    公开(公告)号:US06038171A

    公开(公告)日:2000-03-14

    申请号:US953849

    申请日:1997-10-15

    申请人: Peter J. McElheny

    发明人: Peter J. McElheny

    摘要: Disclosed is a field-emission erasable programmable read-only memory cell which includes one or more field-emission tips on one or more layers of the cell. The cell is programmable and/or erasable by electron emission from the emission tips. Methods of making and using this field-emission erasable programmable read-only memory (FEEPROM) cell are also provided.

    摘要翻译: 公开了一种场发射可擦除可编程只读存储器单元,其包括在该单元的一个或多个层上的一个或多个场致发射尖端。 电池通过来自发射端的电子发射是可编程的和/或可擦除的。 还提供了制造和使用该场发射可擦除可编程只读存储器(FEEPROM)单元的方法。

    Integrated circuit and a method to optimize strain inducing composites
    4.
    发明授权
    Integrated circuit and a method to optimize strain inducing composites 有权
    集成电路和优化应变诱导复合材料的方法

    公开(公告)号:US08765541B1

    公开(公告)日:2014-07-01

    申请号:US13214056

    申请日:2011-08-19

    IPC分类号: H01L21/8238

    摘要: A method to design an IC is disclosed to provide a uniform deposition of strain-inducing composites is disclosed. The method to design the IC comprises, determining a total strain-inducing deposition area on an IC design. Then, the total strain inducing deposition area is compared with a predefined size. A dummy diffusion area is modified to increase the total strain-inducing deposition area, when the total strain-inducing deposition area is below the predefined size. Finally, the strain-inducing deposition area is optimized. A method to manufacture the IC and the IC is also disclosed.

    摘要翻译: 公开了一种设计IC的方法,以提供应变诱导复合材料的均匀沉积。 设计IC的方法包括:确定IC设计上的总应变诱导沉积区域。 然后,将总应变诱导沉积区域与预定尺寸进行比较。 当总应变诱导沉积面积低于预定尺寸时,修改虚拟扩散区域以增加总应变诱导沉积面积。 最后,应变诱导沉积区域被优化。 还公开了制造IC和IC的方法。

    Method and system for hard failure repairs in the field
    6.
    发明授权
    Method and system for hard failure repairs in the field 有权
    在现场进行硬故障维修的方法和系统

    公开(公告)号:US07277346B1

    公开(公告)日:2007-10-02

    申请号:US11012877

    申请日:2004-12-14

    IPC分类号: G11C17/18

    摘要: A semiconductor system and method for repairing failures of a packaged integrated circuit system are provided. The method includes detecting a failure associated with a packaged integrated circuit system after the packaged integrated circuit system is packaged, and repairing the failure by activating a redundancy circuit in the packaged integrated circuit system and deactivating a defective circuit associated with the failure. The process for repairing the failure includes applying a repair voltage to a polysilicon fuse to change a conductivity state of the polysilicon fuse from a first state to a second state. In another embodiment, the polysilicon fuse is replaced by a metal fuse, an anti-fuse, or a non-volatile random access memory.

    摘要翻译: 提供了一种用于修复封装集成电路系统的故障的半导体系统和方法。 该方法包括在打包的集成电路系统被封装之后检测与封装的集成电路系统相关联的故障,以及通过激活封装的集成电路系统中的冗余电路来修复故障,并且去激活与故障相关的故障电路。 修复故障的过程包括将修复电压施加到多晶硅熔丝以将多晶硅熔丝的导电状态从第一状态改变到第二状态。 在另一个实施例中,多晶硅熔丝由金属熔断器,反熔丝或非易失性随机存取存储器代替。

    EEPROM active area castling
    7.
    发明授权
    EEPROM active area castling 失效
    EEPROM活动区域

    公开(公告)号:US06624467B1

    公开(公告)日:2003-09-23

    申请号:US10193085

    申请日:2002-07-09

    IPC分类号: H01L29788

    CPC分类号: H01L27/11519 H01L27/0203

    摘要: Provided is a “castled” active area mask. A castled active area mask is one which has been lengthened to extend beyond its intended intersection with a tunnel dielectric to form the tunnel window of an EEPROM cell, and has also been widened in at least a portion of the extension. For example, in one preferred embodiment, a castled extension may have a “T” shape. The castled active area generated by such a mask provides a buffer to absorb field oxide encroachment before it reaches the EEPROM cell's TD window. A mask in accordance with the present invention may be used to fabricate EEPROM cells which are not subject to TD window size variations due to field oxide encroachment, and EEPROM cell arrays of increased density.

    摘要翻译: 提供了一个“castled”活动区域面罩。 壁挂式有源区掩模是延长超过其与隧道电介质的预期交点的形式的有源区掩模,以形成EEPROM单元的隧道窗口,并且还在扩展的至少一部分中加宽。 例如,在一个优选实施例中,城堡延伸部可以具有“T”形。 由这种掩模产生的拱形有源区域在到达EEPROM单元的TD窗口之前提供缓冲器以吸收场氧化物侵入。 根据本发明的掩模可以用于制造由于场氧化物侵入而不受TD窗口尺寸变化的EEPROM单元以及增加密度的EEPROM单元阵列。

    Castled active area mask
    8.
    发明授权
    Castled active area mask 失效
    壁挂活动区域面罩

    公开(公告)号:US06472272B1

    公开(公告)日:2002-10-29

    申请号:US09733850

    申请日:2000-12-08

    IPC分类号: H01L21336

    摘要: Provided is a “castled” active area mask. A castled active area mask is one which has been lengthened to extend beyond its intended intersection with a tunnel dielectric to form the tunnel window of an EEPROM cell, and has also been widened in at least a portion of the extension. For example, in one preferred embodiment, a castled extension may have a “T” shape. The castled active area generated by such a mask provides a buffer to absorb field oxide encroachment before it reaches the EEPROM cell's TD window. A mask in accordance with the present invention may be used to fabricate EEPROM cells which are not subject to TD window size variations due to field oxide encroachment, and EEPROM cell arrays of increased density.

    摘要翻译: 提供了一个“castled”活动区域面罩。 壁挂式有源区掩模是延长超过其与隧道电介质的预期交点的形式的有源区掩模,以形成EEPROM单元的隧道窗口,并且还在扩展的至少一部分中加宽。 例如,在一个优选实施例中,城堡延伸部可以具有“T”形状。 由这种掩模产生的拱形有源区域在到达EEPROM单元的TD窗口之前提供缓冲器以吸收场氧化物侵入。 根据本发明的掩模可以用于制造由于场氧化物侵入而不受TD窗口尺寸变化的EEPROM单元以及增加密度的EEPROM单元阵列。

    Multiport memory element circuitry
    9.
    发明授权
    Multiport memory element circuitry 有权
    多端口存储元件电路

    公开(公告)号:US08755218B2

    公开(公告)日:2014-06-17

    申请号:US13149249

    申请日:2011-05-31

    IPC分类号: G11C11/00

    摘要: Integrated circuits with multiport memory elements may be provided. A multiport memory element may include a latching circuit, a first set of address transistors, and a second set of address transistors. The latching circuit may include cross-coupled inverters, each of which includes a pull-up transistor and a pull-down transistor. The first set of address transistors may couple the latching circuit to a write port, whereas the second set of address transistors may couple the latching circuit to a read port. The pull-down transistors and the second set of address transistors may have body bias terminals that are controlled by a control signal. During data loading operations, the control signal may be temporarily elevated to weaken the pull-down transistors and the second set of address transistors to improve the write margin of the multiport memory element.

    摘要翻译: 可以提供具有多端口存储器元件的集成电路。 多端口存储元件可以包括锁存电路,第一组地址晶体管和第二组地址晶体管。 锁存电路可以包括交叉耦合的反相器,每个反相器包括上拉晶体管和下拉晶体管。 第一组地址晶体管可以将锁存电路耦合到写入端口,而第二组地址晶体管可以将锁存电路耦合到读取端口。 下拉晶体管和第二组地址晶体管可以具有由控制信号控制的体偏置端子。 在数据加载操作期间,控制信号可以临时升高以削弱下拉晶体管和第二组地址晶体管,以改善多端口存储器元件的写入裕度。

    Integrated circuits with asymmetric transistors
    10.
    发明授权
    Integrated circuits with asymmetric transistors 有权
    具有不对称晶体管的集成电路

    公开(公告)号:US08638594B1

    公开(公告)日:2014-01-28

    申请号:US13110823

    申请日:2011-05-18

    IPC分类号: G11C11/00 H01L21/02

    摘要: Integrated circuits with memory elements are provided. A memory element may include a storage circuit coupled to data lines through access transistors. Access transistors may be used to read data from and write data into the storage circuit. An access transistor may have asymmetric source-drain resistances. The access transistor may have a first source-drain that is coupled to a data line and a second source-drain that is coupled to the storage circuit. The second source-drain may have a contact resistance that is greater than the contact resistance associated with the first source-drain. Access transistors with asymmetric source-drain resistances may have a first drive strength when passing a low signal and a second drive strength when passing a high signal to the storage circuit. The second drive strength may be less than the first drive strength. Access transistors with asymmetric drive strengths may be used to improve memory read/write performance.

    摘要翻译: 提供具有存储元件的集成电路。 存储元件可以包括通过存取晶体管耦合到数据线的存储电路。 存取晶体管可用于从存储电路读取数据并将数据写入存储电路。 存取晶体管可以具有不对称的源极 - 漏极电阻。 存取晶体管可以具有耦合到数据线的第一源极 - 漏极和耦合到存储电路的第二源极 - 漏极。 第二源极 - 漏极可以具有大于与第一源极 - 漏极相关联的接触电阻的接触电阻。 具有不对称源极 - 漏极电阻的存取晶体管在通过高信号到存储电路时通过低信号和第二驱动强度时可具有第一驱动强度。 第二驱动强度可能小于第一驱动强度。 具有非对称驱动强度的存取晶体管可用于提高存储器读/写性能。