摘要:
Integrated circuits may be provided that include memory elements that produce output control signals and corresponding programmable logic circuitry that receives the output control signals from the memory elements. The memory elements may include bistable storage elements formed from circuits such as cross-coupled inverters. The inverters may include n-channel metal-oxide-semiconductor transistors with p-metal gate conductors and n-channel metal-oxide-semiconductor transistors with p-metal gate conductors. These gate conductor assignments are the reverse of the gate conductor assignments used in the n-channel and p-channel transistors in other circuitry such as the programmable logic circuitry. The reversed gate conductor assignments increase the threshold voltages of the transistors in the memory elements to improve reliability in scenarios in which the memory elements are overdriving pass transistors in the programmable logic circuitry.
摘要:
A low-voltage reference circuit may have a pair of semiconductor devices. Each semiconductor device may have an n-type semiconductor region, an n+ region in the n-type semiconductor region, a metal gate, and a gate insulator interposed between the metal gate and the n-type semiconductor region through which carriers tunnel. The metal gate may have a work function matching that of p-type polysilicon. The gate insulator may have a thickness of less than about 25 angstroms. The metal gate may form a first terminal for the semiconductor device and the n+ region and n-type semiconductor region may form a second terminal for the semiconductor device. The second terminals may be coupled to ground. A biasing circuit may use the first terminals to supply different currents to the semiconductor devices and may provide a corresponding reference output voltage at a value that is less than one volt.
摘要:
A method for improving analog circuits performance using a circuit design using forward bias and a modified mixed-signal process is presented. A circuit consisting plurality of NMOS and PMOS transistors is defined. The body terminal of the NMOS transistors are coupled to a first voltage source and the body terminal of the PMOS transistors are coupled a second voltage source. Transistors in the circuit are selectively biased by applying the first voltage source to the body terminal of each selected NMOS transistor and applying the second voltage source to the body terminal of each selected PMOS transistor. In one embodiment, the first voltage source and the second voltage source are modifiable to provide forward and reverse bias to the body terminal of the transistors.
摘要:
Apparatus for integrated capacitors and associated methods are disclosed. In one embodiment, an integrated capacitor includes a first plurality of metal members that are fabricated using a first plurality of metal layers, and are oriented in a first orientation. The integrated capacitor also includes a second plurality of metal members that are fabricated using a second plurality of metal layers. The second plurality of metal members are oriented transverse to the first orientation. The integrated capacitor further includes a third plurality of metal members, which are fabricated using a third plurality of metal layers, and are oriented in the first orientation.
摘要:
A programmable device with a metal oxide semiconductor field effect transistor (MOSFET) surrounded by a programmable substrate region is described. The MOSFET has a source and drain region separated by a channel region with an insulating region and gate disposed above the channel region. A junction disposed within the substrate region controls the programmable substrate region. Biasing the junction depletes the substrate region, which isolates the body of the MOSFET from a secondary well. When the junction is left unbiased, the body of the MOSFET is electrically coupled to the secondary well.
摘要:
A first trimming capacitor having a first terminal and a second terminal is coupled in parallel between a first terminal and a second terminal of a first capacitor. The first trimming capacitor comprises a first plurality of switched capacitors having different capacitances coupled in parallel. Each of the switched capacitors comprises a switch capacitor and a switch coupled in series. In an illustrative application the first capacitor and the first trimming capacitor are coupled between an output terminal of an operational amplifier (op-amp) and an inverting input terminal of the op-amp. A second capacitor and a second trimming capacitor similar to the first capacitor and the first trimming capacitor are coupled between an input and the inverting input terminal of the op-amp.
摘要:
A low-voltage reference circuit may have a pair of semiconductor devices. Each semiconductor device may have an n-type semiconductor region, an n+ region in the n-type semiconductor region, a metal gate, and a gate insulator interposed between the metal gate and the n-type semiconductor region through which carriers tunnel. The metal gate may have a work function matching that of p-type polysilicon. The gate insulator may have a thickness of less than about 25 angstroms. The metal gate may form a first terminal for the semiconductor device and the n+ region and n-type semiconductor region may form a second terminal for the semiconductor device. The second terminals may be coupled to ground. A biasing circuit may use the first terminals to supply different currents to the semiconductor devices and may provide a corresponding reference output voltage at a value that is less than one volt.
摘要:
Mixed gate varactors are provided. The mixed gate varactors may include a semiconductor region of a given doping type. A first terminal for the varactor may be formed from a gate structure on the semiconductor region. A second terminal for the varactor may be formed from a heavily doped region in the semiconductor region that has the same doping type as the given doping type. A third terminal for the varactor may be formed from a heavily doped region in the semiconductor region that has a different doping type than the given doping type. The gate structure may include multiple gate conductors on a gate insulator. The gate insulator may be a high-K dielectric. The gate conductors may be metals or other materials that have different work functions. A conductive layer such as a layer of polysilicon may electrically connect the first and second gate conductors.
摘要:
Nonvolatile memory element circuitry is provided that is based on metal-oxide-semiconductor transistor structures. A nonvolatile memory element may be based on a metal-oxide-semiconductor transistor structure that has a gate, a drain, a source, and a body. During programming operations, control circuitry floats the body while applying a positive voltage to the drain and a negative voltage to the source. This causes the drain and source, which serve as the collector and emitter in a parasitic bipolar transistor, to break down. The drain-to-source (collector-to-emitter) breakdown causes sufficient current to flow through the source to alter the source electrode and thereby increase the resistance of the source significantly. During sensing operations, control circuitry may apply a voltage across the drain and source while grounding the body to determine whether the memory element has been programmed.
摘要:
Asymmetric transistors may be formed by creating pocket implants on one source-drain terminal of a transistor and not the other. Asymmetric transistors may also be formed using dual-gate structures having first and second gate conductors of different work functions. Stacked transistors may be formed by stacking two transistors of the same channel type in series. One of the source-drain terminals of each of the two transistors is connected to a common node. The gates of the two transistors are also connected together. The two transistors may have different threshold voltages. The threshold voltage of the transistor that is located higher in the stacked transistor may be provided with a lower threshold voltage than the other transistor in the stacked transistor. Stacked transistors may be used to reduce leakage currents in circuits such as memory cells. Asymmetric transistors may also be used in memory cells to reduce leakage.