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公开(公告)号:US20060072868A1
公开(公告)日:2006-04-06
申请号:US11244318
申请日:2005-10-05
申请人: David Bateman , Todd Bullock , Robert Engle
发明人: David Bateman , Todd Bullock , Robert Engle
IPC分类号: G02B6/00
CPC分类号: G01F23/14 , G01L9/0076 , G01L9/0077
摘要: A pressure sensor includes an optical transmitter transmitting a dispersive light toward two optical receivers, all carried in a housing. Pressure changes on the housing cause the light beam to be deflected with the amount of deflection measured by the difference in light received by each of the two receivers. A processor operable with the receivers provides a pressure measurement responsive to the light beam deflection.
摘要翻译: 压力传感器包括将两个光接收器分散在一个壳体内的光发送器。 壳体上的压力变化导致光束由于由两个接收器中的每一个接收的光的差异所测量的偏转量而偏转。 与接收器一起操作的处理器提供响应于光束偏转的压力测量。
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公开(公告)号:US20060179340A1
公开(公告)日:2006-08-10
申请号:US11050945
申请日:2005-02-07
申请人: John Gunnels , Fred Gustavson , Robert Engle
发明人: John Gunnels , Fred Gustavson , Robert Engle
IPC分类号: G06F11/00
CPC分类号: G06F11/0751
摘要: A method (and system) for detecting at least one faulty object in a system including a plurality of objects in communication with each other in an n-dimensional architecture, includes probing a first plane of objects in the n-dimensional architecture and probing at least one other plane of objects in the n-dimensional architecture which would result in identifying a faulty object in the system.
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公开(公告)号:US06947958B2
公开(公告)日:2005-09-20
申请号:US09955820
申请日:2001-09-19
申请人: Alan L. Davidson , Amit Agrawal , James Berney , John McLaughlin , Robert Engle
发明人: Alan L. Davidson , Amit Agrawal , James Berney , John McLaughlin , Robert Engle
CPC分类号: G06F17/30067 , G06F17/30017 , Y10S707/99933 , Y10S707/99945 , Y10S707/99954
摘要: A process is provided for documenting the contents of at least one version of a plurality of data products stored in a database, at least one of the products being a composite product having at least a portion of at least one of the data products included therein. The process includes the steps of: creating a state file to be associated with a version of a composite product to be created, the state file specifying a selected version of at least one selected data product to be used in creating the composite product; using the state file to access the selected version of the selected product from the database; creating the version of the composite product by including therein at least a portion of the selected version of the selected product; and generating a state history file associated with the version of the composite product, the state history file indicating that at least a portion of the selected version of the selected product is included within the version of the composite product. The documenting process also includes the steps of: assigning a product name to the composite product; storing the version of the composite product in the database; and storing the state history file in the database. The documenting further includes a step of assigning a version value to the version of the composite product.
摘要翻译: 提供了一种用于记录存储在数据库中的多个数据产品的至少一个版本的内容的过程,所述产品中的至少一个是具有其中包括的至少一个数据产品的至少一部分的复合产品。 该过程包括以下步骤:创建要与待创建的复合产品的版本相关联的状态文件,所述状态文件指定要在创建复合产品中使用的至少一个所选数据产品的选定版本; 使用状态文件从数据库中访问所选产品的选定版本; 通过在其中包括所选产品的所选版本的至少一部分来创建复合产品的版本; 以及生成与所述复合产品的版本相关联的状态历史文件,所述状态历史文件指示所选择的产品的所选版本的至少一部分被包括在所述复合产品的版本内。 记录过程还包括以下步骤:将产品名称分配给复合产品; 将复合产品的版本存储在数据库中; 并将状态历史文件存储在数据库中。 记录还包括将版本值分配给复合产品的版本的步骤。
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公开(公告)号:US5768774A
公开(公告)日:1998-06-23
申请号:US740888
申请日:1996-11-04
IPC分类号: H01L21/60 , H01L23/12 , H01L23/13 , H01L23/36 , H01L23/367 , H01L23/373 , H01L23/498 , H05K3/34
CPC分类号: H01L23/49838 , H01L23/36 , H01L23/3675 , H01L23/3737 , H01L23/49816 , H01L23/49833 , H01L2224/16 , H01L2224/32245 , H01L2224/48091 , H01L2224/49171 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/0102 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , Y10T29/49144
摘要: A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sink. Bonding the ceramic component carriers to the heat sink reduces expansion induced stresses of the solder balls on the carriers. Plural ceramic component carriers, smaller than a single carrier would have to be for the same package, reduce stresses at the interfaces between the ceramic component carriers and the heat sink.
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