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公开(公告)号：US07852635B1
公开(公告)日：2010-12-14
申请号：US10853456
申请日：2004-05-25
CPC分类号： H05K3/403 , H05K3/429 , H05K2201/096 , H05K2201/09645 , H05K2201/09845 , H05K2203/175
摘要： The present invention provides a PWB for attaching electrical components thereto. One aspect of the PWB includes multiple PWB insulating layers having conductive traces therebetween. The PWB has an interconnect opening located in the multiple PWB insulating layers that intersect at least a portion of the conductive traces. The interconnect opening has ledges therein, wherein each of the ledges separates a first group of the conductive traces from a second group of the conductive traces. The present invention also provides a method of making the PWB and also provides a power converter implementing the edge plate interconnects.
摘要翻译： 本发明提供一种用于将电气部件附接到其上的PWB。 PWB的一个方面包括其间具有导电迹线的多个PWB绝缘层。 PWB具有位于多个PWB绝缘层中的互连开口，其与至少一部分导电迹线相交。 互连开口在其中具有凸缘，其中每个凸缘将第一组导电迹线与第二组导电迹线分离。 本发明还提供一种制造PWB的方法，并且还提供实现边缘板互连的功率转换器。
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公开(公告)号：US07180397B1
公开(公告)日：2007-02-20
申请号：US10783073
申请日：2004-02-20
IPC分类号： H01F5/00
CPC分类号： H05K1/165 , H01F2027/2819 , H05K3/429 , H05K2201/086 , H05K2201/09063 , H05K2201/092 , H05K2201/09645
摘要： The present invention provides a PWB for attaching electrical components thereto. The PWB includes a stack of insulating layers, conductive layers located between the insulating layers, wherein the conductive layers terminate at an edge of the PWB, and an edge plate interconnect located on the edge. The edge plate interconnect is free of a complementary via and contacts and electrically interconnects the conductive layers. The present invention also provides a method of making the PWB and also provides a power converter implementing the edge plate interconnects.
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公开(公告)号：US06927667B1
公开(公告)日：2005-08-09
申请号：US10004604
申请日：2001-11-01
申请人： Galliano R. Busletta , Robert J. Catalano , Paul J. Offer, Jr. , Robert J. Roessler , Matthew A. Wilkowski , William L. Woods
发明人： Galliano R. Busletta , Robert J. Catalano , Paul J. Offer, Jr. , Robert J. Roessler , Matthew A. Wilkowski , William L. Woods
CPC分类号： H01F17/045 , H01F17/043 , H01F27/292 , H01F27/306
摘要： A magnetic device is provided that may be employed with surface mount technology. In an advantageous embodiment, the magnetic device includes a magnetic core having a magnetic core half and a springable winding positioned about at least a portion of the magnetic core half. The springable winding includes a terminus biased against the magnetic core half.
摘要翻译： 提供可用于表面贴装技术的磁性装置。 在有利的实施例中，磁性装置包括具有磁芯半部和围绕磁芯半部的至少一部分定位的弹性绕组的磁芯。 弹性绕组包括偏置在磁芯半部上的端子。
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公开(公告)号：US07304862B2
公开(公告)日：2007-12-04
申请号：US11559928
申请日：2006-11-15
IPC分类号： H05K7/00
CPC分类号： H05K1/165 , H01F2027/2819 , H05K3/429 , H05K2201/086 , H05K2201/09063 , H05K2201/092 , H05K2201/09645
摘要： The present invention provides a PWB for attaching electrical components thereto. The PWB includes a stack of insulating layers, conductive layers located between the insulating layers, wherein the conductive layers terminate at an edge of the PWB, and an edge plate interconnect located on the edge. The edge plate interconnect is free of a complementary via and contacts and electrically interconnects the conductive layers. The present invention also provides a method of making the PWB and also provides a power converter implementing the edge plate interconnects.
摘要翻译： 本发明提供一种用于将电气部件附接到其上的PWB。 PWB包括堆叠的绝缘层，位于绝缘层之间的导电层，其中导电层终止于PWB的边缘，以及位于边缘上的边缘板互连。 边缘板互连件没有互补的通孔和触点，并且电连接导电层。 本发明还提供一种制造PWB的方法，并且还提供实现边缘板互连的功率转换器。
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5.发明授权Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board 失效可边缘安装的集成电路封装以及将其连接到印刷电路板的方法公开(公告)号：US06246016B1
公开(公告)日：2001-06-12
申请号：US09266531
申请日：1999-03-11
IPC分类号： H01R909
CPC分类号： H01L23/49805 , H01L2924/0002 , H05K3/0052 , H05K3/3442 , H05K3/366 , H05K3/403 , H05K3/42 , H05K2201/09181 , H05K2201/09854 , H05K2201/10568 , H05K2203/167 , H01L2924/00
摘要： An edge-mountable integrated circuit (IC) package and methods of manufacturing and assembling the same onto a printed wiring board (PWB). In one embodiment, the package includes: (1) a substrate having a major surface and a substantially planar edge and (2) a conductive coating having a first region located on a portion of the major surface and a second region located on a portion of the substantially planar edge, the second region being substantially planar to allow the second region to be reflow soldered to the adjoining printed wiring board PWB.
摘要翻译： 一种可边缘安装的集成电路（IC）封装及其制造和组装到印刷电路板（PWB）上的方法。 在一个实施例中，封装包括：（1）具有主表面和基本上平面的边缘的衬底，以及（2）导电涂层，其具有位于主表面的一部分上的第一区域和位于主表面的一部分上的第二区域 基本上平面的边缘，第二区域基本上是平面的，以允许第二区域回流焊接到相邻的印刷线路板PWB。
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6.发明授权Magnetic device employing a winding structure spanning multiple boards and method of manufacture thereof 有权采用跨越多个板的绕组结构的磁性装置及其制造方法公开(公告)号：US06353379B1
公开(公告)日：2002-03-05
申请号：US09514822
申请日：2000-02-28
IPC分类号： H01F500
CPC分类号： H01F27/2804 , H05K1/141 , H05K1/165 , Y10T29/4902
摘要： A magnetic device and a method of manufacturing the same. In one embodiment, the device includes: (1) a magnetic core and (2) a winding structure located proximate the magnetic core. The winding structure includes:(2a) a multilayer main circuit board containing an interconnected first plurality of winding layers, (2b) a multilayer overlay board located proximate the main circuit board and containing an interconnected second plurality of winding layers and (2c) conductors coupling the first and second pluralities of winding layers together to cause the first and second pluralities of winding layers to function cooperatively as windings for the magnetic device.
摘要翻译： 磁性装置及其制造方法。 在一个实施例中，该装置包括：（1）磁芯和（2）位于磁芯附近的绕组结构。 所述绕组结构包括：（2a）包含互连的第一多个绕组层的多层主电路板，（2b）位于所述主电路板附近并且包含互连的第二多个绕组层的多层覆盖板，以及（2c） 所述第一和第二多个绕组层一起引起所述第一和第二多个绕组层作为所述磁性器件的绕组协同地起作用。
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7.发明授权Inter-substrate conductive mount for a circuit board, circuit board and power magnetic device employing the same 有权用于电路板的基板间导电安装座，电路板和采用该电路板的电力磁性装置公开(公告)号：US06310301B1
公开(公告)日：2001-10-30
申请号：US09288749
申请日：1999-04-08
申请人： Randy T. Heinrich , Robert J. Roessler , Thang D. Truong , Matthew A. Wilkowski , William L. Woods, Jr.
发明人： Randy T. Heinrich , Robert J. Roessler , Thang D. Truong , Matthew A. Wilkowski , William L. Woods, Jr.
IPC分类号： H05K116
CPC分类号： H05K3/368 , H05K1/141 , H05K1/165 , H05K3/3436 , H05K2201/10234 , H05K2201/10257 , H05K2201/10666 , H05K2201/10992 , H05K2203/041 , H05K2203/0455 , Y02P70/613
摘要： An inter-substrate conductive mount for a surface mountable circuit board, a method of manufacturing the circuit board and a surface mountable power magnetic device. In one embodiment, the circuit board includes: (1) a substrate, (2) an inter-substrate conductive mount composed of a material having a melting point above a solder reflow temperature and including a compliant solder joint at an interface of the substrate and (3) a solder located proximate the conductive mount, the conductive mount of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the conductive mount in contact with the substrate as the solder is brought to the reflow temperature, the conductive mount being capable of mounting the substrate to an adjacent substrate and providing a conductive path therebetween.
摘要翻译： 一种用于表面安装电路板的基板间导电座，一种制造电路板的方法和一种可表面安装的电力磁性装置。 在一个实施例中，电路板包括：（1）基板，（2）由具有高于焊料回流温度的熔点的材料构成的基板间导电安装件，并且在基板的界面处包括柔性焊接点 （3）位于导电安装座附近的焊料，该导电安装件具有足够低的重量，使得焊料的液体状态的表面张力足以使导电安装座与衬底接触，因为焊料被带到 回流温度，导电安装件能够将衬底安装到相邻的衬底上并且在它们之间提供导电路径。
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