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公开(公告)号：US20120277183A1
公开(公告)日：2012-11-01
申请号：US13544775
申请日：2012-07-09
申请人： Robert L. Lewis , Charles E. Day
发明人： Robert L. Lewis , Charles E. Day
IPC分类号： A61K31/722 , A61P13/12 , C08B37/08
CPC分类号： A61K31/722 , A23L29/275 , A61K9/20
摘要： The present invention provides compositions and methods for removing phosphate from a subject using chitosan. The present invention also provides compositions and methods for treating hyperphosphatemia based on phosphate-binding chitosan.
摘要翻译： 本发明提供了使用壳聚糖从受试者中除去磷酸盐的组合物和方法。 本发明还提供了用于治疗基于磷酸结合壳聚糖的高磷酸盐血症的组合物和方法。
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公开(公告)号：USD481609S1
公开(公告)日：2003-11-04
申请号：US29161824
申请日：2002-06-04
申请人： Thomas Perlmutter , Robert L. Lewis
设计人： Thomas Perlmutter , Robert L. Lewis
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公开(公告)号：US5612573A
公开(公告)日：1997-03-18
申请号：US584757
申请日：1996-01-11
IPC分类号： H05K1/18 , H01L21/48 , H01L21/60 , H01L23/12 , H01L23/498 , H01L23/538 , H05K1/11 , H05K3/34 , H05K3/40 , H05K3/46 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/4846 , H01L23/49816 , H01L23/5385 , H05K1/112 , H01L2224/0401 , H01L2224/05571 , H01L2224/1403 , H01L2924/0002 , H01L2924/09701 , H05K2201/09472 , H05K2201/10734 , H05K3/3431 , H05K3/3436 , H05K3/4007 , H05K3/4644
摘要： A circuitized substrate for use in an electronic package wherein the substrate, e.g., ceramic, includes more than one conductive layer, e.g. , copper, thereon separated by a suitable dielectric material, e.g. , polyimide. Each layer includes its own conductive location(s) which are designed for being directly electrically connected, e.g., using solder, to respective contact sites on a semiconductor chip positioned on the substrate to form part of the final package. A method for making such a package is also provided. Significantly, the resulting package does not include interconnections between the conductive layers at the desired contact locations, these locations, as mentioned, instead being directly connected to the chip.
摘要翻译： 一种用于电子封装的电路化衬底，其中衬底例如陶瓷包括多于一个的导电层，例如陶瓷。 ，铜，其上由合适的电介质材料分隔，例如。 ，聚酰亚胺。 每个层包括其自身的导电位置，其被设计用于直接电连接（例如使用焊料）到位于衬底上的半导体芯片上的相应接触位置，以形成最终封装的一部分。 还提供了制造这种包装的方法。 显着地，所得到的封装不包括在所需接触位置处的导电层之间的互连，如上所述，这些位置而不是直接连接到芯片。
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公开(公告)号：US4685586A
公开(公告)日：1987-08-11
申请号：US853564
申请日：1986-04-18
CPC分类号： E06B5/16 , E06B5/12 , F23M7/00 , F23M2900/05004
摘要： A door system for a boiler penthouse or other high temperature industrial environment is disclosed. A sufficiently large entranceway for both workmen and large equipment is provided by the door system. The access door has the capability for quick gas-tight sealing during closing. A hinged metal door plate has arcuate welding beads applied to its internal surface near its corners to produce permanent inward cupping of the door plate adjacent to its corners. Devices apply pressure to the exterior surface of the door plate during the closing thereof to flatten the inwardly cupped corners and effect gas-tight sealing of the interior surface of the door plate near its margin with an opposing high temperature resistant gasket carried by the front face of a refractory insulated door frame. A layer of thermal insulating material in a protective jacket is secured to the interior surface of the door plate.
摘要翻译： 公开了一种用于锅炉顶棚或其他高温工业环境的门系统。 门系统为工人和大型设备提供了一个足够大的入口。 检修门具有在关闭时快速气密密封的能力。 铰链式金属门板具有弧形焊接珠，其应用于其角落附近的内表面，以产生与其角部相邻的门板的永久性内部拔罐。 装置在关闭门板时对门板的外表面施加压力以使内侧的杯形角部变平，并且通过由前表面承载的相对的耐高温垫片来实现门板的内表面在其边缘附近的气密密封 的耐火绝缘门框。 保护套中的绝热材料层固定在门板的内表面上。
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公开(公告)号：US20120282352A1
公开(公告)日：2012-11-08
申请号：US13544949
申请日：2012-07-09
申请人： Robert L. Lewis , Charles E. Day
发明人： Robert L. Lewis , Charles E. Day
CPC分类号： A61K33/06 , A61K9/0053 , A61K9/28 , A61K9/2806 , A61K9/4891 , A61K31/19 , A61K31/191 , A61K31/197 , A61K31/715 , A61K33/08 , A61K33/10
摘要： The present invention provides, among other things, compositions and methods suitable for the treatment of hyperphosphatemia based on phosphate-binding magnesium salts. In some embodiments, the present invention provides compositions and methods suitable for the treatment of hyperphosphatemia based on the combination of phosphate-binding magnesium and calcium salts.
摘要翻译： 本发明尤其提供了适用于治疗基于磷酸盐结合镁盐的高磷酸盐血症的组合物和方法。 在一些实施方案中，本发明提供了适合于基于磷酸结合镁和钙盐的组合治疗高磷酸血症的组合物和方法。
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公开(公告)号：US08247000B2
公开(公告)日：2012-08-21
申请号：US12422012
申请日：2009-04-10
申请人： Robert L. Lewis , Charles E. Day
发明人： Robert L. Lewis , Charles E. Day
CPC分类号： A61K33/06 , A61K9/0053 , A61K9/28 , A61K9/2806 , A61K9/4891 , A61K31/19 , A61K31/191 , A61K31/197 , A61K31/715 , A61K33/08 , A61K33/10
摘要： The present invention provides, among other things, compositions and methods suitable for the treatment of hyperphosphatemia based on phosphate-binding magnesium salts. In some embodiments, the present invention provides compositions and methods suitable for the treatment of hyperphosphatemia based on the combination of phosphate-binding magnesium and calcium salts.
摘要翻译： 本发明尤其提供了适用于治疗基于磷酸盐结合镁盐的高磷酸盐血症的组合物和方法。 在一些实施方案中，本发明提供了适合于基于磷酸结合镁和钙盐的组合治疗高磷酸血症的组合物和方法。
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公开(公告)号：US20090253652A1
公开(公告)日：2009-10-08
申请号：US12436680
申请日：2009-05-06
申请人： Robert L. Lewis , Charles E. Day
发明人： Robert L. Lewis , Charles E. Day
IPC分类号： A61K31/722 , A61P13/00
CPC分类号： A61K31/722 , A23L29/275 , A61K9/20
摘要： The present invention provides compositions and methods for removing phosphate from a subject using chitosan. The present invention also provides compositions and methods for treating hyperphosphatemia based on phosphate-binding chitosan.
摘要翻译： 本发明提供了使用壳聚糖从受试者中除去磷酸盐的组合物和方法。 本发明还提供了基于磷酸结合壳聚糖处理高磷酸盐血症的组合物和方法。
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8.发明授权
公开(公告)号：US5505320A
公开(公告)日：1996-04-09
申请号：US343162
申请日：1994-11-22
CPC分类号： H01L21/4846 , C23F1/02 , H05K3/061 , H05K3/0032 , H05K3/062 , H05K3/388
摘要： A pattern is provided on a substrate by providing the substrate with at least two layers of material thereon and providing a layer of dry imaging polymer compositions thereon. The layer of the dry imaging polymer composition is laser ablated to provide the desired personality pattern. The top exposed portion of at least the top layer is removed and the desired select pattern is laser ablated. The exposed portions of said first layer is removed and the pattern is completed through the other layers of material to thereby expose the substrate surface, without the substrate surface being subjected to laser ablating to thereby provide the desired pattern on the substrate.
摘要翻译： 通过在衬底上提供至少两层材料，并在其上提供一层干成像聚合物组合物，在衬底上提供图案。 将干成像聚合物组合物的层激光烧蚀以提供期望的个性图案。 至少顶层的顶部暴露部分被去除并且期望的选择图案被激光烧蚀。 去除所述第一层的暴露部分，并且通过其它材料层完成图案，从而暴露衬底表面，而不对衬底表面进行激光烧蚀，从而在衬底上提供期望的图案。
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公开(公告)号：US4574973A
公开(公告)日：1986-03-11
申请号：US731473
申请日：1985-05-07
摘要： An entrance doorway for electrostatic precipitators, bag houses, scrubbers, ductwork and breeching includes an interior metal plate door hinged to a frame plate of similar thickness whereby the interior door and frame plate will follow any warpage of the casing wall as they are subjected to the same temperatures as the casing wall. A hollow core high temperature acid-resistant resilient gasket is employed between the interior door and its frame plate. A pressure screw acting on the center of the interior door flexes it toward the interior of the casing and renders the interior door concave to form a tight seal with the gasket. An interior door retractor is provided to pull the interior door and its gasket away from the frame plate when the pressure screw is relieving pressure on the interior door, thereby preventing damage to the door gasket. An adjustable length telescoping sleeve fixed to the interior door frame plate extends away from the interior door and supports a lightweight thermally insulated exterior door panel which is removably secured by corrosion-resistant latches. The door system eliminates air infiltration and corrosion.
摘要翻译： 用于静电除尘器，袋子，洗涤器，管道和膛孔的入口门口包括铰链到类似厚度的框架板的内部金属板门，由此当内部门和框架板受到套管壁的任何翘曲时， 与套管壁相同的温度。 内门与其框架板之间采用中空高温耐酸弹性垫片。 作用在内门的中心的压力螺丝将其朝向壳体的内部弯曲，并使内门凹入以与垫圈形成紧密的密封。 提供内门牵开器，当压力螺丝释放内门上的压力时，将内门及其垫圈拉离框架板，从而防止损坏门垫圈。 固定在内门框架板上的可调节长度的伸缩套筒远离内门延伸，并支撑一个轻质的隔热外门面板，其可拆卸地由耐腐蚀的锁扣固定。 门系统消除空气渗透和腐蚀。
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公开(公告)号：US1437369A
公开(公告)日：1922-11-28
申请号：US44183221
申请日：1921-02-02
申请人： HERBERT HARSH , ROBERT L LEWIS , NANCY T LEWIS
IPC分类号： F16K5/08
CPC分类号： F16K5/08
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