Hydrophilic DLC on substrate with barrier discharge pyrolysis treatment
    1.
    发明申请
    Hydrophilic DLC on substrate with barrier discharge pyrolysis treatment 审中-公开
    亲水性DLC在衬底上具有屏障放电热解处理

    公开(公告)号:US20060246218A1

    公开(公告)日:2006-11-02

    申请号:US11117724

    申请日:2005-04-29

    CPC classification number: C23C16/513 C23C16/26 C23C16/56

    Abstract: A substrate is coated with a layer(s) or coating(s) that includes, for example, amorphous carbon in a form of diamond-like carbon (DLC). The DLC is then subjected to barrier discharge treatment (or some other type of plasma treatment) in order to cause the contact angle θ thereof to decrease. In certain example embodiments, an atmospheric plasma is used in the barrier discharge treatment, and the glow discharge produces oxygen radicals which impinge on the DLC and cause the contact angle to decrease.

    Abstract translation: 基材涂覆有一层或多层,其包括例如类金刚石碳(DLC)形式的无定形碳。 然后对DLC进行阻挡放电处理(或某种其他类型的等离子体处理),以使其接触角θ减小。 在某些示例性实施例中,在阻挡放电处理中使用大气等离子体,并且辉光放电产生冲击DLC的氧自由基并导致接触角降低。

    COMBUSTION CHEMICAL VAPOR DEPOSITION ON TEMPERATURE-SENSITIVE SUBSTRATES
    2.
    发明申请
    COMBUSTION CHEMICAL VAPOR DEPOSITION ON TEMPERATURE-SENSITIVE SUBSTRATES 审中-公开
    温度敏感基板上的化学气相沉积

    公开(公告)号:US20100151130A1

    公开(公告)日:2010-06-17

    申请号:US11720851

    申请日:2005-12-07

    CPC classification number: C23C16/463 C23C16/453 C23C16/4586 H01L21/67248

    Abstract: Method and apparatus for depositing film on flexible (plastic/metal) foil and/or temperature sensitive substrates (101) by combustion chemical vapor deposition (C-CVD). A substrate (101) is held in place to provide physical and conductive thermal contact between the substrate (101) and a substrate holder (102). The substrate holder (102) is cooled using a cooling fluid and the substrate (101) and burner are moved relative to each other as C-CVD takes place. Heating of the substrate (101) during C-CVD is controlled and deterioration by heating is avoided. The foil or substrate (101) is suitable, in particular, for use in flat and flexible displays.

    Abstract translation: 通过燃烧化学气相沉积(C-CVD)在柔性(塑料/金属)箔和/或温度敏感基板(101)上沉积膜的方法和装置。 衬底(101)被保持就位以在衬底(101)和衬底保持器(102)之间提供物理和导电的热接触。 使用冷却流体对衬底保持器(102)进行冷却,并且当发生C-CVD时,衬底(101)和燃烧器相对于彼此移动。 控制C-CVD时的基板(101)的加热,避免加热劣化。 箔或衬底(101)特别适用于平面和柔性显示器。

    Sputtering target and method/apparatus for cooling the target
    3.
    发明授权
    Sputtering target and method/apparatus for cooling the target 有权
    用于冷却目标的溅射靶和方法/装置

    公开(公告)号:US07560011B2

    公开(公告)日:2009-07-14

    申请号:US11256200

    申请日:2005-10-24

    CPC classification number: H01J37/3497 H01J37/3405

    Abstract: A sputtering target includes an outer target tube, an inner support tube supporting a magnet carrier bar extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within the inner support tube with an inlet at one end thereof adapted to receive cooling water from an external source, at least one outlet aperture at an opposite end thereof opening to a cooling plenum radially between the inner support tube and the outer target tube; and a baffle comprising a substantially flat plate attached to the inner support tube adjacent the opposite end, the plate extending radially within the plenum between the inner support tube and the outer target tube and having an array of flow apertures therein.

    Abstract translation: 溅射靶包括外目标管,支撑沿着内支撑管的整个长度延伸的磁体承载杆的内支撑管; 以及水冷却回路,其包括在所述内支撑管内的至少一个通道,其一端处的入口适于从外部源接收冷却水,所述至少一个出口在其相对端处径向地通向所述冷却室, 内支撑管和外目标管; 以及挡板,其包括邻近所述相对端附接到所述内支撑管的基本平坦的板,所述板在所述内支撑管和所述外目标管之间的所述增压室内径向延伸并且在其中具有一组流动孔。

    Sputtering target and method/apparatus for cooling the target
    4.
    发明授权
    Sputtering target and method/apparatus for cooling the target 失效
    用于冷却目标的溅射靶和方法/装置

    公开(公告)号:US07504011B2

    公开(公告)日:2009-03-17

    申请号:US11256196

    申请日:2005-10-24

    CPC classification number: H01J37/3497 H01J37/3405

    Abstract: A sputtering target comprising an outer target tube, an inner support tube supporting a magnet carrier extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within the inner support tube with an inlet at one end thereof adapted to receive cooling water from an external source, at least one outlet aperture at an opposite end thereof opening to a cooling chamber radially between the inner support tube and the outer target tube; and a plurality of spiral vane segments attached to an outer surface of the inner support tube.

    Abstract translation: 一种溅射靶,包括外目标管,支撑沿着内支撑管的整个长度延伸的磁体载体的内支撑管; 以及水冷却回路,其包括在所述内部支撑管内的至少一个通道,其一端处的入口适于从外部源接收冷却水;至少一个在其相对端处的出口孔, 内支撑管和外目标管; 以及附接到内部支撑管的外表面的多个螺旋叶片段。

    Photovoltaic module
    5.
    发明申请
    Photovoltaic module 审中-公开
    光伏组件

    公开(公告)号:US20100186813A1

    公开(公告)日:2010-07-29

    申请号:US12657864

    申请日:2010-01-28

    Abstract: For fastening the contact strip (8) to the back electrode layer (4) of a photovoltaic module, the back electrode layer (4) is provided on its outer side with a tin-, copper- and/or silver-containing contact layer (12). Subsequently the contact strip (8) provided with solder (17) on the joining surface is connected to the back electrode layer (4) by soldering. The contact layer (12) causes good adhesion of the back surface encapsulation material (13) to be obtained. A barrier layer (11) prevents alloying of the tin-solder with the layers (9, 10) of the back electrode layer (4).

    Abstract translation: 为了将接触片(8)紧固到光伏组件的背面电极层(4)上,背面电极层(4)在其外侧设置有锡,铜和/或含银接触层( 12)。 随后,通过焊接将在接合表面上设置有焊料(17)的接触条(8)连接到背面电极层(4)。 接触层(12)引起要获得的背表面密封材料(13)的良好粘附。 阻挡层(11)防止锡焊料与背面电极层(4)的层(9,10)的合金化。

    Sputtering target and method/apparatus for cooling the target
    7.
    发明申请
    Sputtering target and method/apparatus for cooling the target 有权
    用于冷却目标的溅射靶和方法/装置

    公开(公告)号:US20070089986A1

    公开(公告)日:2007-04-26

    申请号:US11256200

    申请日:2005-10-24

    CPC classification number: H01J37/3497 H01J37/3405

    Abstract: A sputtering target includes an outer target tube, an inner support tube supporting a magnet carrier bar extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within the inner support tube with an inlet at one end thereof adapted to receive cooling water from an external source, at least one outlet aperture at an opposite end thereof opening to a cooling plenum radially between the inner support tube and the outer target tube; and a baffle comprising a substantially flat plate attached to the inner support tube adjacent the opposite end, the plate extending radially within the plenum between the inner support tube and the outer target tube and having an array of flow apertures therein.

    Abstract translation: 溅射靶包括外目标管,支撑沿着内支撑管的整个长度延伸的磁体承载杆的内支撑管; 以及水冷却回路,其包括在所述内支撑管内的至少一个通道,其一端处的入口适于从外部源接收冷却水,所述至少一个出口在其相对端处径向地通向所述冷却室, 内支撑管和外目标管; 以及挡板,其包括邻近所述相对端附接到所述内支撑管的基本平坦的板,所述板在所述内支撑管和所述外目标管之间的所述增压室内径向延伸并且在其中具有一组流动孔。

    Sputtering target and method/apparatus for cooling the target
    8.
    发明申请
    Sputtering target and method/apparatus for cooling the target 失效
    用于冷却目标的溅射靶和方法/装置

    公开(公告)号:US20070089985A1

    公开(公告)日:2007-04-26

    申请号:US11256196

    申请日:2005-10-24

    CPC classification number: H01J37/3497 H01J37/3405

    Abstract: A sputtering target comprising an outer target tube, an inner support tube supporting a magnet carrier extending along substantially the entire length of the inner support tube; and a water cooling circuit including at least one passageway within the inner support tube with an inlet at one end thereof adapted to receive cooling water from an external source, at least one outlet aperture at an opposite end thereof opening to a cooling chamber radially between the inner support tube and the outer target tube; and a plurality of spiral vane segments attached to an outer surface of the inner support tube.

    Abstract translation: 一种溅射靶,包括外目标管,支撑沿着内支撑管的整个长度延伸的磁体载体的内支撑管; 以及水冷却回路,其包括在所述内部支撑管内的至少一个通道,其一端处的入口适于从外部源接收冷却水;至少一个在其相对端处的出口孔, 内支撑管和外目标管; 以及附接到内部支撑管的外表面的多个螺旋叶片段。

    SOLDERING HEAD AND PROCESS FOR INDUCTIVE SOLDERING
    9.
    发明申请
    SOLDERING HEAD AND PROCESS FOR INDUCTIVE SOLDERING 审中-公开
    焊接头和电感焊接工艺

    公开(公告)号:US20120031895A1

    公开(公告)日:2012-02-09

    申请号:US13186061

    申请日:2011-07-19

    CPC classification number: B23K1/002

    Abstract: A soldering head for an induction-soldering apparatus for soldering a contact strip onto a solar cell and a soldering process using the soldering head are provided. The soldering head has a soldering side, with which the soldering head is placed onto the site to be soldered during the soldering process, an inductor loop with a feed region and a coupling-out region arranged on the soldering side, a main body made of an electrically non-conductive material, and a fastener, with which the main body is fixed to the inductor loop, wherein the coupling-out region of the inductor loop is exposed on the soldering side, and the main body has one or more spacer elements, on the soldering side, which are arranged outside the coupling-out region and protrude beyond the coupling-out region of the inductor loop.

    Abstract translation: 提供了一种用于将接触条焊接到太阳能电池上的感应焊接装置的焊接头和使用焊接头的焊接工艺。 焊接头具有焊接侧,焊接头在焊接过程中放置​​在要焊接的位置上,具有馈电区域的电感器环和布置在焊接侧的耦合出区域,主体由 电导体材料和紧固件,主体固定到电感器环路上,其中电感器环路的耦合输出区域暴露在焊接侧,并且主体具有一个或多个间隔元件 在焊接侧,其布置在耦合输出区域的外部并突出超过电感器环路的耦合输出区域。

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