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    System for isolating batteries during testing
    1.
    发明授权
    System for isolating batteries during testing 失效
    测试过程中隔离电池的系统

    公开(公告)号：US5558956A

    公开(公告)日：1996-09-24

    申请号：US522211

    申请日：1995-08-30

    Applicant: Rudolf Gujer ,  Clifford B. Simpson

    Inventor： Rudolf Gujer ,  Clifford B. Simpson

    IPC: H01M2/10 ,  H01M6/50

    CPC classification number: H01M6/5083 ,  H01M2/1016

    Abstract: An apparatus for shielding adjacent batteries during testing includes a shell with partitions to form an array of pockets, and a cover with shields. When a cover is placed in a closed position on top of the shell, each shield would contact a corresponding partition to completely isolate two batteries placed in two pockets adjacent to the shield and partition. In this manner, even if a battery catches fire or leaks, the partition and the shield minimizes the effect on an adjacent battery.

    Abstract translation: 用于在测试期间屏蔽相邻电池的装置包括具有分隔件以形成一个凹穴阵列的外壳和带有屏蔽的盖。 当盖子放置在壳体顶部的关闭位置时，每个屏蔽件将接触相应的隔板，以完全隔离放置在与屏蔽和隔板相邻的两个口袋中的两个电池。 以这种方式，即使电池发生火灾或泄漏，分隔件和屏蔽件也可以使对相邻电池的影响最小化。

    Gas distribution system for improved transient phase deposition
    2.
    发明授权
    Gas distribution system for improved transient phase deposition 有权
    用于改善瞬态相沉积的气体分配系统

    公开(公告)号：US07722737B2

    公开(公告)日：2010-05-25

    申请号：US11123453

    申请日：2005-05-04

    Applicant: Sudhir Gondhalekar ,  Robert Duncan ,  Siamak Salimian ,  Muhammad M. Rasheed ,  Harry Smith Whitesell ,  Bruno Geoffrion ,  Padmanabhan Krishnaraj ,  Rudolf Gujer ,  Diana E. Gujer, legal representative

    Inventor： Sudhir Gondhalekar ,  Robert Duncan ,  Siamak Salimian ,  Muhammad M. Rasheed ,  Harry Smith Whitesell ,  Bruno Geoffrion ,  Padmanabhan Krishnaraj ,  Rudolf Gujer

    IPC: H01L21/326 ,  C23C16/505

    CPC classification number: C23C16/4558

    Abstract: Embodiments of the present invention are directed to a gas distribution system which distributes the gas more uniformly into a process chamber. In one embodiment, a gas distribution system comprises a gas ring including an outer surface and an inner surface, and a gas inlet disposed at the outer surface of the gas ring. The gas inlet is fluidicly coupled with a first channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of gas outlets are distributed over the inner surface of the gas ring, and are fluidicly coupled with a second channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of orifices are fluidicly coupled between the first channel and the second channel. The plurality of orifices are spaced from the gas inlet by a plurality of distances, and have sizes which vary with the distances from the gas inlet as measured along the first channel, such that the size of the orifice increases with an increase in the distance between the orifice and the gas inlet as measured along the first channel.

    Abstract translation: 本发明的实施例涉及一种将气体更均匀地分配到处理室中的气体分配系统。 在一个实施例中，气体分配系统包括包括外表面和内表面的气环，以及设置在气环的外表面处的气体入口。 气体入口与设置在气体环的外表面和内表面之间的第一通道流体耦合。 多个气体出口分布在气环的内表面上，并且与设置在气体环的外表面和内表面之间的第二通道流体连接。 多个孔流体耦合在第一通道和第二通道之间。 多个孔与气体入口间隔多个距离，并且具有随着沿着第一通道测量的与气体入口的距离而变化的尺寸，使得孔的尺寸随着气体入口之间的距离的增加而增加 沿着第一通道测量的孔口和气体入口。

    Semiconductor substrate support assembly having lobed o-rings therein
    3.
    发明授权
    Semiconductor substrate support assembly having lobed o-rings therein 失效
    半导体衬底支撑组件在其中具有凸起的O形环

    公开(公告)号：US06776875B2

    公开(公告)日：2004-08-17

    申请号：US09797217

    申请日：2001-02-28

    Applicant: Rudolf Gujer ,  Thomas K. Cho ,  Tetsuya Ishikawa

    Inventor： Rudolf Gujer ,  Thomas K. Cho ,  Tetsuya Ishikawa

    IPC: C23F100

    CPC classification number: C23C16/4409 ,  C23C16/4412 ,  C23C16/45561 ,  C23C16/4586

    Abstract: A semiconductor wafer processing substrate support assembly, comprises a substrate support platform having a centrally disposed recess, coupled to a base disposed above the centrally disposed recess, a plate disposed above the base, and a substrate support disposed above the plate. The substrate support assembly further comprises a plurality of o-rings having a plurality of lobes, wherein a first lobed o-ring of the plurality of lobed o-rings is disposed between the support platform and the base, a second lobed o-ring is disposed between the base and the plate, and a third lobed o-ring is disposed between the plate and the substrate support. Moreover, the plurality of lobed o-rings are utilized in the support assembly for reducing the number of o-rings required in the support assembly.

    Abstract translation: 半导体晶片处理基板支撑组件包括具有中心设置的凹部的基板支撑平台，其联接到设置在中心设置的凹部上方的基座，设置在基座上方的板和设置在板上方的基板支撑。 所述基板支撑组件还包括多个具有多个凸角的O形环，其中所述多个凸起的O形环的第一凸起的O形环设置在所述支撑平台和所述基座之间，第二凸起的O形环是 设置在基座和板之间，并且第三叶片O形环设置在板和基板支撑件之间。 此外，在支撑组件中使用多个凸起的O形环以减少支撑组件中所需的O形圈的数量。

    Gas Distribution System for Improved Transient Phase Deposition
    6.
    发明申请
    Gas Distribution System for Improved Transient Phase Deposition 审中-公开
    用于改进瞬态相沉积的气体分配系统

    公开(公告)号：US20080041821A1

    公开(公告)日：2008-02-21

    申请号：US11877502

    申请日：2007-10-23

    Applicant: Sudhir Gondhalekar ,  Robert Duncan ,  Siamak Salimian ,  Muhammad Rasheed ,  Harry Smith Whitesell ,  Bruno Geoffrion ,  Padmanabhan Krishnaraj ,  Rudolf Gujer ,  Diana Gujer

    Inventor： Sudhir Gondhalekar ,  Robert Duncan ,  Siamak Salimian ,  Muhammad Rasheed ,  Harry Smith Whitesell ,  Bruno Geoffrion ,  Padmanabhan Krishnaraj ,  Rudolf Gujer ,  Diana Gujer

    IPC: C23F1/00

    CPC classification number: C23C16/4558

    Abstract: Embodiments of the present invention are directed to a gas distribution system which distributes the gas more uniformly into a process chamber. In one embodiment, a gas distribution system comprises a gas ring including an outer surface and an inner surface, and a gas inlet disposed at the outer surface of the gas ring. The gas inlet is fluidicly coupled with a first channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of gas outlets are distributed over the inner surface of the gas ring, and are fluidicly coupled with a second channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of orifices are fluidicly coupled between the first channel and the second channel. The plurality of orifices are spaced from the gas inlet by a plurality of distances, and have sizes which vary with the distances from the gas inlet as measured along the first channel, such that the size of the orifice increases with an increase in the distance between the orifice and the gas inlet as measured along the first channel.

    Abstract translation: 本发明的实施例涉及一种将气体更均匀地分配到处理室中的气体分配系统。 在一个实施例中，气体分配系统包括包括外表面和内表面的气环，以及设置在气环的外表面处的气体入口。 气体入口与设置在气体环的外表面和内表面之间的第一通道流体耦合。 多个气体出口分布在气环的内表面上，并且与设置在气体环的外表面和内表面之间的第二通道流体连接。 多个孔流体耦合在第一通道和第二通道之间。 多个孔与气体入口间隔多个距离，并且具有随着沿着第一通道测量的与气体入口的距离而变化的尺寸，使得孔的尺寸随着气体入口之间的距离的增加而增加 沿着第一通道测量的孔口和气体入口。

    Antenna coil assemblies for substrate processing chambers
    7.
    发明授权
    Antenna coil assemblies for substrate processing chambers 有权
    用于衬底处理室的天线线圈组件

    公开(公告)号：US06192829B1

    公开(公告)日：2001-02-27

    申请号：US09398746

    申请日：1999-09-17

    Applicant: Michael P. Karazim ,  Tetsuya Ishikawa ,  Rudolf Gujer ,  Thomas Kring ,  Pavel Staryuk ,  Abhi Desai ,  Tom Cho ,  Michael Douglas

    Inventor： Michael P. Karazim ,  Tetsuya Ishikawa ,  Rudolf Gujer ,  Thomas Kring ,  Pavel Staryuk ,  Abhi Desai ,  Tom Cho ,  Michael Douglas

    IPC: C23C1600

    CPC classification number: H01J37/321

    Abstract: The present invention provides exemplary antenna coil assemblies and substrate processing chambers using such assemblies. In one embodiment, an antenna coil assembly (100) for a substrate processing chamber includes an antenna coil (102) disposed in a frame (104). The frame includes a plurality of spaced apart tabs (120) around a periphery of the frame, with the coil coupled to the frame at the tabbed locations. At least one notch (122) is provided between each pair of adjacent tabs. The notches are adapted to facilitate thermal expansion and contraction of the frame at the notched locations to reduce stresses on the frame and coil connections.

    Abstract translation: 本发明提供使用这种组件的示例性天线线圈组件和衬底处理室。 在一个实施例中，用于衬底处理室的天线线圈组件（100）包括设置在框架（104）中的天线线圈（102）。 框架包括围绕框架的周边的多个间隔开的突片（120），线圈在标签位置处联接到框架。 在每对相邻的突片之间提供至少一个凹口（122）。 切口适于促进框架在缺口处的热膨胀和收缩，以减少框架和线圈连接处的应力。

    Gas distribution system for improved transient phase deposition
    8.
    发明申请
    Gas distribution system for improved transient phase deposition 有权
    用于改善瞬态相沉积的气体分配系统

    公开(公告)号：US20060113038A1

    公开(公告)日：2006-06-01

    申请号：US11123453

    申请日：2005-05-04

    Applicant: Sudhir Gondhalekar ,  Robert Duncan ,  Siamak Salimian ,  Muhammad Rasheed ,  Harry Whitesell ,  Bruno Geoffrion ,  Padmanabhan Krishnaraj ,  Rudolf Gujer

    Inventor： Sudhir Gondhalekar ,  Robert Duncan ,  Siamak Salimian ,  Muhammad Rasheed ,  Harry Whitesell ,  Bruno Geoffrion ,  Padmanabhan Krishnaraj ,  Rudolf Gujer

    IPC: H01L21/306 ,  C23F1/00

    CPC classification number: C23C16/4558

    Abstract: Embodiments of the present invention are directed to a gas distribution system which distributes the gas more uniformly into a process chamber. In one embodiment, a gas distribution system comprises a gas ring including an outer surface and an inner surface, and a gas inlet disposed at the outer surface of the gas ring. The gas inlet is fluidicly coupled with a first channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of gas outlets are distributed over the inner surface of the gas ring, and are fluidicly coupled with a second channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of orifices are fluidicly coupled between the first channel and the second channel. The plurality of orifices are spaced from the gas inlet by a plurality of distances, and have sizes which vary with the distances from the gas inlet as measured along the first channel, such that the size of the orifice increases with an increase in the distance between the orifice and the gas inlet as measured along the first channel.

    Abstract translation: 本发明的实施例涉及一种将气体更均匀地分配到处理室中的气体分配系统。 在一个实施例中，气体分配系统包括包括外表面和内表面的气环，以及设置在气环的外表面处的气体入口。 气体入口与设置在气体环的外表面和内表面之间的第一通道流体耦合。 多个气体出口分布在气环的内表面上，并且与设置在气体环的外表面和内表面之间的第二通道流体连接。 多个孔流体耦合在第一通道和第二通道之间。 多个孔与气体入口间隔多个距离，并且具有随着沿着第一通道测量的与气体入口的距离而变化的尺寸，使得孔的尺寸随着气体入口之间的距离的增加而增加 沿着第一通道测量的孔口和气体入口。

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