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    Air conditioner for a vehicle using a composite heat exchanger
    1.
    发明授权
    Air conditioner for a vehicle using a composite heat exchanger 有权
    使用复合热交换器的车辆空调

    公开(公告)号：US09352634B2

    公开(公告)日：2016-05-31

    申请号：US13435574

    申请日：2012-03-30

    申请人： Yoshiki Katoh ,  Satoshi Itoh

    发明人： Yoshiki Katoh ,  Satoshi Itoh

    IPC分类号： B60H1/32 ,  B60H1/00 ,  F28F9/02 ,  F28D1/053

    CPC分类号： B60H1/00328 ,  B60H1/00335 ,  F28D1/05391 ,  F28F9/0214 ,  F28F9/0246

    摘要： A composite heat exchanger includes a first heat exchanger configured to exchange heat between feed air and a refrigerant, and a second heat exchanger configured to exchange heat between the feed air and engine coolant. The composite heat exchanger is integrated so as to enable heat transfer between discharge refrigerant flowing through the first heat exchanger and the coolant flowing through the second heat exchanger. Furthermore, the composite heat exchanger is configured to change an amount of the heat exchanged among the feed air, the discharge refrigerant and the coolant in the composite heat exchanger by changing at least one of a volume of the feed air, a refrigerant discharge capacity of the compression mechanism, and an inflow amount of the heat medium.

    摘要翻译： 复合热交换器包括构造成在进料空气和制冷剂之间交换热量的第一热交换器和被配置为在进料空气和发动机冷却剂之间交换热量的第二热交换器。 复合式热交换器是一体的，以便使流过第一热交换器的排放制冷剂和流过第二热交换器的冷却剂之间的热传递。 此外，复合热交换器构成为，通过改变原料空气的体积，制冷剂的排出容量，制冷剂的排出容量等，来改变复合式热交换器中的进料空气，排出制冷剂和冷却剂之间的热交换量 压缩机构和热介质的流入量。

    Heat exchange system and vehicle refrigeration cycle system
    2.
    发明授权
    Heat exchange system and vehicle refrigeration cycle system 有权
    热交换系统和车辆制冷循环系统

    公开(公告)号：US09285171B2

    公开(公告)日：2016-03-15

    申请号：US13428620

    申请日：2012-03-23

    申请人： Yoshiki Katoh ,  Satoshi Itoh

    发明人： Yoshiki Katoh ,  Satoshi Itoh

    IPC分类号： F28D1/04 ,  F28D1/053 ,  B60H1/00 ,  F28D21/00

    CPC分类号： F28D1/0426 ,  B60H1/00042 ,  B60H1/00335 ,  B60H1/00921 ,  B60H2001/00942 ,  F25B39/00 ,  F25B41/04 ,  F25B2400/0403 ,  F25B2400/0409 ,  F25B2500/18 ,  F28D1/05391 ,  F28D2021/0096

    摘要： A unified heat exchanger includes a first heat exchanging arrangement and a second heat exchanging arrangement. The first heat exchanging arrangement is adapted to exchange heat between high pressure refrigerant and conditioning air. The second heat exchanging arrangement is adapted to exchange heat between low pressure refrigerant and the conditioning air. The first heat exchanging arrangement and the second heat exchanging arrangement are integrated together and are arranged to enable heat exchange of the conditioning air with both of the high pressure refrigerant and the low pressure refrigerant.

    摘要翻译： 统一的热交换器包括第一热交换装置和第二热交换装置。 第一热交换装置适于在高压制冷剂和调节空气之间交换热量。 第二热交换装置适于在低压制冷剂和调节空气之间交换热量。 第一热交换装置和第二热交换装置集成在一起，并且被布置成使得调节空气与高压制冷剂和低压制冷剂都能够进行热交换。

    HEAT EXCHANGE SYSTEM
    3.
    发明申请
    HEAT EXCHANGE SYSTEM 有权
    热交换系统

    公开(公告)号：US20130283835A1

    公开(公告)日：2013-10-31

    申请号：US13996232

    申请日：2011-12-10

    申请人： Yoshiki Katoh ,  Atsushi Inaba ,  Satoshi Itoh ,  Masahiro Shimoya

    发明人： Yoshiki Katoh ,  Atsushi Inaba ,  Satoshi Itoh ,  Masahiro Shimoya

    IPC分类号： B60H1/00

    CPC分类号： B60H1/00335 ,  B60H1/00328 ,  B60H1/00342 ,  B60H1/00735 ,  B60H1/00921 ,  F28D1/0316 ,  F28D1/035 ,  F28D1/0435 ,  F28D1/05391

    摘要： A heat exchange system for realizing an adequate heat exchange among a plural type of fluids uses a refrigerant radiator and a radiator which are combined to have one unit for enabling heat exchange between a refrigerant and a coolant, and decreases an inflow amount of the coolant flowing into the radiator when coolant temperature of the coolant flowing into the radiator is equal to or higher than a second standard temperature, which is set to be lower than a temperature of the refrigerant flowing into the refrigerant radiator, and is equal to or lower than a predetermined first standard temperature. In such manner, heat from the refrigerant is effectively transferred to an outside air by reducing an unwanted heat exchange between the refrigerant and the outside air.

    摘要翻译： 用于实现多种流体之间的充分热交换的热交换系统使用制冷剂散热器和散热器，该制冷剂散热器和散热器组合成具有用于使制冷剂和冷却剂之间进行热交换的一个单元，并且减少冷却剂流入的流入量 进入散热器的冷却剂温度等于或高于被设定为低于流入制冷剂散热器的制冷剂的温度的第二标准温度，并且等于或低于 预定的第一标准温度。 以这种方式，通过减少制冷剂和外部空气之间的不希望的热交换，来自制冷剂的热量被有效地传递到外部空气。

    Semiconductor nanowire memory device
    5.
    发明授权
    Semiconductor nanowire memory device 有权
    半导体纳米线存储器件

    公开(公告)号：US08390066B2

    公开(公告)日：2013-03-05

    申请号：US12881593

    申请日：2010-09-14

    申请人： Hideyuki Nishizawa ,  Satoshi Itoh

    发明人： Hideyuki Nishizawa ,  Satoshi Itoh

    IPC分类号： H01L27/11 ,  H01L27/12

    CPC分类号： B82Y10/00 ,  G11C11/36 ,  G11C11/39 ,  G11C11/40 ,  G11C11/41 ,  G11C13/025 ,  H01L21/84 ,  H01L27/11 ,  H01L27/1203 ,  H01L29/0673 ,  H01L29/861

    摘要： According to an embodiment, a semiconductor memory device capable of stably operating even when an element is shrunk is provided. The semiconductor memory device of the embodiment includes: first and second diodes serially connected between power sources of two different potentials, formed by nanowires, and exhibiting negative differential resistances; and a select transistor connected between the first diode and the second diode. The nanowires are preferably silicon nanowires. The thickness of the silicon nanowires is preferably 8 nm or less.

    摘要翻译： 根据一个实施例，提供即使当元件收缩时也能够稳定地操作的半导体存储器件。 该实施例的半导体存储器件包括：串联连接在两个不同电位的电源之间的由纳米线形成并呈现负的差分电阻的第一和第二二极管; 以及连接在第一二极管和第二二极管之间的选择晶体管。 纳米线优选为硅纳米线。 硅纳米线的厚度优选为8nm以下。

    HEAT PUMP CYCLE
    6.
    发明申请
    HEAT PUMP CYCLE 失效
    热泵循环

    公开(公告)号：US20120266624A1

    公开(公告)日：2012-10-25

    申请号：US13450800

    申请日：2012-04-19

    申请人： Atsushi Inaba ,  Satoshi Itoh

    发明人： Atsushi Inaba ,  Satoshi Itoh

    IPC分类号： F25B13/00 ,  F25B1/00

    CPC分类号： F25B41/04 ,  B60H1/00899 ,  F25B1/10 ,  F25B5/04 ,  F25B2341/0662 ,  F25B2400/0409 ,  F25B2400/0411 ,  F25B2400/23

    摘要： A heat pump cycle includes a compressor having a suction port and a discharge port, a heating heat exchanger which heats air, a gas-liquid separator, and a cooling heat exchanger which cools air upstream of the heating heat exchanger in an air flow direction. The heat pump cycle further includes an intermediate pressure passage which guides gas refrigerant from the gas-liquid separator to the suction port. A variable open-close portion opens the intermediate pressure passage and decompresses the gas refrigerant in the intermediate pressure passage, so that the gas refrigerant is introduced into the suction port when a bypass dehumidifying-heating mode is selected as a dehumidifying-heating mode in which the air having been heated in the heating heat exchanger becomes equal to or higher than air in an air-conditioning target space in temperature.

    摘要翻译： 热泵循环包括具有吸入口和排出口的压缩机，加热空气的加热热交换器，气液分离器和在空气流动方向上冷却加热热交换器上游的空气的冷却热交换器。 热泵循环还包括将气体制冷剂从气 - 液分离器引导到吸入口的中间压力通道。 可变的开闭部分打开中间压力通道并对中间压力通道中的气体制冷剂进行减压，使得当选择旁路除湿加热模式作为除湿加热模式时，气体制冷剂被引入吸入口，其中 在加热热交换器中被加热的空气在空调目标温度的空间中变得等于或高于空气。

    SEMICONDUCTOR MEMORY DEVICE
    7.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE 有权
    半导体存储器件

    公开(公告)号：US20110220876A1

    公开(公告)日：2011-09-15

    申请号：US12881593

    申请日：2010-09-14

    申请人： Hideyuki Nishizawa ,  Satoshi Itoh

    发明人： Hideyuki Nishizawa ,  Satoshi Itoh

    IPC分类号： H01L29/88 ,  B82Y99/00

    CPC分类号： B82Y10/00 ,  G11C11/36 ,  G11C11/39 ,  G11C11/40 ,  G11C11/41 ,  G11C13/025 ,  H01L21/84 ,  H01L27/11 ,  H01L27/1203 ,  H01L29/0673 ,  H01L29/861

    摘要： According to an embodiment, a semiconductor memory device capable of stably operating even when an element is shrunk is provided. The semiconductor memory device of the embodiment includes: first and second diodes serially connected between power sources of two different potentials, formed by nanowires, and exhibiting negative differential resistances; and a select transistor connected between the first diode and the second diode. The nanowires are preferably silicon nanowires. The thickness of the silicon nanowires is preferably 8 nm or less.

    摘要翻译： 根据一个实施例，提供即使当元件收缩时也能够稳定地操作的半导体存储器件。 该实施例的半导体存储器件包括：串联连接在两个不同电位的电源之间的由纳米线形成并呈现负的差分电阻的第一和第二二极管; 以及连接在第一二极管和第二二极管之间的选择晶体管。 纳米线优选为硅纳米线。 硅纳米线的厚度优选为8nm以下。

    Flat panel speaker system with a coated diaphragm
    8.
    发明授权
    Flat panel speaker system with a coated diaphragm 失效
    平板扬声器系统带有涂层隔膜

    公开(公告)号：US07460679B2

    公开(公告)日：2008-12-02

    申请号：US10534272

    申请日：2004-10-01

    申请人： Satoshi Itoh ,  Tetsuya Mouri ,  Masahide Sumiyama ,  Shoji Kamii

    发明人： Satoshi Itoh ,  Tetsuya Mouri ,  Masahide Sumiyama ,  Shoji Kamii

    IPC分类号： H04R25/00 ,  H04R1/00

    CPC分类号： H04R1/2842 ,  H04R1/021 ,  H04R1/2834 ,  H04R2499/11 ,  H04R2499/15

    摘要： A speaker system having a structure in which the room surrounding the first diaphragm and the room adjacent to the second diaphragm are acoustically coupled. The second diaphragm has coating on a surface. Applying the coating to the second diaphragm enhances the reliability and performance of the speaker system. Besides, the diversely definable geometry of the diaphragm allows an electronic device employing the speaker system or the speaker module to have flexibility in design.

    摘要翻译： 具有这样的结构的扬声器系统，其中围绕第一隔膜的房间和与第二隔膜相邻的房间是声耦合的。 第二个隔膜在表面上有涂层。 将涂层施加到第二隔膜增强了扬声器系统的可靠性和性能。 此外，隔膜的不同定义的几何形状允许使用扬声器系统或扬声器模块的电子设备具有设计灵活性。