SYSTEM AND METHOD FOR APPLYING A CONFORMAL BARRIR COATING WITH PRETREATING
    1.
    发明申请
    SYSTEM AND METHOD FOR APPLYING A CONFORMAL BARRIR COATING WITH PRETREATING 有权
    用预处理方法应用合适的条形涂层的系统和方法

    公开(公告)号:US20100079060A1

    公开(公告)日:2010-04-01

    申请号:US12242399

    申请日:2008-09-30

    摘要: In a method for depositing a barrier coating, a device is provided comprising a first portion and a second portion where a surface of the second portion is in a shadow zone. The device is pretreated wherein the pretreating alters a deposition rate of the barrier coating on a surface exposed to the pretreating. The shadow zone is substantially unexposed to the pretreating. A barrier coating is deposited wherein the barrier coating substantially conforms to a profile of the device. The coating may be a graded-composition barrier coating wherein a composition of the coating varies substantially continuously across a thickness thereof. The first portion may include a flexible, substantially transparent substrate. The second portion may include an electronic device. The barrier coating and first portion may encapsulate the second portion. The method is a single, commercially advantageous, barrier deposition process, enabling increased product throughput and low process tact time.

    摘要翻译: 在用于沉积阻挡涂层的方法中,提供了包括第一部分和第二部分的装置,其中第二部分的表面处于阴影区域。 该装置被预处理,其中预处理改变了暴露于预处理的表面上的阻挡涂层的沉积速率。 阴影区域基本上未被暴露于预处理。 沉积阻挡涂层,其中阻挡涂层基本上符合设备的轮廓。 涂层可以是梯度组合物阻挡涂层,其中涂层的组合物在其厚度上基本连续地变化。 第一部分可以包括柔性的,基本上透明的基底。 第二部分可以包括电子设备。 阻挡涂层和第一部分可以封装第二部分。 该方法是单一的,商业上有利的阻隔沉积工艺,能够提高产品生产量和低工艺节拍时间。

    SYSTEM AND METHOD FOR APPLYING A CONFORMAL BARRIER COATING
    5.
    发明申请
    SYSTEM AND METHOD FOR APPLYING A CONFORMAL BARRIER COATING 审中-公开
    用于施加一致性障碍物涂层的系统和方法

    公开(公告)号:US20100080929A1

    公开(公告)日:2010-04-01

    申请号:US12242443

    申请日:2008-09-30

    CPC分类号: C23C16/029 C23C16/50

    摘要: An improvement of a baseline method for depositing a coating on a device having a surface where the surface includes a first portion and a second portion, where the second portion is in a shadow zone, and where the coating is deposited using a first predetermined set of process parameters having a first ratio of a thickness of the coating on the second portion to a thickness of the coating on the first portion. In the improved method, the coating is deposited using a second predetermined set of process parameters such that the coating substantially conforms to a profile of the device and a second ratio of a thickness of the coating on the second portion to a thickness of the coating on the first portion is greater than the first ratio. The method is a single, commercially advantageous deposition process, enabling increased product throughput and low process tact time.

    摘要翻译: 一种用于在具有表面的装置上沉积涂层的基线方法的改进,其中所述表面包括第一部分和第二部分,其中第二部分处于阴影区域,并且其中涂层使用第一预定组 工艺参数具有第二部分上的涂层的厚度与第一部分上的涂层的厚度的第一比率。 在改进的方法中,使用第二预定的一组工艺参数沉积涂层,使得涂层基本上符合装置的轮廓,并且第二部分上的涂层的厚度与涂层的厚度的第二比率 第一部分大于第一比例。 该方法是单一的,商业上有利的沉积工艺,能够提高产品产量和低的工艺节拍时间。