摘要:
In a method for depositing a barrier coating, a device is provided comprising a first portion and a second portion where a surface of the second portion is in a shadow zone. The device is pretreated wherein the pretreating alters a deposition rate of the barrier coating on a surface exposed to the pretreating. The shadow zone is substantially unexposed to the pretreating. A barrier coating is deposited wherein the barrier coating substantially conforms to a profile of the device. The coating may be a graded-composition barrier coating wherein a composition of the coating varies substantially continuously across a thickness thereof. The first portion may include a flexible, substantially transparent substrate. The second portion may include an electronic device. The barrier coating and first portion may encapsulate the second portion. The method is a single, commercially advantageous, barrier deposition process, enabling increased product throughput and low process tact time.
摘要:
A method of monolithically interconnecting electrical devices that isolates and interconnects the contacts of neighboring electrical devices such as thin film PV cells, without damaging the surrounding materials.
摘要:
A photonic crystal based collection probe is provided. The probe includes a photonic crystal configured to guide and condition a beam of Raman scattered photons. Further, the device includes a spectrograph in optical communication with the photonic crystal and configured to receive Raman scattering from the photonic crystal. The device may be employed in a Raman spectrometer system.
摘要:
A method of monolithically interconnecting electrical devices that isolates and interconnects the contacts of neighboring electrical devices such as thin film PV cells, without damaging the surrounding materials.
摘要:
An improvement of a baseline method for depositing a coating on a device having a surface where the surface includes a first portion and a second portion, where the second portion is in a shadow zone, and where the coating is deposited using a first predetermined set of process parameters having a first ratio of a thickness of the coating on the second portion to a thickness of the coating on the first portion. In the improved method, the coating is deposited using a second predetermined set of process parameters such that the coating substantially conforms to a profile of the device and a second ratio of a thickness of the coating on the second portion to a thickness of the coating on the first portion is greater than the first ratio. The method is a single, commercially advantageous deposition process, enabling increased product throughput and low process tact time.