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公开(公告)号：US20100080929A1
公开(公告)日：2010-04-01
申请号：US12242443
申请日：2008-09-30
申请人： Ahmet Gun ERLAT , George Theodore Dalakos , Min Yan , Sheila Neumann Tandon , Brian Joseph Scherer
发明人： Ahmet Gun ERLAT , George Theodore Dalakos , Min Yan , Sheila Neumann Tandon , Brian Joseph Scherer
IPC分类号： C23C14/34 , C23C16/04 , C23C16/513
CPC分类号： C23C16/029 , C23C16/50
摘要： An improvement of a baseline method for depositing a coating on a device having a surface where the surface includes a first portion and a second portion, where the second portion is in a shadow zone, and where the coating is deposited using a first predetermined set of process parameters having a first ratio of a thickness of the coating on the second portion to a thickness of the coating on the first portion. In the improved method, the coating is deposited using a second predetermined set of process parameters such that the coating substantially conforms to a profile of the device and a second ratio of a thickness of the coating on the second portion to a thickness of the coating on the first portion is greater than the first ratio. The method is a single, commercially advantageous deposition process, enabling increased product throughput and low process tact time.
摘要翻译： 一种用于在具有表面的装置上沉积涂层的基线方法的改进，其中所述表面包括第一部分和第二部分，其中第二部分处于阴影区域，并且其中涂层使用第一预定组 工艺参数具有第二部分上的涂层的厚度与第一部分上的涂层的厚度的第一比率。 在改进的方法中，使用第二预定的一组工艺参数沉积涂层，使得涂层基本上符合装置的轮廓，并且第二部分上的涂层的厚度与涂层的厚度的第二比率 第一部分大于第一比例。 该方法是单一的，商业上有利的沉积工艺，能够提高产品产量和低的工艺节拍时间。
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2.发明授权公开(公告)号：US08033885B2
公开(公告)日：2011-10-11
申请号：US12242399
申请日：2008-09-30
申请人： Ahmet Gun Erlat , George Theodore Dalakos , Min Yan , Shelia Neumann Tandon , Brian Joseph Scherer
发明人： Ahmet Gun Erlat , George Theodore Dalakos , Min Yan , Shelia Neumann Tandon , Brian Joseph Scherer
IPC分类号： H05B33/04
CPC分类号： C23C16/0245 , B05D1/62 , C23C16/029 , H01L51/5253 , H01L2251/5346 , Y10T428/24612
摘要： In a method for depositing a barrier coating, a device is provided comprising a first portion and a second portion where a surface of the second portion is in a shadow zone. The device is pretreated wherein the pretreating alters a deposition rate of the barrier coating on a surface exposed to the pretreating. The shadow zone is substantially unexposed to the pretreating. A barrier coating is deposited wherein the barrier coating substantially conforms to a profile of the device. The coating may be a graded-composition barrier coating wherein a composition of the coating varies substantially continuously across a thickness thereof. The first portion may include a flexible, substantially transparent substrate. The second portion may include an electronic device. The barrier coating and first portion may encapsulate the second portion. The method is a single, commercially advantageous, barrier deposition process, enabling increased product throughput and low process tact time.
摘要翻译： 在用于沉积阻挡涂层的方法中，提供了包括第一部分和第二部分的装置，其中第二部分的表面处于阴影区域。 该装置被预处理，其中预处理改变了暴露于预处理的表面上的阻挡涂层的沉积速率。 阴影区域基本上未被暴露于预处理。 沉积阻挡涂层，其中阻挡涂层基本上符合设备的轮廓。 涂层可以是梯度组合物阻挡涂层，其中涂层的组合物在其厚度上基本连续地变化。 第一部分可以包括柔性的，基本上透明的基底。 第二部分可以包括电子设备。 阻挡涂层和第一部分可以封装第二部分。 该方法是单一的，商业上有利的阻隔沉积工艺，能够提高产品生产量和低工艺节拍时间。
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公开(公告)号：US09472783B2
公开(公告)日：2016-10-18
申请号：US12577629
申请日：2009-10-12
CPC分类号： H01L51/5256 , B05D1/60 , H01L2251/5346 , H01L2251/558
摘要： The present techniques provide systems and methods for protecting electronic devices such as organic light emitting devices (OLEDs) from adverse environmental effects using a thin film encapsulation with reduced process time. In some embodiments, the process time of forming a graded barrier over the OLED structure may take less than 5 minutes, and may result in substantially similar barrier properties as those of metal and epoxy sealants and/or typical thin film encapsulations. The process time of forming the barrier may be reduced by increasing deposition rates for organic and/or inorganic materials, reducing the thicknesses of organic and/or inorganic layers, and/or varying the number of zones in the barrier.
摘要翻译： 本技术提供了用减少处理时间的薄膜封装来保护诸如有机发光器件（OLED）的电子器件免受不利环境影响的系统和方法。 在一些实施方案中，在OLED结构上形成梯度屏障的处理时间可能需要少于5分钟，并且可能导致与金属和环氧树脂密封剂和/或典型的薄膜封装相似的阻挡性能。 通过增加有机和/或无机材料的沉积速率，降低有机和/或无机层的厚度和/或改变阻挡层中的区域数量，可以减少形成阻挡层的工艺时间。
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公开(公告)号：US20110151200A1
公开(公告)日：2011-06-23
申请号：US12642501
申请日：2009-12-18
CPC分类号： H05B33/04
摘要： The present techniques provide systems and methods for protecting electronic devices, such as organic light emitting devices (OLEDs) from adverse environmental effects. The edges of the devices may also be protected by a edge protection coating to reduce the adverse affects of a lateral ingress of adverse environmental conditions. In some embodiments, inorganic materials, or a combination of inorganic and organic materials, are deposited over the device to form a edge protection coating which extends approximately 3 millimeter or less beyond the edges of the device. In other embodiments, the device may be encapsulated with an organic region, and with an inorganic region, or the device may be encapsulated with inorganic materials, which may form the edge protection coating and may be combined with ultra high barrier technology. The coatings formed over the device may extend beyond the edges of the device to ensure lateral protection.
摘要翻译： 本技术提供了用于保护诸如有机发光器件（OLED）的电子器件免受不利环境影响的系统和方法。 设备的边缘也可以被边缘保护涂层保护，以减少不利环境条件的侧向侵入的不利影响。 在一些实施例中，将无机材料或无机材料和有机材料的组合沉积在器件上以形成延伸约3毫米或更少超过器件边缘的边缘保护涂层。 在其它实施方案中，该装置可以用有机区域和无机区域包封，或者该装置可以用无机材料包封，其可以形成边缘保护涂层并且可以与超高阻隔技术组合。 在装置上形成的涂层可以延伸超过装置的边缘以确保侧向保护。
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公开(公告)号：US08753711B2
公开(公告)日：2014-06-17
申请号：US12642501
申请日：2009-12-18
IPC分类号： B05D5/12
CPC分类号： H05B33/04
摘要： The present techniques provide systems and methods for protecting electronic devices, such as organic light emitting devices (OLEDs) from adverse environmental effects. The edges of the devices may also be protected by a edge protection coating to reduce the adverse affects of a lateral ingress of adverse environmental conditions. In some embodiments, inorganic materials, or a combination of inorganic and organic materials, are deposited over the device to form a edge protection coating which extends approximately 3 millimeter or less beyond the edges of the device. In other embodiments, the device may be encapsulated with an organic region, and with an inorganic region, or the device may be encapsulated with inorganic materials, which may form the edge protection coating and may be combined with ultra high barrier technology. The coatings formed over the device may extend beyond the edges of the device to ensure lateral protection.
摘要翻译： 本技术提供了用于保护诸如有机发光器件（OLED）的电子器件免受不利环境影响的系统和方法。 设备的边缘也可以被边缘保护涂层保护，以减少不利环境条件的侧向侵入的不利影响。 在一些实施例中，将无机材料或无机材料和有机材料的组合沉积在器件上以形成延伸约3毫米或更少超过器件边缘的边缘保护涂层。 在其它实施方案中，该装置可以用有机区域和无机区域包封，或者该装置可以用无机材料包封，其可以形成边缘保护涂层并且可以与超高阻隔技术组合。 在装置上形成的涂层可以延伸超过装置的边缘以确保侧向保护。
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公开(公告)号：US20110086183A1
公开(公告)日：2011-04-14
申请号：US12577629
申请日：2009-10-12
CPC分类号： H01L51/5256 , B05D1/60 , H01L2251/5346 , H01L2251/558
摘要： The present techniques provide systems and methods for protecting electronic devices such as organic light emitting devices (OLEDs) from adverse environmental effects using a thin film encapsulation with reduced process time. In some embodiments, the process time of forming a graded barrier over the OLED structure may take less than 5 minutes, and may result in substantially similar barrier properties as those of metal and epoxy sealants and/or typical thin film encapsulations. The process time of forming the barrier may be reduced by increasing deposition rates for organic and/or inorganic materials, reducing the thicknesses of organic and/or inorganic layers, and/or varying the number of zones in the barrier.
摘要翻译： 本技术提供了用减少处理时间的薄膜封装来保护诸如有机发光器件（OLED）的电子器件免受不利环境影响的系统和方法。 在一些实施方案中，在OLED结构上形成梯度屏障的处理时间可能需要少于5分钟，并且可能导致与金属和环氧树脂密封剂和/或典型的薄膜封装相似的阻挡性能。 通过增加有机和/或无机材料的沉积速率，降低有机和/或无机层的厚度和/或改变阻挡层中的区域数量，可以减少形成阻挡层的工艺时间。
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公开(公告)号：US20110008525A1
公开(公告)日：2011-01-13
申请号：US12501308
申请日：2009-07-10
CPC分类号： B05D1/62 , B05D3/0254 , B05D3/067
摘要： Present embodiments are directed to a system and method for condensing and curing organic materials within a deposition chamber. Present embodiments may include condensing an organic component from a gas phase into a liquid phase on a target surface within the deposition chamber, wherein the gas phase of the organic component might be mixed with an inert gas. Further, present embodiments may include solidifying the liquid phase of the organic component into a solid phase within the deposition chamber using an inert plasma formed from the inert gas.
摘要翻译： 本实施例涉及用于在沉积室内冷凝和固化有机材料的系统和方法。 本实施方案可以包括将有机组分从气相中冷凝到沉积室内的目标表面上的液相，其中有机组分的气相可能与惰性气体混合。 此外，本实施例可以包括使用由惰性气体形成的惰性等离子体将有机组分的液相固化成沉积室内的固相。
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公开(公告)号：US20130157405A1
公开(公告)日：2013-06-20
申请号：US13329418
申请日：2011-12-19
申请人： Jinbo Cao , Bastiaan Arie Korevaar , George Theodore Dalakos , Aharon Yakimov , Scott D. Feldman-Peabody , Dalong Zhong , Juan Carlos Rojo
发明人： Jinbo Cao , Bastiaan Arie Korevaar , George Theodore Dalakos , Aharon Yakimov , Scott D. Feldman-Peabody , Dalong Zhong , Juan Carlos Rojo
IPC分类号： H01L31/0296
CPC分类号： H01L21/477 , H01L31/03925 , H01L31/1828 , H01L31/1864 , Y02E10/543 , Y02P70/521
摘要： A method of manufacturing semiconductor assemblies is provided. The manufacturing method includes thermally processing a first semiconductor assembly comprising a first semiconductor layer disposed on a first support and thermally processing a second semiconductor assembly comprising a second semiconductor layer disposed on a second support. The first and second semiconductor assemblies are thermally processed simultaneously, and the first and second semiconductor assemblies are arranged such that the first semiconductor layer faces the second semiconductor layer during the thermal processing.
摘要翻译： 提供一种制造半导体组件的方法。 该制造方法包括热处理包括设置在第一支撑件上的第一半导体层的第一半导体组件，并且热处理包括设置在第二支撑件上的第二半导体层的第二半导体组件。 第一和第二半导体组件被同时热处理，并且第一和第二半导体组件被布置成使得第一半导体层在热处理期间面向第二半导体层。
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公开(公告)号：US20120219791A1
公开(公告)日：2012-08-30
申请号：US13036089
申请日：2011-02-28
申请人： Daniel Qi Tan , George Theodore Dalakos , Yang Cao , Qin Chen , Ri-an Zhao
发明人： Daniel Qi Tan , George Theodore Dalakos , Yang Cao , Qin Chen , Ri-an Zhao
CPC分类号： H01B3/306 , H01B3/42 , H01G4/18 , Y10T428/26 , Y10T428/265 , Y10T428/266 , Y10T428/31507 , Y10T428/31667 , Y10T428/31721 , Y10T428/31855
摘要： Present invention provides a film and an article including the film. The film includes first layer, second layer and third layer. The first layer includes a polymer dielectric material. The second layer is disposed on at least one surface of the first layer and includes inorganic oxide dielectric material. The third layer is disposed on the first or second layer and includes a nitride or oxynitride material.
摘要翻译： 本发明提供了一种包括该膜的膜和物品。 该膜包括第一层，第二层和第三层。 第一层包括聚合物电介质材料。 第二层设置在第一层的至少一个表面上，并且包括无机氧化物介电材料。 第三层设置在第一层或第二层上，并且包括氮化物或氧氮化物材料。
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公开(公告)号：US20080009417A1
公开(公告)日：2008-01-10
申请号：US11560953
申请日：2006-11-17
IPC分类号： H01L39/24
CPC分类号： H01L21/68757 , C03C3/062 , C03C3/095 , C03C4/20
摘要： A processing apparatus for use in a corrosive operating environment at a temperature range of 25-1500° C. is provided. The apparatus has protective coating structure that includes a glassy material. The glassy material includes at least one of yttrium, cerium, or gadolinium; and aluminum and silicon. The coating composition resists etching by a harsh environment.
摘要翻译： 提供一种用于在25-1500℃的温度范围内的腐蚀性操作环境中的加工设备。 该装置具有包括玻璃状材料的保护涂层结构。 玻璃状材料包括钇，铈或钆中的至少一种; 和铝和硅。 涂料组合物可以抵抗恶劣环境的蚀刻。
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