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1.发明授权公开(公告)号：US07915696B2
公开(公告)日：2011-03-29
申请号：US11877786
申请日：2007-10-24
申请人： David Cecil Hays , Marco Francesco Aimi , Christopher Fred Keimel , Glenn Scott Claydon , Kanakasabapathi Subramanian , Oliver Charles Boomhower
发明人： David Cecil Hays , Marco Francesco Aimi , Christopher Fred Keimel , Glenn Scott Claydon , Kanakasabapathi Subramanian , Oliver Charles Boomhower
IPC分类号： H01L29/82
CPC分类号： B81B7/007 , B81B2207/07 , B81B2207/096 , H01H1/0036
摘要： An electrical through-connection, or via, that passes through a substrate to a bus on a first surface of the substrate. The via may be configured with an interlock such that the electrically conductive core of the via is constrained to thermally expand towards the second surface, away from the bus, thus preventing damage to the bus. The interlock may be a local constriction or enlargement of the via near the first surface of the substrate. The via may be greater in length along the bus than a unit spacing of beams in a parallel microswitch array actuated in unison along the bus. The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface of the substrate than at the first surface.
摘要翻译： 电穿过连接或通孔，其通过基板到基板的第一表面上的总线。 通孔可以配置有互锁，使得通孔的导电芯被约束以朝向第二表面热膨胀，远离总线，从而防止对总线的损坏。 互锁可以是在基板的第一表面附近的通孔的局部收缩或扩大。 沿着母线的通路长度可以大于沿着总线一致致动的平行微动开关阵列中的梁的单位间隔。 通孔的宽度可以比长度窄，并且可以形成在衬底的第二表面处比在第一表面处更大的梯形几何形状。
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公开(公告)号：US07605466B2
公开(公告)日：2009-10-20
申请号：US11872562
申请日：2007-10-15
申请人： Marco Francesco Aimi , Christopher James Kapusta , Arun Virupaksha Gowda , David Cecil Hays , Oliver Charles Boomhower , Glenn Scott Claydon , Joseph Alfred Iannotti , Christopher Fred Keimel
发明人： Marco Francesco Aimi , Christopher James Kapusta , Arun Virupaksha Gowda , David Cecil Hays , Oliver Charles Boomhower , Glenn Scott Claydon , Joseph Alfred Iannotti , Christopher Fred Keimel
IPC分类号： H01L23/34
CPC分类号： B81C1/00269 , B81C2203/0118 , B81C2203/019 , B81C2203/032 , H01L2224/16225 , H01L2924/1461 , H01L2924/00
摘要： Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.
摘要翻译： 衬底上的多个微电子机械系统（MEMS）用盖子盖住，使用可用作粘合剂，分离层和气密密封的层。 衬底具有具有多个MEMS器件的第一侧。 形成有用于通孔的通孔的盖，并且具有用于层对准和分离的支柱。 图案化粘合片用于MEMS器件，通孔和支柱的切口。 将粘合片粘合到盖上，然后放置在MEMS基板上并加热以粘合层。 通孔可以用电路板连接的引线金属化。 在密封之后，MEMS单元可以从基底切割，从而保护它们免受污染。
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3.发明申请公开(公告)号：US20090107812A1
公开(公告)日：2009-04-30
申请号：US11877786
申请日：2007-10-24
申请人： David Cecil Hays , Marco Francesco Aimi , Christopher Fred Keimel , Glenn Scott Claydon , Kanakasabapathi Subramanian , Oliver Charles Boomhower
发明人： David Cecil Hays , Marco Francesco Aimi , Christopher Fred Keimel , Glenn Scott Claydon , Kanakasabapathi Subramanian , Oliver Charles Boomhower
IPC分类号： H01H57/00
CPC分类号： B81B7/007 , B81B2207/07 , B81B2207/096 , H01H1/0036
摘要： An electrical through-connection, or via, that passes through a substrate to a bus on a first surface of the substrate. The via may be configured with an interlock such that the electrically conductive core of the via is constrained to thermally expand towards the second surface, away from the bus, thus preventing damage to the bus. The interlock may be a local constriction or enlargement of the via near the first surface of the substrate. The via may be greater in length along the bus than a unit spacing of beams in a parallel microswitch array actuated in unison along the bus. The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface of the substrate than at the first surface.
摘要翻译： 电穿过连接或通孔，其通过基板到基板的第一表面上的总线。 通孔可以配置有互锁，使得通孔的导电芯被约束以朝向第二表面热膨胀，远离总线，从而防止对总线的损坏。 互锁可以是在基板的第一表面附近的通孔的局部收缩或扩大。 沿着母线的通路长度可以大于沿着总线一致致动的平行微动开关阵列中的梁的单位间隔。 通孔的宽度可以比长度窄，并且可以形成在衬底的第二表面处比在第一表面处更大的梯形几何形状。
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公开(公告)号：US07505128B2
公开(公告)日：2009-03-17
申请号：US11400948
申请日：2006-04-10
申请人： Anis Zribi , Stacey Joy Kennerly , Glenn Scott Claydon , Long Que , Ayan Banerjee , Shankar Chandrasekaran , Shivappa Ningappa Goravar , David Cecil Hays
发明人： Anis Zribi , Stacey Joy Kennerly , Glenn Scott Claydon , Long Que , Ayan Banerjee , Shankar Chandrasekaran , Shivappa Ningappa Goravar , David Cecil Hays
IPC分类号： G01J3/44
CPC分类号： G01J3/02 , G01J3/0208 , G01J3/0256 , G01J3/0272 , G01J3/0291 , G01J3/26 , G01J3/44 , G01N21/65 , G01N21/658 , G01N2201/0221
摘要： An integrated spectrometer instrument, including an optical source formed on a chip, the optical source configured to generate an incident optical beam upon a sample to be measured. Collection optics formed on the chip are configured to receive a scattered optical beam from the sample, and filtering optics formed on the chip are configured to remove elastically scattered light from the scattered optical beam at a wavelength corresponding to the optical source. A tunable filter formed on the chip is configured to pass selected wavelengths of the scattered optical beam, and a photo detector device formed on the chip is configured to generate an output signal corresponding to the intensity of photons passed through the tunable filter.
摘要翻译： 一种集成光谱仪器，包括形成在芯片上的光源，所述光源被配置为在待测样品上产生入射光束。 形成在芯片上的采集光学元件被配置为接收来自样品的散射光束，并且形成在芯片上的滤光光学元件被配置为以对应于光源的波长去除来自散射光束的弹性散射光。 形成在芯片上的可调滤波器被配置为通过散射光束的选定波长，并且形成在芯片上的光检测器装置被配置为产生对应于通过可调谐滤波器的光子的强度的输出信号。
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公开(公告)号：US20080239306A1
公开(公告)日：2008-10-02
申请号：US11693277
申请日：2007-03-29
申请人： William Scott Sutherland , Anis Zribi , Long Que , Glenn Scott Claydon , Stacey Joy Kennerly , Ayan Banerjee , Shivappa Ningappa Goravar , Shankar Chandrasekaran , David Cecil Hays , Victor Samper , Dirk Lange , Marko Baller , Min-Yi Shih , Sandip Maity
发明人： William Scott Sutherland , Anis Zribi , Long Que , Glenn Scott Claydon , Stacey Joy Kennerly , Ayan Banerjee , Shivappa Ningappa Goravar , Shankar Chandrasekaran , David Cecil Hays , Victor Samper , Dirk Lange , Marko Baller , Min-Yi Shih , Sandip Maity
CPC分类号： G01N21/65 , G01J3/02 , G01J3/0208 , G01J3/021 , G01J3/0218 , G01J3/0232 , G01J3/0237 , G01J3/027 , G01J3/0289 , G01J3/10 , G01J3/1895 , G01J3/44 , G02B26/02 , G02B26/0808 , G02B26/0816
摘要： A system and method for managing optical power for controlling thermal alteration of a sample undergoing spectroscopic analysis is provided. The system includes a moveable laser beam generator for irradiating the sample and a beam shaping device for moving and shaping the laser beam to prevent thermal overload or build up in the sample. The moveable laser beam generator includes at least one beam shaping device selected from the group consisting of at least one optical lens, at least one optical diffractor, at least one optical path difference modulator, at least one moveable mirror, at least one Micro-Electro-Mechanical Systems (MEMS) integrated circuit (IC), and/or a liquid droplet. The system also includes an at least two degree of freedom (2 DOF) moveable substrate platform and a controller for controlling the laser beam generator and the substrate platform, and for analyzing light reflected from the sample.
摘要翻译： 提供了一种用于管理用于控制进行光谱分析的样品的热变化的光功率的系统和方法。 该系统包括用于照射样品的可移动激光束发生器和用于移动和成形激光束的光束整形装置，以防止样品中的热过载或积聚。 可移动激光束发生器包括至少一个光束成形装置，其选自由至少一个光学透镜，至少一个光学衍射器，至少一个光程差调制器，至少一个可动反射镜，至少一个微电极 机电系统（MEMS）集成电路（IC）和/或液滴。 该系统还包括至少两个自由度（2自由度）可移动基板平台和用于控制激光束发生器和基板平台的控制器，并用于分析从样品反射的光。
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公开(公告)号：US20080143216A1
公开(公告)日：2008-06-19
申请号：US11640803
申请日：2006-12-18
申请人： Ertugrul Berkcan , Emad Andarawis Andarawis , Robert John Wojnarowski , Charles Scott Sealing , Charles Erklin Seeley , Eladio Clemente Delgado , David Cecil Hays , Christopher James Kapusta , Nanette Judith Gruber
发明人： Ertugrul Berkcan , Emad Andarawis Andarawis , Robert John Wojnarowski , Charles Scott Sealing , Charles Erklin Seeley , Eladio Clemente Delgado , David Cecil Hays , Christopher James Kapusta , Nanette Judith Gruber
IPC分类号： H01L41/083 , H01L41/047 , H01L41/16
CPC分类号： H01L27/20 , G01M5/00 , G01N29/245 , G01N29/2475 , G01N2291/0231 , H01L41/047 , H01L41/1132
摘要： A piezoelectric planar composite apparatus to provide health monitoring of a structure and associated methods are provided. The piezoelectric planar composite apparatus includes a piezoelectric electric material layer, multiple electrodes positioned in electrical contact with the piezoelectric material layer, and multiple sets of electrode interconnect conductors each positioned in electrical contact with a different subset of the of the electrodes and positioned to form multiple complementary electrode patterns. Each of the complementary electrode patterns is positioned to form an electric field having an electric field axis oriented along a different physical axis from that of an electric field formed by at least one other of the complementary electrode patterns. The interconnect conductors can be distributed over several electrode interconnect conductor carrying layers to enhance formation of the different complementary electrode patterns.
摘要翻译： 提供了一种用于提供结构和相关方法的健康监测的压电平面复合装置。 压电平面复合装置包括压电电材料层，与压电材料层电接触的多个电极，以及多组电极互连导体，每组电极互连导体定位成与电极的不同子集电接触并且定位成形成多个 互补电极图案。 每个互补电极图案被定位成形成电场轴，该电场轴沿着与至少另一个互补电极图案形成的电场不同的物理轴定向。 互连导体可以分布在多个电极互连导体承载层上以增强不同互补电极图案的形成。
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公开(公告)号：US08054147B2
公开(公告)日：2011-11-08
申请号：US12416292
申请日：2009-04-01
CPC分类号： H01H59/0009 , H01H1/0036 , H01H2001/0089
摘要： Electrostatic devices, systems and methods are presented. One embodiment is an electrostatic device including a substrate, a first electrode disposed on the substrate, a movable element having a second electrode and a control electrode. The control electrode is disposed in electrostatic communication with the movable element. The control electrode includes a protection layer having resistivity in a range of from about 1 ohm-cm to about 10 kohm-cm.
摘要翻译： 介绍了静电装置，系统和方法。 一个实施例是包括基板，设置在基板上的第一电极，具有第二电极和控制电极的可移动元件的静电装置。 控制电极被设置成与可移动元件静电连通。 控制电极包括具有在约1欧姆 - 厘米至约10千欧姆 - 厘米范围内的电阻率的保护层。
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公开(公告)号：US20100252403A1
公开(公告)日：2010-10-07
申请号：US12416292
申请日：2009-04-01
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H1/0036 , H01H2001/0089
摘要： Electrostatic devices, systems and methods are presented. One embodiment is an electrostatic device including a substrate, a first electrode disposed on the substrate, a movable element having a second electrode and a control electrode. The control electrode is disposed in electrostatic communication with the movable element. The control electrode includes a protection layer having resistivity in a range of from about 1 ohm-cm to about 10 kohm-cm.
摘要翻译： 介绍了静电装置，系统和方法。 一个实施例是包括基板，设置在基板上的第一电极，具有第二电极和控制电极的可移动元件的静电装置。 控制电极被设置成与可移动元件静电连通。 控制电极包括具有在约1欧姆 - 厘米至约10千欧姆 - 厘米范围内的电阻率的保护层。
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公开(公告)号：US20090096088A1
公开(公告)日：2009-04-16
申请号：US11872562
申请日：2007-10-15
申请人： MARCO FRANCESCO AIMI , Chirstopher James Kapusta , Arun Virupaksha Gowda , David Cecil Hays , Oliver Charles Boomhower , Glenn Scott Claydon , Joseph Alfred Iannotti , Christopher Fred Keimel
发明人： MARCO FRANCESCO AIMI , Chirstopher James Kapusta , Arun Virupaksha Gowda , David Cecil Hays , Oliver Charles Boomhower , Glenn Scott Claydon , Joseph Alfred Iannotti , Christopher Fred Keimel
CPC分类号： B81C1/00269 , B81C2203/0118 , B81C2203/019 , B81C2203/032 , H01L2224/16225 , H01L2924/1461 , H01L2924/00
摘要： Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.
摘要翻译： 衬底上的多个微电子机械系统（MEMS）用盖子盖住，使用可用作粘合剂，分离层和气密密封的层。 衬底具有具有多个MEMS器件的第一侧。 形成有用于通孔的通孔的盖，并且具有用于层对准和分离的支柱。 图案化粘合片用于MEMS器件，通孔和支柱的切口。 将粘合片粘合到盖上，然后放置在MEMS基板上并加热以粘合层。 通孔可以用电路板连接的引线金属化。 在密封之后，MEMS单元可以从基底切割，从而保护它们免受污染。
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10.发明授权Collection probe for use in a Raman spectrometer system and methods of making and using the same 有权用于拉曼光谱仪系统的收集探针及其制作和使用方法公开(公告)号：US07411670B2
公开(公告)日：2008-08-12
申请号：US11400863
申请日：2006-04-10
申请人： Anis Zribi , Ayan Banerjee , Shivappa Ningappa Goravar , Shankar (nmn) Chandrasekaran , Sandip Maity , Glenn Scott Claydon , Stacey Joy Kennerly , Todd Ryan Tolliver , David Cecil Hays , Sheila Neumann Tandon , Long Que , Christopher Fred Keimel
发明人： Anis Zribi , Ayan Banerjee , Shivappa Ningappa Goravar , Shankar (nmn) Chandrasekaran , Sandip Maity , Glenn Scott Claydon , Stacey Joy Kennerly , Todd Ryan Tolliver , David Cecil Hays , Sheila Neumann Tandon , Long Que , Christopher Fred Keimel
IPC分类号： G01J3/44
CPC分类号： G01J3/44 , G01J3/02 , G01J3/0291 , G01N21/65
摘要： A photonic crystal based collection probe is provided. The probe includes a photonic crystal configured to guide and condition a beam of Raman scattered photons. Further, the device includes a spectrograph in optical communication with the photonic crystal and configured to receive Raman scattering from the photonic crystal. The device may be employed in a Raman spectrometer system.
摘要翻译： 提供了一种基于光子晶体的收集探针。 探针包括配置为引导和调节拉曼散射光子束的光子晶体。 此外，该装置包括与光子晶体光学通信并被配置为从光子晶体接收拉曼散射的光谱仪。 该装置可以用在拉曼光谱仪系统中。
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