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1.发明申请公开(公告)号：US20130093091A1
公开(公告)日：2013-04-18
申请号：US13806136
申请日：2011-08-05
申请人： Shenglin Ma , Yunhui Zhu , Xin Sun , Yufeng Jin , Min Miao
发明人： Shenglin Ma , Yunhui Zhu , Xin Sun , Yufeng Jin , Min Miao
IPC分类号： H01L23/522 , H01L21/50
CPC分类号： H01L25/0657 , H01L21/50 , H01L21/76843 , H01L21/76879 , H01L21/76898 , H01L23/481 , H01L23/5226 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/50 , H01L2224/0557 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/83896 , H01L2224/9202 , H01L2224/94 , H01L2225/06541 , H01L2225/06544 , H01L2225/06558 , H01L2225/06565 , H01L2225/06589 , H01L2924/00014 , H01L2924/0002 , H01L2924/01029 , H01L2924/01079 , H01L2924/07802 , H01L2924/12042 , H01L2924/00 , H01L2224/05552
摘要： The present invention discloses a three-dimensional vertically interconnected structure and a fabricating method for the same. The structure comprises at least two layers of chips which are stacked in sequence or stacked together face to face, and an adhesive material is used for adhesion between adjacent layers of said chips, each layer of chips contains a substrate layer and a dielectric layer sequentially bottom to top; an front surface of the chip has a first concave with an annular cross section, and the first concave is filled with metal inside to form a first electrical conductive ring connecting to microelectronic devices inside the chip via a redistribution layer; a first through layers of chips hole having the same radius and center as inner ring of the first electrical conductive ring penetrates the stacked chips and has a first micro electrical conductive pole inside that is electrically connected to the first electrical conductive ring. The three-dimensional vertically interconnected structure of the present invention enhances the strength of the electric interconnection and the adhesion between adjacent layers of chips, and in the meantime the disclosed fabricating method simplifies the process difficulty and therefore improves the yield.
摘要翻译： 本发明公开了一种三维垂直互连结构及其制造方法。 该结构包括至少两层芯片，其顺序层叠或面对面堆叠，并且粘合材料用于在所述芯片的相邻层之间的粘合，每层芯片包含基底层和介电层顺序地底部 到达顶点; 芯片的前表面具有环形横截面的第一凹部，并且第一凹部内部填充有金属，以形成通过再分配层连接到芯片内的微电子器件的第一导电环; 具有与第一导电环的内环相同的半径和中心的第一贯穿层的切屑孔穿透堆叠的芯片，并且在其内部具有电连接到第一导电环的第一微导电极。 本发明的三维垂直互连结构增强了电互连的强度和相邻的芯片层之间的粘附力，同时所公开的制造方法简化了工艺难度，从而提高了产量。
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2.发明授权公开(公告)号：US07517527B2
公开(公告)日：2009-04-14
申请号：US09389565
申请日：1999-09-03
CPC分类号： C07K16/2809 , A61K47/6829 , A61K47/6849 , A61K2039/505 , C07K2317/77
摘要： Provided is a method of treating an autoimmune disease in an animal comprising administering to the animal an antibody-DT mutant immunotoxin which routes by the anti-CD3 pathway, or derivatives thereof, under conditions such that the autoimmune disease is treated. In a further embodiment, the invention provides a method of treating T cell leukemias or lymphomas in an animal comprising administering to the animal an antibody-DT mutant immunotoxin which routes by the anti-CD3 pathway, or derivatives thereof, under conditions such that the T cell leukemias or lymphomas are treated.
摘要翻译： 本发明提供一种治疗动物自身免疫性疾病的方法，其特征在于，在对自身免疫性疾病进行治疗的条件下，对该动物施用抗CD3通路途径的抗体-DD突变型免疫毒素或其衍生物。 在另一个实施方案中，本发明提供了一种治疗动物中的T细胞白血病或淋巴瘤的方法，其包括对所述动物施用抗CD3通路途径的抗体-DD突变体免疫毒素或其衍生物， 治疗细胞白血病或淋巴瘤。
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公开(公告)号：US20130211049A1
公开(公告)日：2013-08-15
申请号：US13443779
申请日：2012-04-10
申请人： David M. Neville, JR. , Jerry T. Thompson , Huaizhong Hu , Jung-Hee Woo , Shenglin Ma , Jonathan Mark Hexham , Mary Ellen Digan
发明人： David M. Neville, JR. , Jerry T. Thompson , Huaizhong Hu , Jung-Hee Woo , Shenglin Ma , Jonathan Mark Hexham , Mary Ellen Digan
IPC分类号： C07K19/00
CPC分类号： C07K19/00 , A61K47/6829 , A61K47/6849 , C07K5/1008 , C07K7/06 , C07K7/08 , C07K14/34 , C07K16/2809 , C07K2317/24 , C07K2317/622 , C07K2319/00
摘要： The present invention described and shown in the specification and drawings provides novel recombinant DT-based immunotoxins, and, more specifically anti-T cell immunotoxin fusion proteins. Also provided are immunotoxins that can be ex-pressed in bacterial, yeast, or mammalian cells. The invention also provides means for expression of the immunotoxin fusion protein. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译： 在说明书和附图中描述和示出的本发明提供了新的重组DT-基免疫毒素，更具体地，提供了抗T细胞免疫毒素融合蛋白。 还提供了可以在细菌，酵母或哺乳动物细胞中进行表达的免疫毒素。 本发明还提供了表达免疫毒素融合蛋白的方法。 要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。
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公开(公告)号：US20110086416A1
公开(公告)日：2011-04-14
申请号：US12718673
申请日：2010-03-05
申请人： David M. Neville, Jr. , Jerry Todd Thompson , Huaizhong Hu , Jung-Hee Woo , Shenglin Ma , Jonathan Mark Hexham , Mary Ellen Digan
发明人： David M. Neville, Jr. , Jerry Todd Thompson , Huaizhong Hu , Jung-Hee Woo , Shenglin Ma , Jonathan Mark Hexham , Mary Ellen Digan
CPC分类号： C07K19/00 , A61K47/6829 , A61K47/6849 , C07K5/1008 , C07K7/06 , C07K7/08 , C07K14/34 , C07K16/2809 , C07K2317/24 , C07K2317/622 , C07K2319/00
摘要： The present invention described and shown in the specification and drawings provides novel recombinant DT-based immunotoxins, and, more specifically anti-T cell immunotoxin fusion proteins. Also provided are immunotoxins that can be expressed in bacterial, yeast, or mammalian cells. The invention also provides means for expression of the immunotoxin fusion protein. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译： 在说明书和附图中描述和示出的本发明提供了新的重组DT-基免疫毒素，更具体地，提供了抗T细胞免疫毒素融合蛋白。 还提供了可以在细菌，酵母或哺乳动物细胞中表达的免疫毒素。 本发明还提供了表达免疫毒素融合蛋白的方法。 要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。
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公开(公告)号：US08987426B2
公开(公告)日：2015-03-24
申请号：US13443779
申请日：2012-04-10
申请人： David M. Neville, Jr. , Jerry T. Thompson , Huaizhong Hu , Jung-Hee Woo , Shenglin Ma , Jonathan Mark Hexham , Mary Ellen Digan
发明人： David M. Neville, Jr. , Jerry T. Thompson , Huaizhong Hu , Jung-Hee Woo , Shenglin Ma , Jonathan Mark Hexham , Mary Ellen Digan
CPC分类号： C07K19/00 , A61K47/6829 , A61K47/6849 , C07K5/1008 , C07K7/06 , C07K7/08 , C07K14/34 , C07K16/2809 , C07K2317/24 , C07K2317/622 , C07K2319/00
摘要： The present invention described and shown in the specification and drawings provides novel recombinant DT-based immunotoxins, and, more specifically anti-T cell immunotoxin fusion proteins. Also provided are immunotoxins that can be expressed in bacterial, yeast, or mammalian cells. The invention also provides means for expression of the immunotoxin fusion protein. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译： 在说明书和附图中描述和示出的本发明提供了新的重组DT-基免疫毒素，更具体地，提供了抗T细胞免疫毒素融合蛋白。 还提供了可以在细菌，酵母或哺乳动物细胞中表达的免疫毒素。 本发明还提供了表达免疫毒素融合蛋白的方法。 要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。
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公开(公告)号：US08836140B2
公开(公告)日：2014-09-16
申请号：US13806136
申请日：2011-08-05
申请人： Shenglin Ma , Min Miao , Yunhui Zhu , Xin Sun , Yufeng Jin
发明人： Shenglin Ma , Min Miao , Yunhui Zhu , Xin Sun , Yufeng Jin
IPC分类号： H01L23/48 , H01L25/065 , H01L21/768 , H01L23/522 , H01L21/50 , H01L25/00 , H01L23/00
CPC分类号： H01L25/0657 , H01L21/50 , H01L21/76843 , H01L21/76879 , H01L21/76898 , H01L23/481 , H01L23/5226 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/50 , H01L2224/0557 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/83896 , H01L2224/9202 , H01L2224/94 , H01L2225/06541 , H01L2225/06544 , H01L2225/06558 , H01L2225/06565 , H01L2225/06589 , H01L2924/00014 , H01L2924/0002 , H01L2924/01029 , H01L2924/01079 , H01L2924/07802 , H01L2924/12042 , H01L2924/00 , H01L2224/05552
摘要： The present invention discloses a three-dimensional vertically interconnected structure and a fabricating method for the same. The structure comprises at least two layers of chips which are stacked in sequence or stacked together face to face, and an adhesive material is used for adhesion between adjacent layers of said chips, each layer of chips contains a substrate layer and a dielectric layer sequentially bottom to top; an front surface of the chip has a first concave with an annular cross section, and the first concave is filled with metal inside to form a first electrical conductive ring connecting to microelectronic devices inside the chip via a redistribution layer; a first through layers of chips hole having the same radius and center as inner ring of the first electrical conductive ring penetrates the stacked chips and has a first micro electrical conductive pole inside that is electrically connected to the first electrical conductive ring. The three-dimensional vertically interconnected structure of the present invention enhances the strength of the electric interconnection and the adhesion between adjacent layers of chips, and in the meantime the disclosed fabricating method simplifies the process difficulty and therefore improves the yield.
摘要翻译： 本发明公开了一种三维垂直互连结构及其制造方法。 该结构包括至少两层芯片，其顺序层叠或面对面堆叠，并且粘合材料用于在所述芯片的相邻层之间的粘合，每层芯片包含基底层和介电层顺序地底部 到达顶点; 芯片的前表面具有环形横截面的第一凹部，并且第一凹部内部填充有金属，以形成通过再分配层连接到芯片内的微电子器件的第一导电环; 具有与第一导电环的内环相同的半径和中心的第一贯穿层的切屑孔穿透堆叠的芯片，并且在其内部具有电连接到第一导电环的第一微导电极。 本发明的三维垂直互连结构增强了电互连的强度和相邻的芯片层之间的粘附力，同时所公开的制造方法简化了工艺难度，从而提高了产量。
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公开(公告)号：US08217158B2
公开(公告)日：2012-07-10
申请号：US12718673
申请日：2010-03-05
申请人： David M. Neville, Jr. , Jerry Todd Thompson , Huaizhong Hu , Jung-Hee Woo , Shenglin Ma , Jonathan Mark Hexham , Mary Ellen Digan
发明人： David M. Neville, Jr. , Jerry Todd Thompson , Huaizhong Hu , Jung-Hee Woo , Shenglin Ma , Jonathan Mark Hexham , Mary Ellen Digan
IPC分类号： C07H21/04
CPC分类号： C07K19/00 , A61K47/6829 , A61K47/6849 , C07K5/1008 , C07K7/06 , C07K7/08 , C07K14/34 , C07K16/2809 , C07K2317/24 , C07K2317/622 , C07K2319/00
摘要： The present invention described and shown in the specification and drawings provides novel recombinant DT-based immunotoxins, and, more specifically anti-T cell immunotoxin fusion proteins. Also provided are immunotoxins that can be expressed in bacterial, yeast, or mammalian cells. The invention also provides means for expression of the immunotoxin fusion protein. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
摘要翻译： 在说明书和附图中描述和示出的本发明提供了新的重组DT-基免疫毒素，更具体地，提供了抗T细胞免疫毒素融合蛋白。 还提供了可以在细菌，酵母或哺乳动物细胞中表达的免疫毒素。 本发明还提供了表达免疫毒素融合蛋白的方法。 要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。
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公开(公告)号：US07696338B2
公开(公告)日：2010-04-13
申请号：US10296085
申请日：2001-05-18
申请人： David M. Neville, Jr. , Jerry T. Thompson , Huaizhong Hu , Jung-Hee Woo , Shenglin Ma , Jonathan Mark Hexham , Mary Ellen Digan
发明人： David M. Neville, Jr. , Jerry T. Thompson , Huaizhong Hu , Jung-Hee Woo , Shenglin Ma , Jonathan Mark Hexham , Mary Ellen Digan
IPC分类号： C07H21/04
CPC分类号： C07K19/00 , A61K47/6829 , A61K47/6849 , C07K5/1008 , C07K7/06 , C07K7/08 , C07K14/34 , C07K16/2809 , C07K2317/24 , C07K2317/622 , C07K2319/00
摘要： The present invention described and shown in the specification and drawings provides novel recombinant DT-based immunotoxins, and, more specifically anti-T cell immunotoxin fusion proteins. Also provided are immunotoxins that can be expressed in bacterial, yeast, or mammalian cells. The invention also provides means for expression of the immunotoxin fusion protein.
摘要翻译： 在说明书和附图中描述和示出的本发明提供了新的重组DT-基免疫毒素，更具体地，提供了抗T细胞免疫毒素融合蛋白。 还提供了可以在细菌，酵母或哺乳动物细胞中表达的免疫毒素。 本发明还提供了表达免疫毒素融合蛋白的方法。
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