公开(公告)号：US5655046A

公开(公告)日：1997-08-05

申请号：US570769

申请日：1995-12-12

申请人： Shin-ichi Todoroki ,  Shigeki Sakaguchi

发明人： Shin-ichi Todoroki ,  Shigeki Sakaguchi

IPC分类号： C03C13/04 ,  G02B6/02 ,  G02B6/10 ,  G02B6/00

CPC分类号： C03C13/046 ,  G02B6/02 ,  G02B6/102

摘要： A glass composition comprises an oxyfluoride glass comprising silicon, a divalent metal, a monovalent metal, oxygen, and fluorine, satisfying requirements: (1) the silicon is present in an amount of 40% or more and 75% or less based on total number of cations; (2) the divalent metal is present in an amount of 30% or less based on total number of cations; (3) the monovalent metal is present in an amount of 18% ore more and 60% or less based on total number of cations; and (4) the fluorine is present in an amount of below 20% based on total amount of anions. An optical fiber comprises a clad made of the glass composition and a core made of a silicate glass comprising silicon dioxide, a divalent metal compound, and a monovalent metal compound in which (9) the clad glass contains more SiO.sub.2 than the core or (10) the clad glass contains fluoride(s) of the divalent metal and/or the monovalent metal.

摘要翻译： 玻璃组合物包含含有硅，二​​价金属，一价金属，氧和氟的氟氧化物玻璃，满足要求：（1）基于总数，硅的含量为40％以上且75％以下 的阳离子; （2）二价金属以基于阳离子总数的30％以下的量存在; （3）基于阳离子总数，单价金属的存在量为18％以上，60％以下。 和（4）基于阴离子的总量，氟以低于20％的量存在。 光纤包括由玻璃组合物制成的包层和由包含二氧化硅，二价金属化合物和一价金属化合物的硅酸盐玻璃制成的芯，其中（9）包覆玻璃含有比芯更多的SiO 2或（10 ）复合玻璃中含有二价金属和/或一价金属的氟化物。

公开(公告)号：US5059475A

公开(公告)日：1991-10-22

申请号：US545874

申请日：1990-06-29

申请人： Cheng-ko J. Sun ,  Shigeki Sakaguchi ,  Tadashi Miyashita

发明人： Cheng-ko J. Sun ,  Shigeki Sakaguchi ,  Tadashi Miyashita

IPC分类号： G02B6/122 ,  C03B20/00 ,  G02B6/13 ,  G02B6/132 ,  H01L27/15

CPC分类号： G02B6/132 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/31504 ,  Y10T428/31663

摘要： An integrated optoelectrical circuit is described. An apparatus and method are disclosed whereby planar optical waveguides are formed on Al.sub.2 O.sub.3, other ceramics, silicon, silica, and other glass substrates that are thin film wired. An interface coating of silicon or silicon dioxide is applied to a surface of the thin film wired substrates using a low temperature deposition process such as sputtering or chemical vapor deposition. Glass cladding and core layers are deposited onto the thin film coating using a flame hydrolysis deposition technique. With this invention, channel waveguides and integrated optical circuits can be formed on a common substrate with electronic IC chips.

摘要翻译： 描述了集成的光电路。 公开了一种装置和方法，其中在Al 2 O 3，其它陶瓷，硅，二氧化硅和其它薄膜布线的玻璃基板上形成平面光波导。 使用诸如溅射或化学气相沉积的低温沉积工艺将硅或二氧化硅的界面涂层施加到薄膜有线衬底的表面。 使用火焰水解沉积技术将玻璃包层和芯层沉积在薄膜涂层上。 利用本发明，可以在具有电子IC芯片的公共基板上形成通道波导和集成光电路。

公开(公告)号：US20070140636A1

公开(公告)日：2007-06-21

申请号：US10575564

申请日：2004-10-13

申请人： Toru Tanaka ,  Hidehisa Nanai ,  Yuji Yamamoto ,  Motoyasu Nishimura ,  Shigeki Sakaguchi

发明人： Toru Tanaka ,  Hidehisa Nanai ,  Yuji Yamamoto ,  Motoyasu Nishimura ,  Shigeki Sakaguchi

IPC分类号： G02B6/10

CPC分类号： G02B6/122 ,  G02B6/12002 ,  G02B6/125 ,  G02B2006/12176

摘要： The present invention relates to a multichannel optical path changing device that is constituted of resin optical waveguides and mirrors and that changes a direction of an optical path. This device has monolithically formed cores having a mirror therebetween and optical path directions changed, and has multichannel cores simultaneously formed under a condition that their positional relationship is maintained. This device can be produced by a first or second method. The first method comprises steps of forming a parallelepiped block on a substrate by a cladding resin; forming a film of a core layer to cover the block by a core resin; and simultaneously forming cores having an optical path direction rectangularly changed, by selectively etching the core layer and the block. The second method comprises steps of forming a film of a core layer on a substrate by a resin; and simultaneously forming a plurality of cores having an optical path rectangularly changed, by selectively etching the core layer, under a condition that their positional relationship is maintained.

摘要翻译： 本发明涉及由树脂光波导和反射镜构成并改变光路方向的多通道光路改变装置。 该装置具有在其间具有反射镜并且光路方向改变的单片成形芯，并且在保持它们的位置关系的条件下同时形成多通道芯。 该装置可以通过第一种或第二种方法制造。 第一种方法包括通过包覆树脂在基底上形成平行六面体块的步骤; 通过芯树脂形成芯层的膜以覆盖块; 并且通过选择性地蚀刻芯层和块，同时形成光路方向的矩形变化的芯。 第二种方法包括通过树脂在基底上形成芯层的膜的步骤; 并且通过在保持其位置关系的条件下选择性地蚀刻芯层，同时形成具有矩形变化的光路的多个芯。

公开(公告)号：US06750320B2

公开(公告)日：2004-06-15

申请号：US10078265

申请日：2002-02-20

申请人： Yoshihiro Moroi ,  Hidehisa Nanai ,  Yuji Yamamoto ,  Shigeki Sakaguchi

发明人： Yoshihiro Moroi ,  Hidehisa Nanai ,  Yuji Yamamoto ,  Shigeki Sakaguchi

IPC分类号： B32B2700

CPC分类号： B29C41/003 ,  B29C41/12 ,  B29C67/246 ,  B29K2079/08 ,  B29K2105/0073 ,  B29L2011/00 ,  Y10T428/31721

摘要： A process for producing a polyimide platy object includes (a) providing a solution containing a solvent and a solute (i.e., a polyimide precursor or polyimide); (b) pouring the solution onto a supporting member; (c) removing a portion of the solvent from the solution at a first temperature lower than boiling point of the solvent, thereby forming a precursory platy object thereon, the precursory platy object having a self-supporting property and a first surface in contact with the supporting member and a second surface away therefrom and a first content of the solvent at the first surface and a second content (less than the first content by 2-10 wt %) of the solvent at the second surface; and (d) detaching the precursory platy object therefrom; and (e) heating the precursory platy object at a second temperature higher than boiling point of the solvent and is lower than decomposition temperature of the polyimide.

摘要翻译： 制备聚酰亚胺板状物体的方法包括（a）提供含有溶剂和溶质（即聚酰亚胺前体或聚酰亚胺）的溶液; （b）将溶液倾倒到支撑构件上; （c）在低于溶剂沸点的第一温度下从溶液中除去一部分溶剂，从而在其上形成前体片状物体，所述前体片状物体具有自支撑性质和与所述第一表面接触的第一表面 支撑构件和离开其的第二表面和第一表面处的溶剂的第一含量和第二表面处的溶剂的第二含量（小于第一含量2-10重量％）; 和（d）从其中分离前体片状物体; 和（e）在高于溶剂沸点的第二温度下加热前体片状物体，并且低于聚酰亚胺的分解温度。

公开(公告)号：USD430822S

公开(公告)日：2000-09-12

申请号：US111496

申请日：1999-09-30

申请人： Shigeki Sakaguchi ,  Kenji Tamura

设计人： Shigeki Sakaguchi ,  Kenji Tamura

公开(公告)号：US20100294550A1

公开(公告)日：2010-11-25

申请号：US12810415

申请日：2008-12-09

申请人： Akio Furusawa ,  Shigeki Sakaguchi ,  Kenichiro Suetsugu

发明人： Akio Furusawa ,  Shigeki Sakaguchi ,  Kenichiro Suetsugu

IPC分类号： H05K1/02 ,  C22C12/00

CPC分类号： C22C12/00 ,  B23K35/264 ,  B23K2101/36 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2924/0001 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01032 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2924/00012

摘要： A bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge and 89.3 to 97.98% by weight of Bi has heat resistance of up to 275° C. and superior wettability, and a bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge, 0.02 to 0.11% by weight of Ni and 89.19 to 97.96% by weight of Bi has more superior heat resistance.

摘要翻译： 含有2〜10.5重量％的Cu，0.02〜0.2重量％的Ge和89.3〜97.98重量％的Bi的粘合材料具有高达275℃的耐热性和优异的润湿性，以及含有2 至10.5重量％的Cu，0.02〜0.2重量％的Ge，0.02〜0.11重量％的Ni和89.19〜97.96重量％的Bi具有更优异的耐热性。

公开(公告)号：US06335223B1

公开(公告)日：2002-01-01

申请号：US09339422

申请日：1999-06-24

申请人： Kouji Takada ,  Masami Yokozawa ,  Hiroyoshi Yoshida ,  Shigeki Sakaguchi

发明人： Kouji Takada ,  Masami Yokozawa ,  Hiroyoshi Yoshida ,  Shigeki Sakaguchi

IPC分类号： H01L2144

CPC分类号： H01L21/565 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A lead frame used for a resin-sealed semiconductor device includes a die-mount portion on which a semiconductor chip rests; and a plurality of leads arranged along a common portion of the lead frame. The plurality of leads include at least one adjusting lead, and the adjusting lead has a length that is less than the others of the plurality of leads such that a tip of the adjusting lead is sufficiently proximate to an outer peripheral surface of a resin-seal body to prevent resin flash during a formation of the semiconductor device and to allow the adjusting lead to be removed after the resin-seal body is formed over a portion of the lead frame.

摘要翻译： 用于树脂密封半导体器件的引线框架包括半导体芯片所在的管芯安装部分; 以及沿引线框架的公共部分布置的多个引线。 多个引线包括至少一个调节引线，并且调节引线的长度小于多个引线中的其他引线的长度，使得调节引线的尖端足够靠近树脂密封件的外周表面 在树脂密封体形成在引线框架的一部分上之后，防止树脂在半导体器件形成过程中发生闪光并允许调整引线被去除。

公开(公告)号：USD333641S

公开(公告)日：1993-03-02

申请号：US648429

申请日：1991-01-24

申请人： Shigeki Sakaguchi ,  Nobuyuki Shiwa ,  Keiji Arai

设计人： Shigeki Sakaguchi ,  Nobuyuki Shiwa ,  Keiji Arai

公开(公告)号：US4351657A

公开(公告)日：1982-09-28

申请号：US233476

申请日：1981-02-11

申请人： Takao Kimura ,  Shigeki Sakaguchi ,  Hisao Takata

发明人： Takao Kimura ,  Shigeki Sakaguchi ,  Hisao Takata

IPC分类号： C03C25/10 ,  C03C25/12 ,  G02B6/44 ,  C03B37/025 ,  C03C25/02

CPC分类号： C03C25/12 ,  C03C25/106

摘要： In a process for preparing optical fibers, an optical fiber preform is heated and softened to be drawn at a high speed into an optical fiber. The optical fiber is passed through a plastic pipe of a thermoplastic resin. As the optical fiber is passed through the plastic pipe, the lower part of the plastic pipe is gradually inserted into a heating unit to be uniformly heated. The heated plastic pipe is softened and is coated over the optical fiber.

摘要翻译： 在制备光纤的过程中，光纤预制件被加热并软化，以高速拉伸成光纤。 光纤通过热塑性树脂的塑料管。 当光纤通过塑料管时，塑料管的下部逐渐插入加热单元以均匀加热。 加热的塑料管软化并涂覆在光纤上。

公开(公告)号：US08227090B2

公开(公告)日：2012-07-24

申请号：US12302157

申请日：2007-05-18

申请人： Akio Furusawa ,  Kenichiro Suetsugu ,  Shigeki Sakaguchi ,  Kimiaki Nakaya

发明人： Akio Furusawa ,  Kenichiro Suetsugu ,  Shigeki Sakaguchi ,  Kimiaki Nakaya

IPC分类号： B32B15/04

CPC分类号： H05K3/3463 ,  B23K35/264 ,  C22C12/00 ,  Y10T428/12681 ,  Y10T428/31678

摘要： A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and 0.02 to 0.2 wt % Ge.

摘要翻译： 熔融温度为270℃以上且不含铅的接合材料成本低廉。 电子元件和电子部件的电极使用包含含有Bi作为主要成分并且含有0.2〜0.8重量％的Cu和0.02〜0.2重量％的Ge的合金的接合材料接合。