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35 条记录 (耗时 0.031 秒)

    SOLDERING APPARATUS AND SOLDERING METHOD
    4.
    发明申请
    SOLDERING APPARATUS AND SOLDERING METHOD 有权
    焊接设备和焊接方法

    公开(公告)号：US20090166398A1

    公开(公告)日：2009-07-02

    申请号：US12337826

    申请日：2008-12-18

    申请人： Arata Kishi ,  Kimiaki Nakaya ,  Kenichiro Suetsugu

    发明人： Arata Kishi ,  Kimiaki Nakaya ,  Kenichiro Suetsugu

    IPC分类号： B23K1/20

    CPC分类号： B23K3/0653 ,  B23K2101/36 ,  H05K3/227 ,  H05K3/3468 ,  H05K3/3489 ,  H05K2203/081 ,  H05K2203/082

    摘要： A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.

    摘要翻译： 焊接装置具有输送电子电路板的输送机，将具有水作为溶​​剂的助熔剂的助焊剂输送到要焊接的电子电路板的表面，加热电子电路板的第一加热装置，除水 去除附着在电子电路板上的水的装置，加热电子电路板以将电子电路板维持在焊剂发挥其激活作用的温度的第二加热装置，熔融焊料附着到 电子电路板和冷却器。 除水装置包括具有将气体吹向电子部件配置面的第一夹具的气体吹出部，以及具有从要被焊接的表面吸水的第二夹具的拉拔部。

    Soldering apparatus and soldering method
    5.
    发明授权
    Soldering apparatus and soldering method 有权
    焊接设备和焊接方法

    公开(公告)号：US07780057B2

    公开(公告)日：2010-08-24

    申请号：US12337826

    申请日：2008-12-18

    申请人： Arata Kishi ,  Kimiaki Nakaya ,  Kenichiro Suetsugu

    发明人： Arata Kishi ,  Kimiaki Nakaya ,  Kenichiro Suetsugu

    IPC分类号： B23K1/08

    CPC分类号： B23K3/0653 ,  B23K2101/36 ,  H05K3/227 ,  H05K3/3468 ,  H05K3/3489 ,  H05K2203/081 ,  H05K2203/082

    摘要： A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.

    摘要翻译： 焊接装置具有输送电子电路板的输送机，将具有水作为溶​​剂的助熔剂的助焊剂输送到要焊接的电子电路板的表面，加热电子电路板的第一加热装置，除水 去除附着在电子电路板上的水的装置，加热电子电路板以将电子电路板维持在焊剂发挥其激活作用的温度的第二加热装置，熔融焊料附着到 电子电路板和冷却器。 除水装置包括具有将气体吹向电子部件配置面的第一夹具的气体吹出部，以及具有从要被焊接的表面吸水的第二夹具的拉拔部。

    FLOW SOLDERING APPARATUS AND FLOW SOLDERING METHOD
    6.
    发明申请
    FLOW SOLDERING APPARATUS AND FLOW SOLDERING METHOD 失效
    流动焊接装置和流动焊接方法

    公开(公告)号：US20110031297A1

    公开(公告)日：2011-02-10

    申请号：US12867340

    申请日：2009-04-10

    申请人： Kimiaki Nakaya ,  Kenichiro Suetsugu ,  Arata Kishi

    发明人： Kimiaki Nakaya ,  Kenichiro Suetsugu ,  Arata Kishi

    IPC分类号： B23K1/19 ,  B23K31/12 ,  B23K1/20

    CPC分类号： H05K3/3468 ,  B23K3/0653 ,  H05K3/3447 ,  H05K3/3489 ,  H05K2201/10151 ,  H05K2203/0126 ,  H05K2203/111 ,  H05K2203/163

    摘要： The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.

    摘要翻译： 本发明提供一种能够抑制焊接缺陷的发生的流焊装置，即使无电弧焊或低VOC焊剂施加到电子电路基板。 换句话说，根据本发明的流动焊接装置包括：含水量传感器，用于测量基板的表面的残留含水量; 以及监测装置，通过使用从含水量传感器测定的残留水分含量获取的基板的表面的残留水分值，根据残留水分含量的相关性来判断焊接质量是否满意 样品基板的表面的值和样品基板的通孔的残留水含量值，如先前通过使用多个基板样品所获得的。

    Flow soldering apparatus and flow soldering method using a water content sensor
    7.
    发明授权
    Flow soldering apparatus and flow soldering method using a water content sensor 失效
    流动焊接装置和使用含水量传感器的流焊方法

    公开(公告)号：US08132707B2

    公开(公告)日：2012-03-13

    申请号：US12867340

    申请日：2009-04-10

    申请人： Kimiaki Nakaya ,  Kenichiro Suetsugu ,  Arata Kishi

    发明人： Kimiaki Nakaya ,  Kenichiro Suetsugu ,  Arata Kishi

    IPC分类号： B23K13/08 ,  B23K1/08 ,  B23K31/12 ,  B23K31/02

    CPC分类号： H05K3/3468 ,  B23K3/0653 ,  H05K3/3447 ,  H05K3/3489 ,  H05K2201/10151 ,  H05K2203/0126 ,  H05K2203/111 ,  H05K2203/163

    摘要： The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.

    摘要翻译： 本发明提供一种能够抑制焊接缺陷的发生的流焊装置，即使无电弧焊或低VOC焊剂施加到电子电路基板。 换句话说，根据本发明的流动焊接装置包括：含水量传感器，用于测量基板的表面的残留含水量; 以及监测装置，通过使用从含水量传感器测定的残留水分含量获取的基板的表面的残留水分值，根据残留水分含量的相关性来判断焊接质量是否满意 样品基板的表面的值和样品基板的通孔的残留水含量值，如先前通过使用多个基板样品所获得的。

    Soldering material and electronic component assembly
    9.
    发明授权
    Soldering material and electronic component assembly 有权
    焊料和电子元器件组装

    公开(公告)号：US08598464B2

    公开(公告)日：2013-12-03

    申请号：US12999411

    申请日：2010-04-19

    申请人： Shigeaki Sakatani ,  Akio Furusawa ,  Kenichiro Suetsugu ,  Taichi Nakamura

    发明人： Shigeaki Sakatani ,  Akio Furusawa ,  Kenichiro Suetsugu ,  Taichi Nakamura

    IPC分类号： H05K1/16 ,  B23K31/00 ,  C22C13/02

    CPC分类号： H05K3/3463 ,  B23K35/262 ,  B23K2101/36 ,  B32B15/01 ,  C22C13/00 ,  H05K3/3442 ,  H05K2201/10992 ,  Y02P70/613

    摘要： A solder material includes 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part of an electronic component is connected to a copper-containing electrode land of a substrate by using this solder material, a part having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound can be rapidly grown from the electrode land and the electrode part to form a strong blocking structure.

    摘要翻译： 焊料材料包括1.0-4.0重量％的Ag，4.0-6.0重量％的In，0.1-1.0重量％的Bi，1重量％以下（不包括0重量％）的1个或 选自由Cu，Ni，Co，Fe和Sb组成的组中的更多元素，以及Sn的剩余部分。 当通过使用该焊料将电子部件的含铜电极部分连接到基板的含铜电极焊盘时，可以在焊料连接部分中形成具有优异的应力松弛特性的部分， Sn金属间化合物可以从电极焊盘和电极部分快速生长，形成强阻挡结构。