公开(公告)号：US4868714A

公开(公告)日：1989-09-19

申请号：US175195

申请日：1988-03-30

申请人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda ,  Yasushi Kasatani

发明人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda ,  Yasushi Kasatani

IPC分类号： B42D15/02 ,  B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  G11C5/00 ,  H01R13/453

CPC分类号： H01R13/4534 ,  G06K19/077

摘要： An IC card having a package in which a semiconductor device is accommodated, a plurality of electrode terminals disposed on a surface of the package near the front end thereof in the direction in which the IC card is inserted into a connector in an external device, a shutter supported on the surface of a front portion of the package for exposing and covering the electrode terminals, the shutter having a width smaller than that of the package as measured in the direction perpendicular to the direction of insertion into the connector, a pair of guide projections formed on the shutter at both-sides thereof to extend into the package, the guide projections functioning to open the shutter by abutting against a pair of shutter receiving pins disposed in the insertion hole of the connector when the package is inserted into the connector, and a pair of guide grooves adapted to guide the guide projections, the guide grooves being formed in both sides of the front portion of the surface of the package to be within the side surfaces thereof, the guide grooves extending from the front side of the package in the insertion direction thereof.

摘要翻译： 具有容纳半导体装置的封装的IC卡，在IC卡插入到外部装置的连接器的方向上，在其前端附近设置在封装体的表面附近的多个电极端子， 支撑在封装的前部表面上的遮光板用于曝光和覆盖电极端子，该遮板的宽度小于在垂直于插入连接器的方向的方向上测量的包装的宽度;一对导向件 突起形成在挡板的两侧以延伸到包装中，引导突起用于当包装被插入连接器时通过抵靠设置在连接器的插入孔中的一对挡板接收销来打开闸门， 以及适于引导引导突起的一对引导槽，所述引导槽形成在所述p的表面的前部的两侧 所述引导槽沿着所述封装的插入方向从所述封装的前侧延伸。

公开(公告)号：US4924077A

公开(公告)日：1990-05-08

申请号：US154319

申请日：1988-02-10

申请人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

发明人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

IPC分类号： G06K19/07 ,  B42D15/10 ,  G06K19/077 ,  G11C5/00

CPC分类号： G06K19/07743

摘要： A memory card having: a card-like package; a semiconductor module disposed within the package; a plurality of electrode terminals mounted on the package for external electrical connection of the semiconductor module in the package to an external circuit; a metallic shutter disposed on the package and movable between an open position in which the electrode terminals are exposed for the electrical connection and a closed position in which the electrode terminals are covered; and an insulating layer formed on a surface of the shutter which faces the electrodes.

摘要翻译： 一种存储卡，具有：卡状包装; 设置在所述封装内的半导体模块; 安装在所述封装上的多个电极端子，用于将所述封装中的半导体模块外部电连接到外部电路; 金属快门，其设置在所述封装上，并且在所述电极端子暴露于所述电连接的打开位置和所述电极端子被覆盖的关闭位置之间可移动; 以及形成在快门面向电极的表面上的绝缘层。

公开(公告)号：US4868713A

公开(公告)日：1989-09-19

申请号：US175277

申请日：1988-03-30

申请人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

发明人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  G06K19/077 ,  G11C5/00

CPC分类号： G06K19/077 ,  G11C5/00

摘要： A memory card comprises a plastic outer package which houses a semiconductor device and electrical connector. The outer package comprises a plurality of package sections which are stacked atop one another and bonded together along connecting surfaces formed on the outer peripheries of the package sections. The connecting surface of one package section of each pair of adjoining package sections has a projecting engaging portion formed thereon, and the connecting surface of the other package section of the pair of adjoining package sections has a recessed engaging portion formed therein which engages with the projecting engaging portion of the adjoining package section.

摘要翻译： 存储卡包括容纳半导体器件和电连接器的塑料外包装。 外包装包括多个包装部分，这些包装部分彼此堆叠并且沿着形成在包装部分的外周上的连接表面粘合在一起。 每对相邻包装部分的一个包装部分的连接表面具有形成在其上的突出接合部分，并且一对相邻包装部分中的另一个包装部分的连接表面具有形成在其中的凹入的接合部分， 相邻的包装部分的接合部分。

公开(公告)号：US4890197A

公开(公告)日：1989-12-26

申请号：US175212

申请日：1988-03-30

申请人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

发明人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

IPC分类号： B42D15/10 ,  G06K19/077 ,  G11C5/00 ,  H05K5/02

CPC分类号： H05K5/0269 ,  G06K19/077

摘要： A memory card comprises a plastic outer package which houses a semiconductor device and an electrical connector. The outer package comprises a plurality of package sections which are stacked atop one another and bonded together along connecting surfaces formed on the outer peripheries of the package sections. At least one of the connecting surface of each pair of adjoining package sections has an overflow groove for bonding agent formed therein which prevents the bonding agent from being forced to the outside of the outer package when the package sections are bonded together.

摘要翻译： 存储卡包括容纳半导体器件和电连接器的塑料外包装。 外包装包括多个包装部分，这些包装部分彼此堆叠并且沿着形成在包装部分的外周上的连接表面粘合在一起。 每对相邻包装部分的连接表面中的至少一个具有用于在其中形成的粘合剂的溢流槽，当封装部分结合在一起时，防止粘合剂被迫到外部包装的外部。

公开(公告)号：US4789347A

公开(公告)日：1988-12-06

申请号：US154322

申请日：1988-02-10

申请人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

发明人： Toshinobu Banjo ,  Yasuhiro Murasawa ,  Shigeo Onoda

IPC分类号： G06K19/07 ,  B42D15/10 ,  G11C5/00 ,  H01R13/447 ,  H01R13/648 ,  H01R13/44

CPC分类号： H01R13/447 ,  H01R13/648

摘要： A memory card having: a card-like package; a semiconductor module disposed within the package; a plurality of electrode terminals mounted on the package for allowing an external electrical connection of the semiconductor module in the package to an external circuit, the electrode terminals including an earth electrode terminal; a metallic shutter disposed on the package and movable between an open position in which the electrode terminals are exposed for the electrical connection and a closed position in which the electrode terminals are covered; an electrically conductive spring having one end electrically connected to the shutter and the other end secured to the package for biasing the shutter toward the closed position; and a conductor for electrically connecting the other end of the spring to the earth electrode terminal.

摘要翻译： 一种存储卡，具有：卡状包装; 设置在所述封装内的半导体模块; 安装在封装上的多个电极端子，用于允许封装中的半导体模块与外部电路的外部电连接，所述电极端子包括接地电极端子; 金属快门，其设置在所述封装上，并且在所述电极端子暴露于所述电连接的打开位置和所述电极端子被覆盖的关闭位置之间可移动; 导电弹簧，其一端电连接到闸门，另一端固定到封装件上，用于将闸板偏压到关闭位置; 以及用于将弹簧的另一端电连接到接地电极端子的导体。

公开(公告)号：US5521433A

公开(公告)日：1996-05-28

申请号：US408300

申请日：1995-03-22

申请人： Teru Hirata ,  Shigeo Onoda ,  Tetsuro Washida ,  Yasuhiro Murasawa

发明人： Teru Hirata ,  Shigeo Onoda ,  Tetsuro Washida ,  Yasuhiro Murasawa

IPC分类号： B42D15/10 ,  G06K19/02 ,  G06K19/077 ,  H01L23/12 ,  H01L23/538 ,  H01L25/00 ,  H05K1/03 ,  H05K1/05 ,  H01L23/02 ,  H01L23/053

CPC分类号： G06K19/07728 ,  G06K19/02 ,  G06K19/077 ,  G06K19/0773 ,  H01L23/5388 ,  H05K1/0373 ,  H01L2924/0002 ,  H05K1/036 ,  H05K1/056 ,  H05K2201/0215 ,  H05K2201/0281

摘要： An IC card includes a substrate having a metal fiber resin material layer made of a mixture of a resin and metal fibers and a conductive pattern. The conductive pattern and the metal fiber resin material layer are electrically insulated from each other by a resist film. Heat radiation and mechanical strength of the IC card are enhanced.

摘要翻译： IC卡包括具有由树脂和金属纤维的混合物制成的金属纤维树脂材料层和导电图案的基板。 导电图案和金属纤维树脂材料层通过抗蚀剂膜彼此电绝缘。 提高了IC卡的散热和机械强度。

公开(公告)号：US5982624A

公开(公告)日：1999-11-09

申请号：US907054

申请日：1997-08-06

申请人： Shigeo Onoda ,  Tomomi Morii ,  Makoto Omori ,  Jun Ohbuchi ,  Yasuhiro Murasawa

发明人： Shigeo Onoda ,  Tomomi Morii ,  Makoto Omori ,  Jun Ohbuchi ,  Yasuhiro Murasawa

IPC分类号： B42D15/10 ,  G06F1/18 ,  G06K19/077 ,  H05K7/14

CPC分类号： G06K19/07743

摘要： In an IC card, a frame for connecting a board for mounting electronics components is covered by upper and lower panels. A main connector for connecting the IC card to a computer is provided at one end of the frame. Further, one or more subconnectors to be connected to external systems are provided on the board and the pins of the subconnectors extend towards openings in the upper panel. The subconnectors are supported between the board and the upper panel. Thus, various kinds of subconnectors for various functions can be used with the IC card. In a modified example, a subconnector is provided opposite the main connector on the upper panel, and the pins thereof extend in a direction parallel to the board.

摘要翻译： 在IC卡中，用于连接用于安装电子部件的板的框架被上下面板覆盖。 用于将IC卡连接到计算机的主连接器设置在框架的一端。 此外，要连接到外部系统的一个或多个子连接器设置在板上，并且子连接器的销延伸到上面板中的开口。 子连接器支持在板和上面板之间。 因此，用于各种功能的各种子连接器可以与IC卡一起使用。 在修改示例中，在上面板上与主连接器相对设置子连接器，并且其引脚沿与板平行的方向延伸。

公开(公告)号：US5886874A

公开(公告)日：1999-03-23

申请号：US634930

申请日：1996-04-19

申请人： Shigeo Onoda ,  Katsunori Ochi ,  Yasuhiro Murasawa ,  Tetsuro Washida

发明人： Shigeo Onoda ,  Katsunori Ochi ,  Yasuhiro Murasawa ,  Tetsuro Washida

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K1/14 ,  H05K1/18 ,  H05K5/02

CPC分类号： H05K5/0269 ,  H05K1/144 ,  H05K1/189 ,  Y10S439/946

摘要： IC card of the present invention consists of a frame including a rectangular bottom plate and a U-shaped side wall along the three edges of the bottom plate; a connector fixed to the open side of the frame with the U-shaped side wall; a board module at least one including printed-circuit boards with electronic components mounted thereon, combined with the connector, and inserted in the frame; and a metal panel for sealing off the board module inside the frame with the connector fixed thereto.

摘要翻译： 本发明的IC卡由沿着底板的三个边缘的矩形底板和U形侧壁构成， 连接器，其与U形侧壁固定在框架的开口侧; 板模块，其至少包括安装有电子部件的印刷电路板，与连接器组合并插入框架中; 以及金属板，用于将固定在其上的连接器的框架内的板模块密封。

公开(公告)号：US5952713A

公开(公告)日：1999-09-14

申请号：US577541

申请日：1995-12-22

申请人： Kenichi Takahira ,  Jun Ohbuchi ,  Yasuhiro Murasawa

发明人： Kenichi Takahira ,  Jun Ohbuchi ,  Yasuhiro Murasawa

IPC分类号： G06K19/077 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H01L23/02 ,  H01L23/29 ,  H01L23/34

CPC分类号： G06K19/07718 ,  G06K19/0722 ,  G06K19/077 ,  G06K19/07779 ,  H01L24/97 ,  H05K3/284 ,  H05K3/321 ,  H05K3/4046 ,  H05K3/4652 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H05K1/189 ,  H05K2201/0195 ,  H05K2201/10303 ,  H05K2203/0191 ,  H05K2203/063 ,  H05K2203/1453 ,  H05K3/386 ,  H05K3/4626 ,  H05K3/4655

摘要： A non-contact IC card and a method and apparatus for manufacturing the IC card. The IC card has a small thickness and is manufactured at a low cost, automatically. Electronic parts are mounted on a circuit pattern on a surface of a resin sheet. A filling resin covers the elcetronic parts and fills gaps between them. An electronically insulating plastic material on the filling resin wraps around the filling resin, contacting its side surfaces and saide surfaces of the resin sheet. The plastic material provides added protection to the electronic parts. In a method of manufacturing the non-contact IC card, the laminated structure of the resin sheet, filling resin, and plastic material is subjected to two sequential severing steps. In the first severing step, only the resin sheet and the filling resin are severed, generally in the shape of an IC card that is to be completed. The plastic material is not severed and extends over side surfaces of the resin sheet and filling that are produced in the first cutting step. The plastic material is severed so that it extends beyond the side surfaces of the resin filling material and resin sheet. Finally, the overhanging parts to the resin material are deformed and bent to cover and protect the side surfaces of the resin sheet and the filling resin.

摘要翻译： 一种非接触式IC卡及其制造方法和装置。 IC卡的厚度很小，并且自动以低成本制造。 电子部件安装在树脂片的表面上的电路图案上。 填充树脂覆盖电子部件并填充它们之间的间隙。 填充树脂上的电子绝缘塑料材料包裹在填充树脂周围，与树脂片的侧表面和边缘表面接触。 塑料材料为电子零件提供了额外的保护。 在制造非接触式IC卡的方法中，树脂片，填充树脂和塑料材料的叠层结构经受两个顺序的切断步骤。 在第一切断步骤中，只有树脂片和填充树脂被切断，通常是待完成的IC卡的形状。 塑料材料不被切断并且在树脂片的侧表面和在第一切割步骤中产生的填充物中延伸。 塑料材料被切断，使其延伸超出树脂填充材料和树脂片的侧表面。 最后，向树脂材料的突出部分变形并弯曲以覆盖和保护树脂片和填充树脂的侧表面。

公开(公告)号：US5086336A

公开(公告)日：1992-02-04

申请号：US516127

申请日：1990-04-27

申请人： Yasuhiro Murasawa

发明人： Yasuhiro Murasawa

IPC分类号： G06K19/077

CPC分类号： G06K19/077

摘要： A semiconductor device card includes a frame on which a semiconductor module may be mounted and a protection panel adhered to the frame. The frame includes pairs of offset grooves along each of two opposed sides and the protection panel includes pairs of offset flanges along each of two opposed edges of the panel. The protection panel flanges are inserted into the grooves in the frame and adhered to the frame in the grooves. Thus, a large attached area for ensuring good adhesive strength between the frame and the protection panel is achieved.

摘要翻译： 半导体器件卡包括可以安装半导体模块的框架和粘附到框架的保护面板。 框架包括沿着两个相对的侧面中的每一个的成对的偏移凹槽，并且保护面板包括沿面板的两个相对边缘中的每一个的一对偏移凸缘。 保护面板凸缘插入框架中的凹槽中并粘附到凹槽中的框架上。 因此，实现了用于确保框架和保护面板之间良好粘合强度的大附接区域。