公开(公告)号：US5719746A

公开(公告)日：1998-02-17

申请号：US587928

申请日：1996-01-17

申请人： Jun Ohbuchi ,  Shigeo Onoda ,  Katsunori Ochi ,  Makoto Omori ,  Tetsuro Washida ,  Kiyotaka Nishino

发明人： Jun Ohbuchi ,  Shigeo Onoda ,  Katsunori Ochi ,  Makoto Omori ,  Tetsuro Washida ,  Kiyotaka Nishino

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K5/02 ,  H05K1/14

CPC分类号： H05K5/026 ,  G06K19/07745 ,  H01L2924/0002

摘要： An IC card comprises a module with an electric circuit and two panels adhered to each other to cover the module between them. The two panels are adhered with an adhesive with a sufficient adhesion strength and seals the module with no path of air to the outside of the IC card. Airtight sealing of the IC card in realized in various ways. For example, a groove having a varying width is provided in one of the panels for applying an adhesive, while a groove engaging to the groove is provided in the other of the panels. When the two panels are adhered to each other, gas channels may be formed in the groove at portions with narrower widths, while an adhesive in the groove at portions with wider widths fills the gas channels due to viscosity. In another way, a protrusion provided in one of the panels has an edge opposite to a groove provided in the other of the panels. Thus, the groove is kept air-tight. In a different way, an adhesive having a high viscosity at curing temperature is used. In a still different way, all the space inside the IC card is filled, or a sufficient amount of an adhesive is filled in a space between the two panels around a peripheral thereof. In a further way, the panels are adhered in a thermostat. In a still further way, the panels are adhered with melting at a peripheral thereof.

摘要翻译： IC卡包括具有电路的模块和彼此粘附的两个面板以覆盖它们之间的模块。 两个面板用粘合剂粘附，具有足够的粘附强度，并将模块没有空气通道密封到IC卡的外部。 IC卡的密封密封以各种方式实现。 例如，具有变化的宽度的凹槽设置在用于施加粘合剂的一个面板中，而在另一个面板中设置与凹槽接合的凹槽。 当两个板彼此粘合时，可以在槽中形成具有较窄宽度的部分的气体通道，而具有较宽宽度的部分中的沟槽中的粘合剂由于粘度而填充气体通道。 另一方面，设置在一个面板中的突起具有与设置在另一个面板中的凹槽相对的边缘。 因此，凹槽保持气密。 以不同的方式，使用在固化温度下具有高粘度的粘合剂。 以不同的方式，填充IC卡内的所有空间，或者在两个面板周围的周围的空间中填充足够量的粘合剂。 另一方面，面板被粘附在恒温器中。 在另一方面，面板在其周边处熔化粘附。

公开(公告)号：US5774339A

公开(公告)日：1998-06-30

申请号：US759002

申请日：1996-12-02

申请人： Jun Ohbuchi ,  Hiroshi Miura ,  Kiyotaka Nishino ,  Shigeo Onoda ,  Tetsuro Washida ,  Makoto Omori

发明人： Jun Ohbuchi ,  Hiroshi Miura ,  Kiyotaka Nishino ,  Shigeo Onoda ,  Tetsuro Washida ,  Makoto Omori

IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H05K5/02 ,  H05K1/14

CPC分类号： G06K19/07749 ,  G06K19/077 ,  H05K5/026

摘要： An IC card includes a first cover including a first flat panel portion and a first upright wall portion formed therein adjacent a perimeter of the flat panel portion so as to extend transverse to the flat panel portion, and a second cover including a second flat panel portion and a second upright wall portion formed therein adjacent a perimeter of the flat panel portion so as to extend transverse to the flat panel portion. The first upright wall portion defines a chamber in cooperation with a portion of the first flat panel portion. The first and second covers are mated together with the first and second upright wall portions bonded together in a butt fashion.

摘要翻译： IC卡包括：第一盖，其包括第一平板部分和第一直立壁部分，第一直立壁部分形成在其中邻近平板部分的周边，以便横向于平板部分延伸，第二盖包括第二平板部分 以及形成在其中的与平板部分的周边相邻的第二直立壁部分，以横向于平板部分延伸。 第一直立壁部分与第一平板部分的一部分配合地限定一个室。 第一和第二盖与第一和第二直立壁部分配合在一起，并以对接的方式结合在一起。

公开(公告)号：US5912806A

公开(公告)日：1999-06-15

申请号：US772520

申请日：1996-12-24

申请人： Shigeo Onoda ,  Katsunori Ochi ,  Jun Ohbuchi ,  Makoto Omori

发明人： Shigeo Onoda ,  Katsunori Ochi ,  Jun Ohbuchi ,  Makoto Omori

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K5/02 ,  H05K1/14

CPC分类号： H05K5/0269 ,  G06K19/077 ,  Y10S439/946

摘要： An IC card (1) has a shape of a substantially flat rectangular parallelepiped. The IC card (1) has electronic devices (2) including integrated circuits, a substrate (3) and a frame (5) for supporting the electronic devices (2), a first panel (6c) covering the upper surface of the frame (5), and a second panel (6d) covering the lower surface of the frame (5). Hereupon, the first panel (6c) is directly mounted to the frame (5) in such a manner that each of the left and right end portions (15) of the first panel (6c) is bent twice in accordance with the outer surface of the frame (5) and further each of edges of the left and right end portions (15) is fastened to the lower surface of the frame (5).

摘要翻译： IC卡（1）具有基本平坦的长方体形状。 IC卡（1）具有包括集成电路的电子设备（2），用于支撑电子设备（2）的基板（3）和框架（5），覆盖框架的上表面的第一面板（6c） 5）和覆盖框架（5）的下表面的第二面板（6d）。 因此，第一面板（6c）以这样的方式直接安装到框架（5），使得第一面板（6c）的左端部和右端部部分（15）根据 框架（5）以及左端部和右端部部分（15）的每个边缘被紧固到框架（5）的下表面。

公开(公告)号：US5886874A

公开(公告)日：1999-03-23

申请号：US634930

申请日：1996-04-19

申请人： Shigeo Onoda ,  Katsunori Ochi ,  Yasuhiro Murasawa ,  Tetsuro Washida

发明人： Shigeo Onoda ,  Katsunori Ochi ,  Yasuhiro Murasawa ,  Tetsuro Washida

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K1/14 ,  H05K1/18 ,  H05K5/02

CPC分类号： H05K5/0269 ,  H05K1/144 ,  H05K1/189 ,  Y10S439/946

摘要： IC card of the present invention consists of a frame including a rectangular bottom plate and a U-shaped side wall along the three edges of the bottom plate; a connector fixed to the open side of the frame with the U-shaped side wall; a board module at least one including printed-circuit boards with electronic components mounted thereon, combined with the connector, and inserted in the frame; and a metal panel for sealing off the board module inside the frame with the connector fixed thereto.

摘要翻译： 本发明的IC卡由沿着底板的三个边缘的矩形底板和U形侧壁构成， 连接器，其与U形侧壁固定在框架的开口侧; 板模块，其至少包括安装有电子部件的印刷电路板，与连接器组合并插入框架中; 以及金属板，用于将固定在其上的连接器的框架内的板模块密封。

公开(公告)号：US6031278A

公开(公告)日：2000-02-29

申请号：US954732

申请日：1997-10-20

申请人： Shigeo Onoda ,  Katsunori Ochi ,  Jun Ohbuchi

发明人： Shigeo Onoda ,  Katsunori Ochi ,  Jun Ohbuchi

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L23/538 ,  H01L25/065 ,  H05K5/02 ,  H01L23/02

CPC分类号： H05K5/0269 ,  H01L23/5388 ,  H01L25/0652 ,  H01L2924/0002

摘要： An IC card, and manufacturing method thereof, are provided in which a pair of upper and lower metal panels are fixed to the top and bottom surfaces of a resin frame. Projections projecting upward or downward and having a given height are formed at a given distance from the outside edges of the frame. Cut-outs capable of fitting on the projections are provided on the metal panels, and the metal panels are assembled on the top and bottom surfaces of the frame with the cut-outs fitted on the corresponding projections. A portion of each projection is then deformed by pressing on the metal panels from above or below under a predetermined condition so that the metal panels are riveted to the frame.

摘要翻译： 提供一种IC卡及其制造方法，其中一对上金属板和下金属板固定在树脂框架的顶表面和底表面上。 从框架的外边缘以给定距离形成向上或向下突出并且具有给定高度的突出部。 在金属板上设有能够装配在突起上的切口，并且将金属板组装在框架的顶表面和底表面上，并将切口安装在相应的突出部上。 然后通过在预定条件下从上方或下方按压金属板而使每个突起的一部分变形，使得金属板铆接到框架上。

公开(公告)号：US5327010A

公开(公告)日：1994-07-05

申请号：US553459

申请日：1990-07-17

申请人： Takeshi Uenaka ,  Jun Ohbuchi ,  Shigeo Onoda ,  Makoto Omori ,  Hajime Maeda ,  Toru Tachikawa

发明人： Takeshi Uenaka ,  Jun Ohbuchi ,  Shigeo Onoda ,  Makoto Omori ,  Hajime Maeda ,  Toru Tachikawa

IPC分类号： G06K19/077 ,  H01L23/538 ,  H01L25/10 ,  H05K3/28 ,  H01L23/02 ,  G06K19/00 ,  H01L23/12

CPC分类号： H05K3/284 ,  G06K19/07745 ,  H01L23/5388 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/1627 ,  H01L2924/3511

摘要： An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.

摘要翻译： IC卡包括基板，安装在基板的至少一个主表面上的半导体器件和安装有安装有半导体器件的基板的壳体。 壳体包括框架和通过粘合剂层在框架的相对侧上结合到框架的面板。 防止半导体器件在面向半导体器件的粘合剂层上的位置处经由粘合剂层粘合到面板上。

公开(公告)号：US5994769A

公开(公告)日：1999-11-30

申请号：US669622

申请日：1996-06-24

申请人： Shigeo Onoda ,  Jun Ohbuchi ,  Makoto Omori

发明人： Shigeo Onoda ,  Jun Ohbuchi ,  Makoto Omori

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K5/02 ,  H05K7/14 ,  H01L23/02

CPC分类号： H05K5/0269 ,  H05K7/1461

摘要： An IC card that allows fixing the obverse and reverse metal panels to the plastic frame without using adhesion and allows to make conducting electrically between both the metal panels. The IC card 1 includes an electrical circuit board 3 in which electronic components 4 are incorporated, a connector 5 to be connected to an end portion of the electric circuit board, a frame 2 which constitutes an outer frame of the card and a pair of metal panels 6, 7 which cover an obverse and reverse sides of the card. A plurality of tongues 6c, projecting pieces 7c being able to engage with each other are provided on side edge portions of the metal panels 6,7 respectively, while, a plurality of slits into which the projecting pieces 7c of the lower metal panel 7 are to be pressed are provided in the frame 2, and, the projecting pieces 7c are pressed into the slits, also, corresponding tongues 6c of the upper metal panel 6 are engaged with the projecting pieces 7c respectively in a condition of being subject to elastic force of the metal panels.

摘要翻译： 一种IC卡，其允许将正面和反向金属板固定到塑料框架上而不使用粘合并允许在两个金属板之间进行导电。 IC卡1包括电子部件4并入的电路基板3，与电路基板的端部连接的连接器5，构成卡的外框的框架2和一对金属 面板6,7，其覆盖卡的正面和反面。 分别在金属板6,7的侧边缘部分上分别设有多个舌片6c，能够彼此接合的突出片7c，同时，多个狭缝，下金属板7的突出片7c 被压入设置在框架2中，并且突出片7c被压入狭缝中，上金属板6的相应的舌片6c也分别与突出片7c接合在受到弹力的状态 的金属面板。

公开(公告)号：US5982624A

公开(公告)日：1999-11-09

申请号：US907054

申请日：1997-08-06

申请人： Shigeo Onoda ,  Tomomi Morii ,  Makoto Omori ,  Jun Ohbuchi ,  Yasuhiro Murasawa

发明人： Shigeo Onoda ,  Tomomi Morii ,  Makoto Omori ,  Jun Ohbuchi ,  Yasuhiro Murasawa

IPC分类号： B42D15/10 ,  G06F1/18 ,  G06K19/077 ,  H05K7/14

CPC分类号： G06K19/07743

摘要： In an IC card, a frame for connecting a board for mounting electronics components is covered by upper and lower panels. A main connector for connecting the IC card to a computer is provided at one end of the frame. Further, one or more subconnectors to be connected to external systems are provided on the board and the pins of the subconnectors extend towards openings in the upper panel. The subconnectors are supported between the board and the upper panel. Thus, various kinds of subconnectors for various functions can be used with the IC card. In a modified example, a subconnector is provided opposite the main connector on the upper panel, and the pins thereof extend in a direction parallel to the board.

摘要翻译： 在IC卡中，用于连接用于安装电子部件的板的框架被上下面板覆盖。 用于将IC卡连接到计算机的主连接器设置在框架的一端。 此外，要连接到外部系统的一个或多个子连接器设置在板上，并且子连接器的销延伸到上面板中的开口。 子连接器支持在板和上面板之间。 因此，用于各种功能的各种子连接器可以与IC卡一起使用。 在修改示例中，在上面板上与主连接器相对设置子连接器，并且其引脚沿与板平行的方向延伸。

公开(公告)号：US5661636A

公开(公告)日：1997-08-26

申请号：US542165

申请日：1995-10-12

申请人： Shigeo Onoda ,  Jun Ohbuchi ,  Makoto Omori ,  Takeshi Uenaka ,  Tomomi Morii

发明人： Shigeo Onoda ,  Jun Ohbuchi ,  Makoto Omori ,  Takeshi Uenaka ,  Tomomi Morii

IPC分类号： G06K19/077 ,  G11B33/12 ,  G11B33/14 ,  G06F1/16 ,  H05K7/10

CPC分类号： G11B33/121 ,  G11B33/1493

摘要： An IC card with an on-board hard disk unit comprising a frame; a circuit board inside the frame; and a hard disk unit mounted on the circuit board. The IC card also has a metal front panel supported by the frame, and covering the entire IC card, including the hard disk unit. Thus, the outer surface of the IC card is made stronger, and the hard disk is protected from static electricity. The metal front panel includes a first portion where the IC card is relatively thin and a second, bulging portion where the IC card is relatively thick. The bulging portion accommodates the hard disk unit. The front panel may include a vent or mesh.

摘要翻译： 一种具有板载硬盘单元的IC卡，包括框架; 框架内的电路板; 以及安装在电路板上的硬盘单元。 IC卡还具有由框架支撑的金属前面板，并且覆盖包括硬盘单元的整个IC卡。 因此，IC卡的外表面变得更强，并且保护硬盘免受静电。 金属前面板包括IC卡相对较薄的第一部分和IC卡相对较厚的第二凸起部分。 凸出部容纳硬盘单元。 前面板可以包括排气孔或网孔。

公开(公告)号：US5521433A

公开(公告)日：1996-05-28

申请号：US408300

申请日：1995-03-22

申请人： Teru Hirata ,  Shigeo Onoda ,  Tetsuro Washida ,  Yasuhiro Murasawa

发明人： Teru Hirata ,  Shigeo Onoda ,  Tetsuro Washida ,  Yasuhiro Murasawa

IPC分类号： B42D15/10 ,  G06K19/02 ,  G06K19/077 ,  H01L23/12 ,  H01L23/538 ,  H01L25/00 ,  H05K1/03 ,  H05K1/05 ,  H01L23/02 ,  H01L23/053

CPC分类号： G06K19/07728 ,  G06K19/02 ,  G06K19/077 ,  G06K19/0773 ,  H01L23/5388 ,  H05K1/0373 ,  H01L2924/0002 ,  H05K1/036 ,  H05K1/056 ,  H05K2201/0215 ,  H05K2201/0281

摘要： An IC card includes a substrate having a metal fiber resin material layer made of a mixture of a resin and metal fibers and a conductive pattern. The conductive pattern and the metal fiber resin material layer are electrically insulated from each other by a resist film. Heat radiation and mechanical strength of the IC card are enhanced.

摘要翻译： IC卡包括具有由树脂和金属纤维的混合物制成的金属纤维树脂材料层和导电图案的基板。 导电图案和金属纤维树脂材料层通过抗蚀剂膜彼此电绝缘。 提高了IC卡的散热和机械强度。