摘要:
A thermal-type infrared solid-state imaging device comprises a infrared detector having at least a substrate provided with an integrated circuit for reading out a signal, a diaphragm for detecting a temperature change by absorbing infrared rays, and a support section for supporting the diaphragm above a surface of one side of the substrate with space in between, and includes an eaves section connected to a connection area provided in the vicinity of outer circumference of the diaphragm and covering at least components other than the diaphragm across a space and transmitting the heat generated by absorbing incident infrared rays to the diaphragm, wherein the eaves section has the thickness of a first region covering the components other than the diaphragm across a space thicker than the thicknesses of a second region contacting the connection area of the diaphragm and a third region rising upward in mid air from the diaphragm.
摘要:
A thermal-type infra-red ray solid-state image sensor includes at least one device for detecting infra-red ray, wherein the device is comprised of a substrate including a signal-reading circuit, a contact electrode formed on the substrate and electrically connected to the signal-reading circuit, a diaphragm spaced away from and above the substrate, a support supporting the diaphragm such that the diaphragm floats above the substrate, and being composed of electrically conductive material to electrically connect the contact electrode to the diaphragm, and a hood formed on the diaphragm for preventing infra-red ray from being radiated to the support, absorbing the infra-red ray, and transferring heat resulted from the thus absorbed infra-red ray, to the diaphragm. The hood is comprised of a sidewall standing on the diaphragm, and an upper plate extending inwardly of the sidewall from an upper edge of the sidewall, the upper plate being formed with an opening.
摘要:
The method for fabricating a charge coupled device disclosed includes the steps of forming a gate oxide film and forming a transfer electrode. The provisional oxide film is formed on a semiconductor substrate, and the provisional oxide film at a transfer electrode formation region is selectively etched away. The transfer electrode from a polycrystalline silicon film on the gate oxide film of the transfer electrode formation region is selectively formed, and the provisional oxide film between transfer electrodes is etched away. Since the oxide film which protects the silicon substrate surface (oxide film/silicon interface) of the second layer transfer electrode formation region during the patterning of the first layer polycrystalline film and the insulating oxide film which covers the first layer transfer electrode surface, is formed in the two-step oxidation process, it is possible to adjust the thicknesses of the two oxide films as desired.
摘要:
A thermal type infrared radiation solid state image pick-up device includes a temperature-electrical signal converting function element and a heat isolation structural body supporting the temperature-electrical signal converting function element. The heat isolation structural body is formed of a silicon oxide or a silicon nitride in porous structure. Since the heat isolation structural body has porous structure, heat flowing out from the heat isolation structural body depends on an actual area derived by subtracting the area of the holes from the area of the cross-section of the leg (nominal cross section). On the other hand, the mechanical strength of the heat isolation structural body relies on the area of the cross section of the leg. Therefore, for obtaining the photo sensitivity equivalent to that of the conventional heat isolation structural body, the cross sectional area of the leg can be made greater to improve mechanical strength thereof.
摘要:
Disclosed is a solid state image device which has a plurality of photosensitive units which are disposed in parallel with each other and each of which includes a row of a plurality of photosensitive devices each of which includes a first N(or P)-type impurity region which is selectively formed on the surface of a P(or N)-type semiconductor region at the surface of a semiconductor substrate, a CCD register for executing electronic scanning which is disposed in parallel to the row of photosensitive devices, and a read-out gate in which a signal charge is transferred from the photosensitive device to the CCD register, wherein a transparent Schottky electrode is formed on the first N(or P)-type impurity region except a portion adjacent to the read-out gate region, the Schottky electrode is electrically connected to a P.sup.+ (or N.sup.+)-type element separating region which surrounds the first N(or P)-type impurity region and has a Schottky barrier that is determined such that a diffusion potential between the Schottky electrode and the first N(or P)-type impurity region is lower than a diffusion potential between the first N(or P)-type impurity region and the P(or N)-type semiconductor region.
摘要:
An inter-line, back-illuminated, solid state imaging device having a large active area. Metal signal lines providing driving signals to gate electrodes of vertical CCD shift-registers are disposed in front of radiation sensors. The metal signal lines can serve as metal mirrors for increasing the amount of usable radiation. At the gap portion of the metal signal lines, a second metal mirror can be provided. Alternatively, the dimension of the gap is smaller than the lowest wavelength of the band wavelength of the radiation to be detected. When a metal mirror is provided separately form the metal signal line group, the metal mirror can serve as a shield of the photoelectric conversion layer from the driving signal.
摘要:
An infrared detecting apparatus includes: a substrate; an infrared detector which detects infrared radiation; a first supporting member which extends between the infrared detector and the substrate, and which supports the infrared detector apart from the substrate; a second supporting member which extends between the infrared detector and the substrate, and which supports the infrared detector apart from the substrate; and a plurality of wirings which extend between the infrared detector and the substrate, and which are all provided to the first supporting member.
摘要:
Disclosed is a photoelectric conversion device in which a photodiode capacitance is increased. A transparent electrode is formed between a reflecting plate and a photodiode constituting a unitary picture element of a CCD image sensor. It is so formed that light is incident from the rear surface and the loop of the standing wave of the light comes on a platinum silicide film, thereby achieving the effective absorption of the incident light. The transparent electrode is formed between the reflecting plate and the photodiode in opposition to the platinum silicide film. The capacitance between the transparent electrode and the platinum silicide film can be utilized as photodiode capacitance. Optically optimum thickness is assured by individually forming the reflecting plate which optimizes optical properties represented by the absorption of the incident light, and the transparent electrode used for increasing the photodiode capacitance, and also applying a pulse voltage to the transparent electrode at a given timing in such a manner that the potential at the time of resetting of the photodiode potential is lower than that obtained when the charge is accumulated.
摘要:
In the reference element employed in the thermal-type infrared solid-state image sensing device according to the present invention, a slit used for construction of a light receiving element is opened in insulating films between which a thermoelectric conversion element is tucked to such an extent that the slit pierces into the sacrifice layer; a film made of electrically conductive material covering the light receiving section and the slit is provided and a protective film is provided thereon, and the film made of electrically conductive material and the protective film enter the interior of the slit along a side wall of the slit, whereby a void is left in the interior of the slit. As a result, residual stresses of the insulating films are kept equal in the light receiving element and the reference element, and thereby, the light blocking effect and the heat transfer effect are improved.
摘要:
A thermal-type infrared solid-state imaging element is provided with a pixel having a diaphragm (1), a substrate, and a pair of supporting sections which support the diaphragm (1) by being spaced apart from the substrate. The supporting section has a first supporting section (2) on the same level as the diaphragm (1), and a second supporting section (3) on a level between the diaphragm (1) and the substrate. The second supporting section (3) is composed of a beam (4) having one or more bending points (8), a first contact section (5) on one end portion of the beam (4), and a second contact section (6) on the other end portion of the beam (4). The beam (4) and the second contact section (6) of the second supporting section (3) of each pixel exist underneath the diaphragm (1) of another pixel.