公开(公告)号：USD647096S1

公开(公告)日：2011-10-18

申请号：US29378674

申请日：2010-11-08

Applicant: Yueh Ming Tung ,  Chia Ming Yang ,  Hsiu Fang Tsai ,  Shu Hui Lin ,  Hung Lin Chiang

Designer： Yueh Ming Tung ,  Chia Ming Yang ,  Hsiu Fang Tsai ,  Shu Hui Lin ,  Hung Lin Chiang

公开(公告)号：US07960749B2

公开(公告)日：2011-06-14

申请号：US12421923

申请日：2009-04-10

Applicant: Shu Hui Lin

Inventor： Shu Hui Lin

IPC: H01L33/00

CPC classification number: H01L33/20 ,  H01L33/22

Abstract: A light-emitting device structure comprises a substrate having a first region and a second region outside the first region, a first conductive type semiconductor layer positioned on the first region, a light-emitting structure positioned on the first conductive type semiconductor layer, a second conductive type semiconductor layer positioned on the light-emitting structure, and a wall structure positioned on the second region.

Abstract translation: 发光器件结构包括具有第一区域和第一区域外部的第二区域的衬底，位于第一区域上的第一导电类型半导体层，位于第一导电类型半导体层上的发光结构，第二导电类型半导体层 位于所述发光结构上的导电型半导体层，以及位于所述第二区域上的壁结构。

公开(公告)号：US20100059773A1

公开(公告)日：2010-03-11

申请号：US12327367

申请日：2008-12-03

Applicant: CHIH CHING CHENG ,  TZONG-LIANG TSAI ,  SHU HUI LIN

Inventor： CHIH CHING CHENG ,  TZONG-LIANG TSAI ,  SHU HUI LIN

IPC: H01L33/00

CPC classification number: H01L33/22 ,  H01L33/20 ,  H01L2933/0083

Abstract: A semiconductor light-emitting device comprises a substrate, a first conductive type semiconductor layer positioned on the substrate, a light-emitting structure positioned on the first conductive type semiconductor layer, and a second conductive type semiconductor layer positioned on the light-emitting structure. The substrate includes an upper surface and a plurality of protrusions positioned on the upper surface. Each of the protrusions includes a top surface, a plurality of wall surfaces, and a plurality of inclined surfaces sandwiched between the top surface and the wall surfaces.

Abstract translation: 半导体发光器件包括衬底，位于衬底上的第一导电类型半导体层，位于第一导电类型半导体层上的发光结构和位于发光结构上的第二导电型半导体层。 基板包括上表面和位于上表面上的多个突起。 每个突起包括顶表面，多个壁表面和夹在顶表面和壁表面之间的多个倾斜表面。

公开(公告)号：US20090189295A1

公开(公告)日：2009-07-30

申请号：US12120095

申请日：2008-05-13

Applicant: Yueh-Ming TUNG ,  Chia-Ming Yang ,  Shu-Hui Lin ,  Ta-Fa Lin ,  Mien-Fang Sung

Inventor： Yueh-Ming TUNG ,  Chia-Ming Yang ,  Shu-Hui Lin ,  Ta-Fa Lin ,  Mien-Fang Sung

IPC: H01L21/50 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01L23/3121 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A stack chip package structure and a manufacturing method thereof are disclosed. The method comprises: providing a first substrate; disposing a first chip on the first substrate; disposing a second chip and at least one second substrate on the first chip, wherein the second substrate is electrically connected to the first chip; bonding at least one first connecting wire connected between the second chip and the second substrate; bonding at least one second connecting wire connected between the first substrate and the second substrate; and forming a package body on the first substrate to encapsulate the first chip, the second chip, the second substrate, the first connecting wire and the second connecting wire.

Abstract translation: 公开了一种堆叠芯片封装结构及其制造方法。 该方法包括：提供第一衬底; 在第一基板上设置第一芯片; 在第一芯片上设置第二芯片和至少一个第二基板，其中第二基板电连接到第一芯片; 接合连接在第二芯片和第二基板之间的至少一个第一连接线; 接合连接在第一基板和第二基板之间的至少一个第二连接线; 以及在所述第一基板上形成封装体以封装所述第一芯片，所述第二芯片，所述第二基板，所述第一连接线和所述第二连接线。

公开(公告)号：US20120038839A1

公开(公告)日：2012-02-16

申请号：US12899870

申请日：2010-10-07

Applicant: Yueh Ming TUNG ,  Chia Ming YANG ,  Shu Hui LIN ,  Yuan Wei LIU ,  Wei Fang LIN

Inventor： Yueh Ming TUNG ,  Chia Ming YANG ,  Shu Hui LIN ,  Yuan Wei LIU ,  Wei Fang LIN

IPC: G02F1/136 ,  G02F1/1347

CPC classification number: G02F1/13452 ,  G02F1/136277

Abstract: A micro projector module according to the present invention is provided. The micro projector module includes a substrate, a controller chip, a LCOS chip, a glass and a liquid crystal layer. The controller chip is positioned on the upper surface of the substrate and electrically connected to the substrate. The LCOS chip is positioned on the controller chip and electrically connected to the substrate. The glass is positioned on the LCOS chip and the liquid crystal layer is disposed between the LCOS chip and glass.

Abstract translation: 提供了根据本发明的微型投影仪模块。 微型投影仪模块包括基板，控制芯片，LCOS芯片，玻璃和液晶层。 控制器芯片位于基板的上表面上并与基板电连接。 LCOS芯片位于控制器芯片上并电连接到基板。 玻璃位于LCOS芯片上，液晶层设置在LCOS芯片和玻璃之间。

公开(公告)号：US20070153149A1

公开(公告)日：2007-07-05

申请号：US11464041

申请日：2006-08-11

Applicant: Tai Yuan CHEN ,  Shu Hui LIN ,  Hsiao Ping LIN

Inventor： Tai Yuan CHEN ,  Shu Hui LIN ,  Hsiao Ping LIN

IPC: G02F1/136

CPC classification number: G02F1/136227 ,  G02F1/133555 ,  G02F2203/02

Abstract: A thin film transistor substrate includes a transparent substrate, a plurality of thin film transistors, a passivation insulating layer and a plurality of pixel electrodes. The thin film transistors are disposed on the transparent substrate and include a gate insulating film. The passivation insulating layer is disposed on the gate insulating film and covers the thin film transistors, wherein the passivation insulating layer is formed with a concave-convex surface, a plurality of contact holes and a plurality of light-transmissive regions, and the light-transmissive regions are located above the gate insulating film. The pixel electrodes are disposed on the concave-convex surface and the light-transmissive regions, wherein each pixel electrode is electrically connected to the thin film transistor via the contact hole.

Abstract translation: 薄膜晶体管基板包括透明基板，多个薄膜晶体管，钝化绝缘层和多个像素电极。 薄膜晶体管设置在透明基板上并且包括栅极绝缘膜。 钝化绝缘层设置在栅极绝缘膜上并覆盖薄膜晶体管，其中钝化绝缘层形成有凹凸表面，多个接触孔和多个透光区域， 透射区域位于栅极绝缘膜的上方。 像素电极设置在凹凸表面和透光区域上，其中每个像素电极经由接触孔电连接到薄膜晶体管。

公开(公告)号：USD647097S1

公开(公告)日：2011-10-18

申请号：US29379019

申请日：2010-11-12

Applicant: Yueh Ming Tung ,  Chia Ming Yang ,  Hsiu Fang Tsai ,  Shu Hui Lin ,  Hung Lin Chiang

Designer： Yueh Ming Tung ,  Chia Ming Yang ,  Hsiu Fang Tsai ,  Shu Hui Lin ,  Hung Lin Chiang

公开(公告)号：US20110001147A1

公开(公告)日：2011-01-06

申请号：US12856221

申请日：2010-08-13

Applicant: Chih CHING Cheng ,  Tzong Liang Tsai ,  Shu Hui Lin

Inventor： Chih CHING Cheng ,  Tzong Liang Tsai ,  Shu Hui Lin

IPC: H01L33/00

CPC classification number: H01L33/22 ,  H01L33/20 ,  H01L2933/0083

Abstract: A semiconductor light-emitting device comprises a substrate, a first conductive type semiconductor layer positioned on the substrate, a light-emitting structure positioned on the first conductive type semiconductor layer, and a second conductive type semiconductor layer positioned on the light-emitting structure. The substrate includes an upper surface and a plurality of protrusions positioned on the upper surface. Each of the protrusions includes a top surface, a plurality of wall surfaces, and a plurality of inclined surfaces sandwiched between the top surface and the wall surfaces.

Abstract translation: 半导体发光器件包括衬底，位于衬底上的第一导电类型半导体层，位于第一导电类型半导体层上的发光结构和位于发光结构上的第二导电型半导体层。 基板包括上表面和位于上表面上的多个突起。 每个突起包括顶表面，多个壁表面和夹在顶表面和壁表面之间的多个倾斜表面。

公开(公告)号：US08247822B2

公开(公告)日：2012-08-21

申请号：US12856221

申请日：2010-08-13

Applicant: Chih Ching Cheng ,  Tzong Liang Tsai ,  Shu Hui Lin

Inventor： Chih Ching Cheng ,  Tzong Liang Tsai ,  Shu Hui Lin

IPC: H01L27/15

CPC classification number: H01L33/22 ,  H01L33/20 ,  H01L2933/0083

Abstract: A semiconductor light-emitting device comprises a substrate, a first conductive type semiconductor layer positioned on the substrate, a light-emitting structure positioned on the first conductive type semiconductor layer, and a second conductive type semiconductor layer positioned on the light-emitting structure. The substrate includes an upper surface and a plurality of protrusions positioned on the upper surface. Each of the protrusions includes a top surface, a plurality of wall surfaces, and a plurality of inclined surfaces sandwiched between the top surface and the wall surfaces.

Abstract translation: 半导体发光器件包括衬底，位于衬底上的第一导电类型半导体层，位于第一导电类型半导体层上的发光结构和位于发光结构上的第二导电型半导体层。 基板包括上表面和位于上表面上的多个突起。 每个突起包括顶表面，多个壁表面和夹在顶表面和壁表面之间的多个倾斜表面。

公开(公告)号：US20100123146A1

公开(公告)日：2010-05-20

申请号：US12421923

申请日：2009-04-10

Applicant: SHU HUI LIN

Inventor： SHU HUI LIN

IPC: H01L33/00

CPC classification number: H01L33/20 ,  H01L33/22

Abstract: A light-emitting device structure comprises a substrate having a first region and a second region outside the first region, a first conductive type semiconductor layer positioned on the first region, a light-emitting structure positioned on the first conductive type semiconductor layer, a second conductive type semiconductor layer positioned on the light-emitting structure, and a wall structure positioned on the second region.

Abstract translation: 发光器件结构包括具有第一区域和第一区域外部的第二区域的衬底，位于第一区域上的第一导电类型半导体层，位于第一导电类型半导体层上的发光结构，第二导电类型半导体层 位于所述发光结构上的导电型半导体层，以及位于所述第二区域上的壁结构。