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公开(公告)号：US20240250036A1
公开(公告)日：2024-07-25
申请号：US18592850
申请日：2024-03-01
发明人： Shih-Hao Tseng , Hung-Jui Kuo , Ming-Che Ho
IPC分类号： H01L23/538 , H01L21/288 , H01L21/3105 , H01L21/311 , H01L21/321 , H01L21/56 , H01L21/683 , H01L21/768 , H01L23/00 , H01L23/31 , H01L23/498 , H01L25/10
CPC分类号： H01L23/5386 , H01L21/288 , H01L21/31058 , H01L21/31138 , H01L21/561 , H01L21/565 , H01L21/6835 , H01L21/76802 , H01L21/7684 , H01L21/76871 , H01L21/76877 , H01L23/31 , H01L23/3107 , H01L23/49811 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/05 , H01L24/14 , H01L24/19 , H01L24/20 , H01L24/24 , H01L21/3212 , H01L23/3128 , H01L25/105 , H01L2221/68345 , H01L2221/68359 , H01L2224/0231 , H01L2224/02373 , H01L2224/0401 , H01L2224/05124 , H01L2224/05569 , H01L2224/05573 , H01L2224/24137 , H01L2225/1023 , H01L2225/1058
摘要： In an embodiment, a device includes: an integrated circuit die; a through via adjacent the integrated circuit die; a molding compound encapsulating the integrated circuit die and the through via; and a redistribution structure including: a first conductive via extending through a first dielectric layer, the first conductive via electrically connected to the integrated circuit die, the first dielectric layer being over the integrated circuit die, the through via, and the molding compound; and a first conductive line over the first dielectric layer and the first conductive via, the first conductive via extending into the first conductive line.
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公开(公告)号：US09718669B2
公开(公告)日：2017-08-01
申请号：US14984469
申请日：2015-12-30
发明人： Tung-Tsun Chen , Chia-Hua Chu
CPC分类号： B81B1/004 , B81B2201/025 , B81B2201/0264 , B81C1/00087 , B81C1/00309 , B81C2201/019 , G01L9/00
摘要： A micro-electro mechanical system (MEMS) pressure sensor includes a first substrate, a second substrate and a sensing structure. The second substrate is substantially parallel to the first substrate. The sensing structure is between the first substrate and the second substrate, and bonded to a portion of the first substrate and a portion of the second substrate, in which a first space between the first substrate and the sensing structure is communicated with outside, and a second space between the second substrate and the sensing structure is communicated with or isolated from the outside.
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公开(公告)号：US20170190567A1
公开(公告)日：2017-07-06
申请号：US14984469
申请日：2015-12-30
发明人： Tung-Tsun Chen , Chia-Hua Chu
CPC分类号： B81B1/004 , B81B2201/025 , B81B2201/0264 , B81C1/00087 , B81C1/00309 , B81C2201/019 , G01L9/00
摘要： A micro-electro mechanical system (MEMS) pressure sensor includes a first substrate, a second substrate and a sensing structure. The second substrate is substantially parallel to the first substrate. The sensing structure is between the first substrate and the second substrate, and bonded to a portion of the first substrate and a portion of the second substrate, in which a first space between the first substrate and the sensing structure is communicated with outside, and a second space between the second substrate and the sensing structure is communicated with or isolated from the outside.
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