摘要:
Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. In one respect, the invention relates to the fabrication of board layers by beginning with a metallic core, patterning the core, selectively enclosing the core in a dielectric, selectively depositing metal to form vias, plugs and signal lines, and forming dendrites with joining metallurgy on the vias and plugs to provide stackable connection from above or below the plane of the board layer. In another aspect, the invention is directed to the use of a sol-gel process to form a thin high dielectric constant crystalline film onto a metallic sheet followed with a deposition of a metallic layer onto the high dielectric constant film. The film serves as the dielectric of a capacitor layer which is thereafter in succession patterned, covered by a dielectric, and has selectively deposited a metallic layer for interconnecting the capacitor and forming vias. The ends of the vias are thereafter subject to dendritic growth and joining metallurgy to provide stackable interconnection capability. A multilayer composite laminar stackable circuit board structure is created using, as appropriate, layers having metallic cores and layers having capacitively configured cores. The multilayer laminar stackable circuit board provides direct vertical connection between surface mounted electronic components and the power, signal and capacitive decoupling layers of the composite board through the dendrites and joining metallurgy of the via and plug formations.
摘要:
The present application is directed to a color changeable carrier constructed from at least one dye-laden material, wherein the dye-laden material is treated in a manner effective to provide one or more first visible colors under predetermined ambient conditions and one or more second visible colors under different predetermined ambient conditions.
摘要:
A communications and database delivery service within an internetwork interacts with a service provider and its requestors/customers. A server is maintained for storing requester identifiers and service provider identifiers. A records database is maintained for storing records of digital information for customers of the service provider in accordance with the requester identifiers. An initiation message is received from a requestor over the internetwork. A notification is sent of a requested two-way video session to an IP address corresponding to the service provider. After an acceptance is received from the service provider, signals are provided over the internetwork to enable the two-way video session between respective workstations of the requestor and the service provider. A respective record is retrieved from the records database corresponding to the requester. The respective record is forwarded to the IP address corresponding to the service provider.
摘要:
An information server according to one embodiment of the invention includes a communication interface configured to communicate over a communication network and a processing system connected to the communication interface. The processing system is configured to receive one or more digital content sets, receive a caller system identifier and a called system identifier from the caller system, select a digital content set from among the one or more digital content sets using the caller system identifier and the called system identifier, and provide the selected digital content set to a called system corresponding to the called system identifier prior to the caller system establishing a communication channel to the called system.
摘要:
A data call between at least two internetworked computers is established using a central server. Once the data call is in place, prerecorded motion video is shared between the two computers by creating a streaming video server on one user's computer for streaming the prerecorded motion video simultaneously to both users as clients of the streaming server. Either user can pause, rewind, or fast forward the streamed video as it is viewed by both users.
摘要:
Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. In one respect, the invention relates to the fabrication of board layers by beginning with a metallic core, patterning the core, selectively enclosing the core in a dielectric, selectively depositing metal to form vias, plugs and signal lines, and forming dendrites with joining metallurgy on the vias and plugs to provide stackable connection from above or below the plane of the board layer. In another aspect, the invention is directed to the use of a sol-gel process to form a thin high dielectric constant crystalline film onto a metallic sheet followed with a deposition of a metallic layer onto the high dielectric constant film. The film serves as the dielectric of a capacitor layer which is thereafter in succession patterned, covered by a dielectric, and has selectively deposited a metallic layer for interconnecting the capacitor and forming vias. The ends of the vias are thereafter subject to dendritic growth and joining metallurgy to provide stackable interconnection capability. A multilayer composite laminar stackable circuit board structure is created using, as appropriate, layers having metallic cores and layers having capacitively configured cores. The multilayer laminar stackable circuit board provides direct vertical connection between surface mounted electronic components and the power, signal and capacitive decoupling layers of the composite board through the dendrites and joining metallurgy of the via and plug formations.
摘要:
A method, system and program product for correcting via spacing violations by generating a redundant via to replace one of a pair of vias that violate a ground rule, are disclosed. The redundant via corrects the ground rule violation. The target via corresponding to the redundant via is then removed, which corrects the ground rule violation. The invention can be applied to any spacing ground rule including same net and different net rules, and may also be applied to a current technology or, during migration, to a new technology. The invention can be applied to different levels of a design to ensure ground rule compliance throughout the design.