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    Method and apparatus for designing a spanning tree virtual network
    1.
    发明授权
    Method and apparatus for designing a spanning tree virtual network 有权
    用于设计生成树虚拟网络的方法和装置

    公开(公告)号：US07443800B2

    公开(公告)日：2008-10-28

    申请号：US10935194

    申请日：2004-09-08

    申请人： Tetsuo Imai

    发明人： Tetsuo Imai

    IPC分类号： H04L12/28

    CPC分类号： H04L45/48 ,  H04L12/4641 ,  H04L41/12 ,  H04L41/145 ,  H04L41/22 ,  H04L45/02 ,  H04L45/12 ,  H04L45/125 ,  H04L45/18

    摘要： Apparatus for designing a virtual VLAN network includes a database representing a plurality of VLAN networks in a spanning tree topology, each of the networks being formed of a plurality of VLAN member nodes interconnected by links. In response to a network configuration request from a communications network, control circuitry determines the costs of the links, and then determines the least cost unicast paths by using a shortest path algorithm. A search is made through the least cost unicast paths for detecting a loop. If at least one loop is detected, a link of highest cost of the loop is blocked. All unicast paths of the blocked link are reestablished through links that circumvent the blocked link. A spanning tree built up with all the links accommodating the least cost unicast paths is established. Configuration command is sent to the network for configuring it according to the established spanning tree.

    摘要翻译： 用于设计虚拟VLAN网络的装置包括表示生成树拓扑中的多个VLAN网络的数据库，每个网络由通过链路互连的多个VLAN成员节点形成。 响应于来自通信网络的网络配置请求，控制电路确定链路的成本，然后通过使用最短路径算法来确定最低成本单播路径。 通过用于检测循环的最低成本单播路径进行搜索。 如果检测到至少一个回路，则阻塞循环成本最高的链路。 阻止链接的所有单播路径通过绕过被阻止的链路的链接重新建立。 建立了构建所有链路的生成树，其中包含最少成本的单播路径。 配置命令根据已建立的生成树发送到网络进行配置。

    Vacuum-cleaner suction tool and vacuum cleaner using the same
    2.
    发明授权
    Vacuum-cleaner suction tool and vacuum cleaner using the same 有权
    吸尘器吸尘器和吸尘器使用

    公开(公告)号：US07383608B2

    公开(公告)日：2008-06-10

    申请号：US10421733

    申请日：2003-04-24

    申请人： Toru Odachi ,  Hideo Okubo ,  Saburo Kajikawa ,  Tetsuo Imai

    发明人： Toru Odachi ,  Hideo Okubo ,  Saburo Kajikawa ,  Tetsuo Imai

    IPC分类号： A47L9/00

    CPC分类号： A47L9/0411 ,  A47L9/009 ,  A47L9/02 ,  A47L9/242

    摘要： A vacuum-cleaner suction tool includes a sucking portion for sucking up dust on a surface to be cleaned, a joint portion having one end connected to the upper side of the sucking portion and the other end provided with a connection pipe, and an agitator disposed within the sucking portion for scraping dust off the surface. The opening, the joint portion, and the connection pipe each have a channel portion allowing sucked-up dust to pass therethrough. The joint portion is configured to be turnable, relative to the sucking portion, in a horizontal direction substantially parallel to the surface to be cleaned to such an extent that the longitudinal central axis of the sucking portion becomes substantially parallel to the longitudinal central axis of the connection pipe, whereby the forward end of the sucking portion, from left to right, can be brought into close contact with wall surfaces so that dust liable to collect in corners can be fully sucked up.

    摘要翻译： 真空吸尘器吸附工具包括：用于吸取待清洁表面上的灰尘的吸入部分，一端连接到吸入部分的上侧的接头部分和设置有连接管的另一端;以及搅拌器， 在吸入部分内用于从表面刮除灰尘。 开口，接合部和连接管各自具有允许吸入的灰尘通过的通道部。 所述接合部构造成相对于所述吸引部在基本上平行于所述待清洁表面的水平方向上可转动到使得所述吸引部的纵向中心轴线基本上平行于所述待清洁表面的纵向中心轴线的程度 连接管，由此吸引部的前端从左到右能够与壁面紧密接触，从而可以完全吸入容易收集在角部的灰尘。

    Process for leaching copper from copper sulfide using bacteria
    3.
    发明授权
    Process for leaching copper from copper sulfide using bacteria 失效
    使用细菌从硫化铜中浸出铜的方法

    公开(公告)号：US06168766A

    公开(公告)日：2001-01-02

    申请号：US08937115

    申请日：1997-09-24

    申请人： Tetsuo Imai ,  Atsushi Saitoh

    发明人： Tetsuo Imai ,  Atsushi Saitoh

    IPC分类号： C22B1500

    CPC分类号： C22B3/18 ,  C22B15/0071 ,  Y02P10/234 ,  Y02P10/236 ,  Y02P10/238

    摘要： Disclosed is a process for leaching copper from copper sulfide using bacteria, which ensures that the rate of leaching of copper increases to reduce the leaching time period and that the rate of leaching of primary copper sulfide contained in ores is increased. The process comprises using an acid leaching solution that includes both or any one of iron oxidizing bacteria and sulfur oxidizing bacteria in a concentration of 106 microbes/mL, the acid leaching solution having a redox potential of from 550 to 750 mV and 5 g/L or more of iron, the ratio of trivalent iron ions to bivalent iron ions (Fe3+/Fe2+) in the acid leaching solution being 50 or more.

    摘要翻译： 公开了一种使用细菌从铜硫化物中浸出铜的方法，其确保铜的浸出速率增加以减少浸出时间，并且矿石中所含的初级硫化铜的浸出速率增加。 该方法包括使用含有浓度为106微克/ mL的铁氧化细菌和硫氧化细菌中的任一种或任一种的酸浸液，酸浸液具有550-750mV的氧化还原电位和5g / L 或更多的铁，酸浸液中三价铁离子与二价铁离子（Fe3 + / Fe2 +）的比例为50以上。

    PLATING METHOD OF CIRCUIT SUBSTRATE, PRODUCTION METHOD OF PLATED CIRCUIT SUBSTRATE, AND SILVER ETCHING LIQUID
    6.
    发明申请
    PLATING METHOD OF CIRCUIT SUBSTRATE, PRODUCTION METHOD OF PLATED CIRCUIT SUBSTRATE, AND SILVER ETCHING LIQUID 有权
    电路基板的镀覆方法，电路基板的制造方法，以及银蚀刻液

    公开(公告)号：US20130048598A1

    公开(公告)日：2013-02-28

    申请号：US13527751

    申请日：2012-06-20

    申请人： Emi USHIODA ,  Tetsuo IMAI

    发明人： Emi USHIODA ,  Tetsuo IMAI

    IPC分类号： H05K3/10 ,  C23F1/10

    CPC分类号： C23G1/103 ,  C23C18/1216 ,  C23C18/1651 ,  C23C18/1844 ,  C23C22/52 ,  C23C22/63 ,  C23G1/20 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/246 ,  H05K2203/0796

    摘要： Provided is a plating method of a circuit substrate comprising a conductive pattern in which a metal layer containing at least silver and copper is exposed on an outer surface. The plating method comprises: step (A) of treating the circuit substrate with a first liquid agent containing an oxidizing agent; step (B) of treating the circuit substrate after the step (A) with a second liquid agent which dissolves copper oxide, and thereby removing copper oxide from the conductive pattern's surface; step (C) of treating the circuit substrate after the step (B) with a third liquid agent whose rate of dissolving silver oxide (I) at 25° C. is 1000 times or more faster than its rate of dissolving copper (0) at 25° C., and thereby removing silver oxide from the conductive pattern's surface; and step (D) of performing electroless plating on the conductive pattern of the circuit substrate after the step (C).

    摘要翻译： 提供一种电路基板的电镀方法，该电路基板包括导体图案，其中至少含有银和铜的金属层在外表面上露出。 电镀方法包括：用含有氧化剂的第一液体试剂处理电路基板的工序（A） 在步骤（A）之后用溶解氧化铜的第二液体试剂处理电路基板的步骤（B），从而从导电图案的表面除去氧化铜; 在步骤（B）之后用第三液体试剂处理电路基板的步骤（C），其中溶解氧化银（I）在25℃下的速率比其溶解铜（0）的速率快1000倍或更快 25℃，从而从导电图案的表面除去氧化银; 以及在步骤（C）之后在电路基板的导电图案上进行无电镀的步骤（D）。

    System using pseudo redundant configurator to switch network devices between operating and standby states
    8.
    发明授权
    System using pseudo redundant configurator to switch network devices between operating and standby states 有权
    使用伪冗余配置器的系统在操作和待机状态之间切换网络设备

    公开(公告)号：US07603480B2

    公开(公告)日：2009-10-13

    申请号：US11575123

    申请日：2005-08-29

    申请人： Tetsuo Imai ,  Soichiro Araki ,  Tomoyoshi Sugawara ,  Norito Fujita

    发明人： Tetsuo Imai ,  Soichiro Araki ,  Tomoyoshi Sugawara ,  Norito Fujita

    IPC分类号： G06F15/173

    CPC分类号： H04L45/00 ,  H04L43/0811 ,  H04L45/22 ,  H04L45/28 ,  H04L45/586

    摘要： Disclosed is a network system comprising: a plurality of routers 704 and 705 connected to each other through a network; pseudo redundant configuration setting means 702 and 703 which are connected respectively to the routers and which perform a communication using a redundancy protocol with respective routers; and association control means 701 connected to the pseudo redundant configuration setting means 702 and 703, wherein when a server 716 is a backup server and its backup state needs to be maintained, the pseudo redundant configuration setting means 703 issues a signal for maintaining a standby state to the router 705, and when servers are switched between a standby state and operating state, the association control means 701 transmits a switching instruction for switching between a standby state and operating state to the pseudo redundant configuration setting means 702 and 703.

    摘要翻译： 公开了一种网络系统，包括：通过网络彼此连接的多个路由器704和705; 伪冗余配置设置装置702和703分别连接到路由器，并且使用与相应路由器的冗余协议进行通信; 以及连接到伪冗余配置设置装置702和703的关联控制装置701，其中当服务器716是备份服务器并且需要维护其备份状态时，伪冗余配置设置装置703发出用于维持备用状态的信号 到路由器705，并且当服务器在待机状态和操作状态之间切换时，关联控制装置701将用于在待机状态和操作状态之间切换的切换指令发送到伪冗余配置设置装置702和703。

    Method Of Switching Between Network Connection Devices Using Redundancy Protocol And Pseudo Redundant Configuration Setting Means And Network System
    9.
    发明申请
    Method Of Switching Between Network Connection Devices Using Redundancy Protocol And Pseudo Redundant Configuration Setting Means And Network System 有权
    使用冗余协议和伪冗余配置设置方法和网络系统之间切换网络连接设备的方法

    公开(公告)号：US20080034112A1

    公开(公告)日：2008-02-07

    申请号：US11575123

    申请日：2005-08-29

    申请人： Tetsuo Imai ,  Soichiro Araki ,  Tomoyoshi Sugawara ,  Norito Fujita

    发明人： Tetsuo Imai ,  Soichiro Araki ,  Tomoyoshi Sugawara ,  Norito Fujita

    IPC分类号： G06F15/173

    CPC分类号： H04L45/00 ,  H04L43/0811 ,  H04L45/22 ,  H04L45/28 ,  H04L45/586

    摘要： Disclosed is a network system comprising: a plurality of routers 704 and 705 connected to each other through a network; pseudo redundant configuration setting means 702 and 703 which are connected respectively to the routers and which perform a communication using a redundancy protocol with respective routers; and association control means 701 connected to the pseudo redundant configuration setting means 702 and 703, wherein when a server 716 is a backup server and its backup state needs to be maintained, the pseudo redundant configuration setting means 703 issues a signal for maintaining a standby state to the router 705, and when servers are switched between a standby state and operating state, the association control means 701 transmits a switching instruction for switching between a standby state and operating state to the pseudo redundant configuration setting means 702 and 703.

    摘要翻译： 公开了一种网络系统，包括：通过网络彼此连接的多个路由器704和705; 伪冗余配置设置装置702和703分别连接到路由器，并且使用与相应路由器的冗余协议进行通信; 以及连接到伪冗余配置设置装置702和703的关联控制装置701，其中当服务器716是备份服务器并且需要维护其备份状态时，伪冗余配置设置装置703发出用于维持备用状态的信号 到路由器705，并且当服务器在待机状态和操作状态之间切换时，关联控制装置701将用于在待机状态和操作状态之间切换的切换指令发送到伪冗余配置设置装置702和703。

    Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid
    10.
    发明授权
    Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid 有权
    电路基板的电镀方法，电镀电路基板的制造方法以及银蚀刻液

    公开(公告)号：US09017563B2

    公开(公告)日：2015-04-28

    申请号：US13527751

    申请日：2012-06-20

    申请人： Emi Ushioda ,  Tetsuo Imai

    发明人： Emi Ushioda ,  Tetsuo Imai

    IPC分类号： H01B13/00 ,  C03C15/00 ,  C25D5/54 ,  H01L21/30 ,  C09K13/00 ,  C23G1/10 ,  C23C22/52 ,  C23C22/63 ,  C23G1/20 ,  C23C18/18 ,  C23C18/12 ,  C23C18/16 ,  H05K3/24 ,  H05K1/03 ,  H05K3/12

    CPC分类号： C23G1/103 ,  C23C18/1216 ,  C23C18/1651 ,  C23C18/1844 ,  C23C22/52 ,  C23C22/63 ,  C23G1/20 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/246 ,  H05K2203/0796

    摘要： Provided is a plating method of a circuit substrate comprising a conductive pattern in which a metal layer containing at least silver and copper is exposed on an outer surface. The plating method comprises: step (A) of treating the circuit substrate with a first liquid agent containing an oxidizing agent; step (B) of treating the circuit substrate after the step (A) with a second liquid agent which dissolves copper oxide, and thereby removing copper oxide from the conductive pattern's surface; step (C) of treating the circuit substrate after the step (B) with a third liquid agent whose rate of dissolving silver oxide (I) at 25° C. is 1000 times or more faster than its rate of dissolving copper (0) at 25° C., and thereby removing silver oxide from the conductive pattern's surface; and step (D) of performing electroless plating on the conductive pattern of the circuit substrate after the step (C).

    摘要翻译： 提供一种电路基板的电镀方法，该电路基板包括导体图案，其中至少含有银和铜的金属层在外表面上露出。 电镀方法包括：用含有氧化剂的第一液体试剂处理电路基板的工序（A） 在步骤（A）之后用溶解氧化铜的第二液体试剂处理电路基板的步骤（B），从而从导电图案的表面除去氧化铜; 在步骤（B）之后用第三液体试剂处理电路基板的步骤（C），其中溶解氧化银（I）在25℃下的速率比其溶解铜（0）的速率快1000倍或更快 25℃，从而从导电图案的表面除去氧化银; 以及在步骤（C）之后在电路基板的导电图案上进行无电镀的步骤（D）。