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1.发明授权
公开(公告)号：US5310984A
公开(公告)日：1994-05-10
申请号：US970722
申请日：1992-11-03
CPC分类号： B23K11/252
摘要： An AC line voltage compensation method and controller for use with an AC welding system that is adapted to weld an article. Welding parameters are provided by an operator that are suitable for welding the article. A desired heating percentage is also input by the operator that is determinative of an RMS output voltage supplied by the AC welding system. The AC line voltage supplied to the AC welding system is measured by means of a voltmeter. The difference between the measured AC line voltage and a desired nominal AC line voltage is determined. The time at which heat is applied to the article is adjusted as a function of the measured difference to maintain the RMS output voltage supplied at the output of the AC welding system at a relatively constant level for all AC line voltages supplied to the AC welding system. More specifically, gain adjustment which provides for improved line voltage compensation, and which is controlled by means of a user programmed digital control panel, has been added to a line voltage compensation computational algorithm employed in an AC resistance welding controller. The use of the user programmed gain factor allows an operator to adjust the amount of compensation for a specific welding setup. The user adjusts the gain factor to modify a mathematically calculated term for line voltage compensation. The computed gain factor is used to set a variable time delay, after which an SCR is turned on. The variable time delay determines the phase angle of the AC pulse applied during each weld.
摘要翻译： 一种交流线电压补偿方法和控制器，用于与适于焊接物品的交流焊接系统一起使用。 焊接参数由适合于焊接物品的操作者提供。 所需的加热百分比也由操作者输入，其确定由AC焊接系统提供的RMS输出电压。 通过电压表测量提供给交流焊接系统的交流线路电压。 确定测量的AC线路电压与期望的标称AC线路电压之间的差异。 根据测量的差值调节对物品施加热量的时间，以便在AC焊接系统的所有交流线路电压下，将交流焊接系统的输出端提供的RMS输出电压保持在相对恒定的水平， 。 更具体地，增加了用于改进的线路电压补偿并且由用户编程的数字控制面板控制的增益调整已被添加到在AC电阻焊接控制器中使用的线路电压补偿计算算法。 使用用户编程的增益因子允许操作者调整特定焊接设置的补偿量。 用户调整增益系数以修改线性电压补偿的数学计算项。 计算的增益因子用于设置可变时间延迟，之后SCR被打开。 可变时间延迟决定了每个焊接期间施加的交流脉冲的相位角。
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公开(公告)号：US5138127A
公开(公告)日：1992-08-11
申请号：US738390
申请日：1991-07-31
CPC分类号： B23K11/318
摘要： A parallel-gap welder applies a precisely controlled force to the weld head (40) by means of a solenoid (60) having a plunger (72) aligned with the axis of the welding electrodes (50,52). To precisely control the amount of force applied by the solenoid a load cell (80) is interposed between the weld head (40) and the solenoid plunger (72) to provide a feedback force signal (158) indicative of the force applied by the solenoid. The feedback force signal is used to control current through the solenoid coil (68) and thereby servo the applied force to a force command input. The solenoid plunger (72) and load cell (80) are axially aligned with the axis of the electrodes (50,52) and solenoid force is applied through a universal joint (76,78) connection to assure an in-line driving force on the electrodes.
摘要翻译： 平行间隙焊接机通过具有与焊接电极（50,52）的轴线对准的柱塞（72）的螺线管（60）向焊接头（40）施加精确控制的力。 为了精确地控制由螺线管施加的力的量，称重传感器（80）插入在焊接头（40）和螺线管柱塞（72）之间，以提供反馈力信号（158），该反馈力信号（158）指示螺线管 。 反馈力信号用于控制通过螺线管线圈（68）的电流，从而将所施加的力伺服到力命令输入。 螺线管柱塞（72）和称重传感器（80）与电极（50,52）的轴线轴向对齐，并且通过万向节（76,78）连接施加螺线管力，以确保在线驱动力 电极。
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公开(公告)号：US20120295405A1
公开(公告)日：2012-11-22
申请号：US13548965
申请日：2012-07-13
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , B23K37/00 , H01L21/324 , H01L24/27 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/01029 , H05K13/0465 , H01L2924/00 , H01L2924/3512
摘要： Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.
摘要翻译： 在真空辅助下应用底部填充物的方法。 该方法可以包括将底部填充物分配到靠近附接到衬底的电子设备的至少一个外部边缘的衬底上。 电子设备和基板之间的空间通过底部填充物中的至少一个间隙被排出。 该方法还包括加热底部填充物以使底部填充物流入空间。 因为在开始流动之前在空间的开放部分中提供真空条件，所以底部填充排泄的发生率降低。
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公开(公告)号：US5115111A
公开(公告)日：1992-05-19
申请号：US563014
申请日：1990-08-06
IPC分类号： B23K11/31
CPC分类号： B23K11/318
摘要： Two parallel elongated closely spaced electrodes for welding electronic circuit components are mounted for limited rotation about an axis extending generally longitudinally of the electrodes to allow the electrode pair to be oriented with respect to a workpiece without angularly moving the workpiece. The electrodes are mounted in a pair of mutually aligned and mutually insulated bobbins against which are firmly pressed a pair of contacts for conducting weld current between the electrodes. The bobbins and the electrodes mounted therein are free to rotate relative to the fixed contacts, but the latter are firmly pressed against the bobbins to provide increased contact pressure and decreased electrical resistance between the contacts and bobbins and to provide a relatively large surface area for such contact.
摘要翻译： 安装用于焊接电子电路部件的两个平行细长的紧密间隔的电极，用于围绕电极大致纵向延伸的轴线进行有限旋转，以允许电极对相对于工件定向而不使工件成角度地移动。 电极安装在一对相互对准且相互绝缘的线轴中，牢固地按压一对触点，以在电极之间传导焊接电流。 安装在其中的线轴和电极相对于固定触点自由旋转，但是后者被牢固地压靠在线轴上，以提供增加的接触压力和降低的触点和线轴之间的电阻，并为此提供相对较大的表面积 联系。
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公开(公告)号：US08796075B2
公开(公告)日：2014-08-05
申请号：US13548965
申请日：2012-07-13
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , B23K37/00 , H01L21/324 , H01L24/27 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/01029 , H05K13/0465 , H01L2924/00 , H01L2924/3512
摘要： Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.
摘要翻译： 在真空辅助下应用底部填充物的方法。 该方法可以包括将底部填充物分配到靠近附接到衬底的电子设备的至少一个外部边缘的衬底上。 电子设备和基板之间的空间通过底部填充物中的至少一个间隙被排出。 该方法还包括加热底部填充物以使底部填充物流入空间。 因为在开始流动之前在空间的开放部分中提供真空条件，所以底部填充排泄的发生率降低。
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公开(公告)号：US20120178219A1
公开(公告)日：2012-07-12
申请号：US13004198
申请日：2011-01-11
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L23/295 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/131 , H01L2224/13147 , H01L2224/16227 , H01L2224/29012 , H01L2224/29026 , H01L2224/2929 , H01L2224/29388 , H01L2224/32225 , H01L2224/73204 , H01L2224/83048 , H01L2224/8309 , H01L2224/83102 , H01L2224/92125 , H01L2924/01029 , H01L2924/15311 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/0665 , H01L2924/00012 , H01L2924/014
摘要： Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.
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