System, device, and method for fluid dispensing control

    公开(公告)号:US10139840B2

    公开(公告)日:2018-11-27

    申请号:US15254896

    申请日:2016-09-01

    申请人: Horatio Quinones

    发明人: Horatio Quinones

    IPC分类号: G05D7/06 G01F25/00 G01M5/00

    摘要: A system for fluid dispensing control includes a fluid dispensing control device, a fluid dispenser, and a fluid flow meter, such that an intelligent parameterization of the dispensing system includes process variables, which characterize system behavior. The parameterization is used in convergence schemes for attaining defined fluid dispensing targets. Further, the parameterization is used to attain a consistent volumetric fluid dispensing by utilizing feedback controls. A fluid dispensing device includes a processor, a non-transitory memory, an input/output, a dispensing controller, a flow monitor, a parameterization manager, and a data bus. Also disclosed is a method for fluid dispensing control, including: a parameter sweep, logging system response data, processing response data, calculating system response function, calculating dispensing parameters, assessing intrinsic variation, determining variation band, controlling fluid dispense process response, and normalizing mass/volume fluid flow.

    Automated vacuum assisted valve priming system and methods of use
    2.
    发明授权
    Automated vacuum assisted valve priming system and methods of use 有权
    自动真空辅助阀启动系统及使用方法

    公开(公告)号:US08690009B2

    公开(公告)日:2014-04-08

    申请号:US13063796

    申请日:2009-09-18

    IPC分类号: B67D1/00

    摘要: An automated system (10) and methods (11) for priming a fluid chamber (12) of a fluid dispensing valve (14) with fluid (16) from fluid material source that includes a vacuum source (46), a valve priming station (32), a vacuum switch (54), and a controller (62). The valve priming station (32) has a boot (40), a vacuum chamber (36), and a vacuum channel (42) in the boot (40). The vacuum channel (42) connects with the vacuum source (46) via the vacuum chamber (36). The boot (40) sealingly engages a valve nozzle (28) of the fluid dispensing valve (14) so that the vacuum chamber (36) connects the vacuum source (46) with the fluid chamber (12). The vacuum switch (54) couples with the vacuum channel (42) via the vacuum chamber (36) and has an opened and closed position based upon a vacuum level in the vacuum chamber (36). The controller (62) is electrically connected with the vacuum source (46) and vacuum switch (54) and controls priming of the fluid dispensing valve (14) based upon whether the vacuum switch (54) is opened or closed.

    摘要翻译: 一种自动化系统(10)和方法(11),用于利用来自流体材料源的流体(16)起动流体分配阀(14)的流体室(12),流体材料源包括真空源(46),阀启动站 32),真空开关(54)和控制器(62)。 阀门启动台(32)具有一个罩(40),一个真空室(36)和一个位于靴子(40)中的真空通道(42)。 真空通道(42)通过真空室(36)与真空源(46)连接。 护罩(40)密封地接合流体分配阀(14)的阀喷嘴(28),使得真空室(36)将真空源(46)与流体室(12)连接。 真空开关(54)经由真空室(36)与真空通道(42)联接,并且基于真空室(36)中的真空水平具有打开和关闭位置。 基于真空开关(54)是打开还是关闭,控制器(62)与真空源(46)和真空开关(54)电连接并控制流体分配阀(14)的启动。

    METHODS FOR CONTINUOUSLY MOVING A FLUID DISPENSER WHILE DISPENSING AMOUNTS OF A FLUID MATERIAL
    4.
    发明申请
    METHODS FOR CONTINUOUSLY MOVING A FLUID DISPENSER WHILE DISPENSING AMOUNTS OF A FLUID MATERIAL 有权
    流体分配器中流体分配器连续移动的方法

    公开(公告)号:US20090078720A1

    公开(公告)日:2009-03-26

    申请号:US11859176

    申请日:2007-09-21

    IPC分类号: G01F11/10

    摘要: Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.

    摘要翻译: 在流体分配器连续移动的同时将流体材料施加到诸如电路板的基底上的方法。 一些方法通常包括通过执行基板上的预测和实际着陆位置的统计比较,或在每个分配位置处的分配器的预测位置和实际位置来校正每个分配量的流体材料的分配位置。 其他方法通常包括在通过针对分配器的运动的伺服循环所指定的校正因子校正的分配位置处引发流体材料的量的分配,或通过由计时器提供的部分伺服循环所指定的校正因子 。

    Jetting dispenser with multiple jetting nozzle outlets
    5.
    发明申请
    Jetting dispenser with multiple jetting nozzle outlets 审中-公开
    喷射分配器具有多个喷嘴出口

    公开(公告)号:US20070145164A1

    公开(公告)日:2007-06-28

    申请号:US11315457

    申请日:2005-12-22

    IPC分类号: B05B1/30

    摘要: A jetting dispenser has a dispenser body with a fluid channel and a fluid channel outlet within the fluid channel. A valve member is movable within the fluid channel for selective contact with a valve seat near the fluid channel outlet. A jetting nozzle is adapted to be coupled to the dispenser body, adjacent the channel outlet, and has a nozzle body with a plurality of nozzle outlets in fluid communication with the channel outlet via a plurality of fluid passages through the nozzle body. The valve member is moved by a valve driver to contact the valve seat and impart momentum to liquid material supplied to the dispenser such that a plurality of droplets of liquid material are simultaneously jetted from the plurality of nozzle outlets.

    摘要翻译: 喷射分配器具有分配器本体,其具有流体通道和流体通道内的流体通道出口。 阀构件可在流体通道内移动,用于与流体通道出口附近的阀座选择性接触。 喷射喷嘴适于联接到分配器主体,邻近通道出口,并且具有喷嘴主体,该喷嘴主体具有多个喷嘴出口,其经​​由多个通过喷嘴体的流体通道与通道出口流体连通。 阀构件由阀驱动器移动以接触阀座并且向供给到分配器的液体材料赋予动量,使得多个液体材料液滴从多个喷嘴出口同时喷射。

    Method of conformal coating using noncontact dispensing
    6.
    发明申请
    Method of conformal coating using noncontact dispensing 审中-公开
    使用非接触式分配的保形涂层方法

    公开(公告)号:US20050095366A1

    公开(公告)日:2005-05-05

    申请号:US10698859

    申请日:2003-10-31

    摘要: A method of noncontact dispensing is provided for conformal coating applications by jetting a viscous material onto a substrate. Dispensing by a jetting process results in small wetted areas thus providing highly discrete and selective conformal coating capabilities. Enhanced selectivity permits the coating of small areas and geometries and provides excellent edge definition between coated and uncoated areas.

    摘要翻译: 通过将粘性材料喷射到基底上,提供了非接触式分配方法,用于保形涂层应用。 通过喷射过程分配会导致小的湿润区域,从而提供高度离散和选择性的保形涂布能力。 增强的选择性允许涂覆小面积和几何形状,并在涂层和未涂覆区域之间提供优异的边缘定义。

    Thermal enhancement approach using solder compositions in the liquid state
    7.
    发明授权
    Thermal enhancement approach using solder compositions in the liquid state 失效
    使用焊料组合物处于液态的热增强方法

    公开(公告)号:US06656770B2

    公开(公告)日:2003-12-02

    申请号:US09874826

    申请日:2001-06-05

    IPC分类号: H01L2144

    摘要: Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips. The electronic module cover is a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling. The cap-heat exchanger cover is constructed to be compliant, and to contact both the IC chip and substrate in order to provide, in conjunction with the solder composition, a path of high thermal conduction (low thermal resistance) from the IC chip to the heat exchanger to the ambient air.

    摘要翻译: 引入焊料组合物到IC芯片与其相关联的热交换器盖之间的界面。 焊料组合物具有包含IC芯片工作温度范围的固相线 - 液相线温度范围。 焊料组合物具有通过由于与集成电路芯片的热循环相关的温度波动而导致的每个温度升高和降低而改变状态或相位而吸收和排除热能的所需性质。电子模块盖是具有热量的盖 交换器形成或附接为单个结构,并且由与基底相同的材料制成,或由具有相容的热膨胀系数的材料制成,以减轻热循环期间垂直位移的影响。 盖 - 热交换器盖被构造成柔性,并且与IC芯片和基板接触以便与焊料组合物一起提供从IC芯片到高导热(低热阻)的路径 热交换器到周围空气。

    Zero force heat sink
    8.
    发明授权
    Zero force heat sink 失效
    零力散热器

    公开(公告)号:US06212070B1

    公开(公告)日:2001-04-03

    申请号:US09071897

    申请日:1998-05-05

    IPC分类号: H05K720

    摘要: A heat sink in a heat transfer relationship with a substrate such as an integrated chip, chip carrier, or other electronic package. The heat sink is connected to a frame which is connected to a printed circuit board or other suitable support on which the substrate is positioned. The heat sink, which extends through an aperture in the frame is coupled to a surface of the substrate. The heat sink is mechanically decoupled from the substrate. Large heat sinks may be thermally connected to surface mount substrates mounted using technologies such as ceramic ball or column grid arrays, plastic ball or column grid arrays, or solder balls or columns. The heat sink is attached coaxially through the aperture to the substrate. After assembly and lead/tin or other metallic surface mount interconnects are relaxed such that the substrate and is completely supported by the frame and the heat sink imparts zero or nearly zero downward force. Because the heat sink moves freely within the aperture during assembly, the heat sink package is useful for a variety of different substrates. Preferably, the frame is a plate and a plurality of studs. The plate material are selected to match the thermal expansion of the underlying support, and the stud material matched the thermal expansion of the substrate. Thus, the frame construction allows matching expansion and contraction of the assembly to the underlying substrate and support.

    摘要翻译: 与诸如集成芯片,芯片载体或其它电子封装的衬底的热传递关系的散热器。 散热器连接到框架,该框架连接到印刷电路板或其上放置基板的其它合适的支撑件。 延伸穿过框架中的孔的散热器耦合到衬底的表面。 散热器与基板机械分离。 大型散热器可以热连接到使用诸如陶瓷球或列网格阵列,塑料球或列网格阵列或焊球或列的技术安装的表面安装基板。 散热器同轴地穿过孔径连接到基板。 组装之后,铅/锡或其他金属表面贴装互连件松弛,使得基板并被框架和散热器完全支撑,使零或接近零的向下的力。 因为散热器在组装期间在孔内自由移动,所以散热器封装对于各种不同的衬底是有用的。 优选地,框架是板和多个螺柱。 选择板材以匹配下面的支撑件的热膨胀,并且螺柱材料与基板的热膨胀相匹配。 因此,框架结构允许将组件的膨胀和收缩与下面的衬底和支撑件相匹配。

    System, device, and method for fluid dispensing control
    9.
    发明申请
    System, device, and method for fluid dispensing control 审中-公开
    用于流体分配控制的系统,装置和方法

    公开(公告)号:US20170068257A1

    公开(公告)日:2017-03-09

    申请号:US15254896

    申请日:2016-09-01

    申请人: Horatio Quinones

    发明人: Horatio Quinones

    IPC分类号: G05D7/06 G05B15/02 G01F1/34

    CPC分类号: G05D7/0635 G01F25/0092

    摘要: A system for fluid dispensing control includes a fluid dispensing control device, a fluid dispenser, and a fluid flow meter, such that an intelligent parameterization of the dispensing system includes process variables, which characterize system behavior. The parameterization is used in convergence schemes for attaining defined fluid dispensing targets. Further, the parameterization is used to attain a consistent volumetric fluid dispensing by utilizing feedback controls. A fluid dispensing device includes a processor, a non-transitory memory, an input/output, a dispensing controller, a flow monitor, a parameterization manager, and a data bus. Also disclosed is a method for fluid dispensing control, including: a parameter sweep, logging system response data, processing response data, calculating system response function, calculating dispensing parameters, assessing intrinsic variation, determining variation band, controlling fluid dispense process response, and normalizing mass/volume fluid flow.

    摘要翻译: 用于流体分配控制的系统包括流体分配控制装置,流体分配器和流体流量计,使得分配系统的智能参数化包括表征系统行为的过程变量。 参数化用于达到限定流体分配目标的收敛方案。 此外,参数化用于通过利用反馈控制来获得一致的体积流体分配。 流体分配装置包括处理器,非暂时性存储器,输入/输出,分配控制器,流量监视器,参数化管理器和数据总线。 还公开了一种用于流体分配控制的方法,包括:参数扫描,测井系统响应数据,处理响应数据,计算系统响应函数,计算分配参数,评估固有变化,确定变化带,控制流体分配过程响应和归一化 质量/体积流体流量。

    PNEUMATICALLY-DRIVEN JETTING VALVES WITH VARIABLE DRIVE PIN VELOCITY, IMPROVED JETTING SYSTEMS AND IMPROVED JETTING METHODS
    10.
    发明申请
    PNEUMATICALLY-DRIVEN JETTING VALVES WITH VARIABLE DRIVE PIN VELOCITY, IMPROVED JETTING SYSTEMS AND IMPROVED JETTING METHODS 审中-公开
    具有可变驱动引脚速度,改进的喷射系统和改进的喷射方法的气动驱动喷油阀

    公开(公告)号:US20130052359A1

    公开(公告)日:2013-02-28

    申请号:US13219070

    申请日:2011-08-26

    摘要: An improved pneumatic jetting valve includes a housing with first and second chambers. A pneumatic piston is enclosed between the chambers. First and second solenoid valves are configured to respectively supply air pressure to the chambers and to exhaust the chambers. A controller is operable to regulate the pressurization and venting of the chambers. The controller controls the timing of control signals for the first and second solenoid valves to control the overlap time during which both the first and second chambers are pressurized. By controlling this overlap time, the controller controls the speed of the drive pin of the jetting valve and thereby the speed at which the valve closes to jet a droplet of material. This allows a valve speed to be selected that is most appropriate for the viscosity of the material being jetted. Numerous new methods for utilizing the improved jetting valve and system are disclosed.

    摘要翻译: 改进的气动喷射阀包括具有第一和第二腔室的壳体。 气动活塞被封闭在腔室之间。 第一和第二电磁阀被配置为分别向腔室供应空气压力并排出腔室。 控制器可操作以调节室的加压和排气。 控制器控制第一和第二电磁阀的控制信号的定时,以控制第一和第二腔室被加压的重叠时间。 通过控制该重叠时间,控制器控制喷射阀的驱动销的速度,从而控制阀闭合的速度以喷射液滴。 这允许选择最适合于被喷射材料的粘度的阀门速度。 公开了用于利用改进的喷射阀和系统的许多新方法。