公开(公告)号：US5115111A

公开(公告)日：1992-05-19

申请号：US563014

申请日：1990-08-06

申请人： William M. Fries ,  Thomas L. Ratledge ,  William H. Hill

发明人： William M. Fries ,  Thomas L. Ratledge ,  William H. Hill

IPC分类号： B23K11/31

CPC分类号： B23K11/318

摘要： Two parallel elongated closely spaced electrodes for welding electronic circuit components are mounted for limited rotation about an axis extending generally longitudinally of the electrodes to allow the electrode pair to be oriented with respect to a workpiece without angularly moving the workpiece. The electrodes are mounted in a pair of mutually aligned and mutually insulated bobbins against which are firmly pressed a pair of contacts for conducting weld current between the electrodes. The bobbins and the electrodes mounted therein are free to rotate relative to the fixed contacts, but the latter are firmly pressed against the bobbins to provide increased contact pressure and decreased electrical resistance between the contacts and bobbins and to provide a relatively large surface area for such contact.

摘要翻译： 安装用于焊接电子电路部件的两个平行细长的紧密间隔的电极，用于围绕电极大致纵向延伸的轴线进行有限旋转，以允许电极对相对于工件定向而不使工件成角度地移动。 电极安装在一对相互对准且相互绝缘的线轴中，牢固地按压一对触点，以在电极之间传导焊接电流。 安装在其中的线轴和电极相对于固定触点自由旋转，但是后者被牢固地压靠在线轴上，以提供增加的接触压力和降低的触点和线轴之间的电阻，并为此提供相对较大的表面积 联系。

公开(公告)号：US5138127A

公开(公告)日：1992-08-11

申请号：US738390

申请日：1991-07-31

申请人： William M. Fries ,  Thomas L. Ratledge ,  William H. Hill ,  Joseph E. Donner

发明人： William M. Fries ,  Thomas L. Ratledge ,  William H. Hill ,  Joseph E. Donner

IPC分类号： B23K11/11 ,  B23K11/24 ,  B23K11/31

CPC分类号： B23K11/318

摘要： A parallel-gap welder applies a precisely controlled force to the weld head (40) by means of a solenoid (60) having a plunger (72) aligned with the axis of the welding electrodes (50,52). To precisely control the amount of force applied by the solenoid a load cell (80) is interposed between the weld head (40) and the solenoid plunger (72) to provide a feedback force signal (158) indicative of the force applied by the solenoid. The feedback force signal is used to control current through the solenoid coil (68) and thereby servo the applied force to a force command input. The solenoid plunger (72) and load cell (80) are axially aligned with the axis of the electrodes (50,52) and solenoid force is applied through a universal joint (76,78) connection to assure an in-line driving force on the electrodes.

摘要翻译： 平行间隙焊接机通过具有与焊接电极（50,52）的轴线对准的柱塞（72）的螺线管（60）向焊接头（40）施加精确控制的力。 为了精确地控制由螺线管施加的力的量，称重传感器（80）插入在焊接头（40）和螺线管柱塞（72）之间，以提供反馈力信号（158），该反馈力信号（158）指示螺线管 。 反馈力信号用于控制通过螺线管线圈（68）的电流，从而将所施加的力伺服到力命令输入。 螺线管柱塞（72）和称重传感器（80）与电极（50,52）的轴线轴向对齐，并且通过万向节（76,78）连接施加螺线管力，以确保在线驱动力 电极。

公开(公告)号：US08538188B2

公开(公告)日：2013-09-17

申请号：US12535126

申请日：2009-08-04

申请人： Kathryn R. Watkins ,  Michael McWhorter ,  William H. Hill ,  Jeffrey W. Long ,  Christian Shrauder

发明人： Kathryn R. Watkins ,  Michael McWhorter ,  William H. Hill ,  Jeffrey W. Long ,  Christian Shrauder

IPC分类号： G06K9/42

CPC分类号： G06F17/30212

摘要： A forensically sound image of a computer readable storage medium can be transferred across a low bandwidth communications network. The method can include the step of scanning an image of the computer readable storage medium for redundant data, the redundant data duplicative of locally stored data. The method can also include generating a skeleton image based on the image of the computer readable storage medium by excluding the redundant data from the image of the computer readable storage medium. The method can include transmitting, by a transmitting device, the skeleton image over the communications network to a receiving device to enable reconstruction of an image copy of the computer readable storage medium using the skeleton image and the locally stored data. A receiving device can reconstruct a bit-for-bit copy of the image of the computer readable storage medium.

摘要翻译： 可以在低带宽通信网络上传送计算机可读存储介质的非法声音图像。 该方法可以包括扫描用于冗余数据的计算机可读存储介质的图像的步骤，冗余数据与本地存储的数据重复。 该方法还可以包括通过从计算机可读存储介质的图像排除冗余数据来基于计算机可读存储介质的图像生成骨架图像。 该方法可以包括通过发送设备将骨架图像通过通信网络发送到接收设备，以使得能够使用骨架图像和本地存储的数据来重建计算机可读存储介质的图像副本。 接收设备可以重建计算机可读存储介质的图像的位位复制。

公开(公告)号：US4940875A

公开(公告)日：1990-07-10

申请号：US313932

申请日：1989-02-22

申请人： William H. Hill ,  Joseph E. Donner

发明人： William H. Hill ,  Joseph E. Donner

IPC分类号： B23K11/11 ,  B23K11/31

CPC分类号： B23K11/318 ,  B23K11/31

摘要： A force limiting weld head (11) which includes a supporting structure (13), a pressure barrel (15) and an output member (17) mounted for movement on the supporting structure, a fixed electrode (19) mounted on the supporting structure, a movable electrode (21) driven by the output member, a coupling (23) for drivingly coupling the pressure barrel and the output member. The coupling includes a variable-volume chamber (89) and a piston (77) responsive to overtravel for varying the volume of the chamber.

摘要翻译： 一种力限制焊头（11），其包括安装用于在所述支撑结构上移动的支撑结构（13），压力桶（15）和输出构件（17），安装在所述支撑结构上的固定电极（19） 由输出构件驱动的可动电极（21），用于驱动地连接压力桶和输出构件的联接器（23）。 联接器包括可变容积室（89）和响应于超程以改变室的体积的活塞（77）。

公开(公告)号：US4718591A

公开(公告)日：1988-01-12

申请号：US944704

申请日：1986-12-19

申请人： William H. Hill

发明人： William H. Hill

IPC分类号： B23K20/00 ,  B23K20/10 ,  B23Q1/48 ,  H01L21/60 ,  H01L21/607 ,  H01R43/02 ,  B23K1/06

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/106 ,  B23Q1/4804 ,  H01L24/78 ,  H01R43/0207 ,  B23K2201/32 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14

摘要： A movable open center mounting for the tool of an ultrasonic wire bonding machine employs ball-bearing rollers (22, 24, 30, 32) to permit limited motion of the wire bonding tip (13a) substantially constrained to a vertical line with a minimum of tip skid. The mounting structure which is all positioned on one side of the tool tip includes a frame (10) of inverted U-shape having a pair of mutually spaced ball-bearing rollers (22, 24, 30, 32) on the end of each frame leg and a transducer support (12) positioned between the frame legs and having fixed roller contacting rods (90, 92, 96, 98) extending fore-and-aft between and partly under each of the respective rollers. A pair of springs (80, 82) urges the transducer support upwardly to press the fixed rods against the roller surfaces, allowing the transducer support to effectively rock about a center of motion (120) that is well below the bonder frame and transducer support, with the rocking motion being so constrained that the bonder tip moves substantially in a straight vertical line for small displacements.

摘要翻译： 用于超声波引线接合机的工具的可移动开放中心安装件使用滚珠轴承辊（22,24,30,32）来允许线接合尖端（13a）的有限运动基本上被约束到垂直线，其中最小 提示滑行 全部位于工具尖端一侧的安装结构包括：倒U形的框架（10），其在每个框架的端部上具有一对相互间隔开的滚珠轴承辊（22,24,30,32） 腿部和位于框架腿之间的换能器支撑件（12），并且具有在每个相应辊之间并部分地在每个相应辊之间前后延伸的固定辊接触杆（90,92,96,98）。 一对弹簧（80,82）向上推动换能器支撑以将固定杆压靠在滚子表面上，从而允许换能器支撑件有效地围绕紧密接合框架和换能器支撑的运动中心（120）摇动， 摇摆运动受到限制，使得接合器尖端基本上在直线垂直线上移动以进行小位移。

公开(公告)号：US4600138A

公开(公告)日：1986-07-15

申请号：US634237

申请日：1984-07-25

申请人： William H. Hill

发明人： William H. Hill

IPC分类号： H01L21/60 ,  H01L21/00 ,  H01R43/02 ,  B23K31/02

CPC分类号： H01L24/85 ,  H01R43/0207 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/20752

摘要： A bonding tool and clamp assembly is disclosed and includes an upper wire guide (23,51) and a bonding tool (17,75) having a short guide hole (45) adjacent the heel of the bonding tool foot (41). The bonding tool tip (17a) includes a clamping surface (47) adjacent the guide hole (45); and a clamp (21b,49b) is selectively forced toward the clamping surface (47) to clamp the bonding wire (39,77). The clamp (21b,49b) is biased toward the clamping surface by a spring (37,73), and is released from the clamping surface by an electromagnet (29,57).

摘要翻译： 公开了焊接工具和夹具组件，并且包括具有邻近焊接工具脚（41）的跟部的短引导孔（45）的上导线引导件（23,51）和接合工具（17,75）。 接合工具尖端（17a）包括邻近引导孔（45）的夹紧表面（47）; 并且钳位件（21b，49b）选择性地被迫朝向夹紧表面（47）以夹紧接合线（39,77）。 夹具（21b，49b）通过弹簧（37,73）向夹紧表面偏置，并通过电磁体（29,57）从夹紧表面释放。

公开(公告)号：US6068171A

公开(公告)日：2000-05-30

申请号：US113665

申请日：1998-07-10

申请人： William H. Hill ,  John B. Gabaldon ,  Todd G. Wieseler

发明人： William H. Hill ,  John B. Gabaldon ,  Todd G. Wieseler

IPC分类号： B23K20/00 ,  B65H51/20 ,  B65H59/10 ,  B65H20/00

CPC分类号： H01L24/78 ,  B23K20/004 ,  B65H51/205 ,  B65H59/105 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01033 ,  H01L2924/14

摘要： A wire conveyance system is provided for a wire bonding machine having, in series, a first wire handler, a wire slacking device and a second wire handler. The wire slacking device includes a wire support chamber having a substantially enclosed bottom, opposing first and second vertical sidewalls, a substantially open top, a back opening and a front opening. The wire slacking device further includes a pressurized fluid source and first and second fluid orifices for receiving a pressurized fluid from the pressurized fluid source. The fluid orifices extend through the first or second sidewall of the wire support chamber with the second fluid orifice being positioned downstream of the first fluid orifice. First and second fluid paths are provided in fluid communication with the pressurized fluid source via the first and second fluid orifices. The first and second fluid paths extend upward between the first and second sidewalls of the wire support chamber and out the open top. A wire support path extends laterally through the wire support chamber above the first and second fluid orifices. The wire support path is substantially contactless with respect to the wire slacking device.

摘要翻译： 提供了一种用于线焊机的电线传送系统，其串联地具有第一电线处理器，电线松弛装置和第二电线处理器。 线材松弛装置包括线支撑室，其具有基本封闭的底部，相对的第一和第二垂直侧壁，基本上敞开的顶部，后开口和前开口。 钢丝松弛装置还包括加压流体源和用于从加压流体源接收加压流体的第一和第二流体孔。 流体孔口延伸穿过线材支撑室的第一或第二侧壁，第二流体孔口位于第一流体孔口的下游。 第一和第二流体通道经由第一和第二流体孔口与加压流体源流体连通地设置。 第一和第二流体路径在线支撑室的第一和第二侧壁之间向上延伸并且从开口顶部延伸出来。 线支撑路径横向延伸穿过第一和第二流体孔之上的线支撑室。 电线支撑路径相对于电线松弛装置基本上是非接触的。

公开(公告)号：US4858819A

公开(公告)日：1989-08-22

申请号：US174566

申请日：1988-03-29

申请人： William H. Hill ,  Dale W. Cawelti

发明人： William H. Hill ,  Dale W. Cawelti

IPC分类号： H01L21/00

CPC分类号： H01L24/85 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48096 ,  H01L2224/4847 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/78822 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/14

摘要： Wire bonds are closely spaced about the edge of a semiconductor chip device (150) in an orthogonal array. Even though the wires may have a fan out pattern to their second bond locations, close spacing of the first bond pads is achieved by use of rectangular pads (154) having their long dimensions all perpendicular to the chip edge, making all of the first bonds along lines perpendicular to the chip edge and then bending the wire to extend to the second bond.

摘要翻译： 引线键以正交阵列围绕半导体芯片器件（150）的边缘紧密间隔开。 即使电线可能具有到其第二接合位置的扇形图案，通过使用其长度尺寸全部垂直于芯片边缘的矩形焊盘（154）来实现第一接合焊盘的紧密间隔，使得所有第一接合 沿着与芯片边缘垂直的线，然后弯曲导线以延伸到第二接合。

公开(公告)号：US4012839A

公开(公告)日：1977-03-22

申请号：US418997

申请日：1973-11-26

申请人： William H. Hill

发明人： William H. Hill

IPC分类号： A61K6/00 ,  A61K6/02 ,  A61K5/02

CPC分类号： A61K6/0017 ,  A61K6/0067

摘要： In the well-known technique of disinfecting caries-infected or potentially caries-infected dental tissue with silver nitrate, silver thiocyanate or its complexes have been substituted for silver nitrate with excellent disinfecting results and lowered side effects, e.g., with lowered toxicity toward dental tissues and mouth membranes and less blackening of exposed portions of the teeth.

摘要翻译： 在用硝酸银消毒龋齿感染或潜在的龋齿感染的牙科组织的众所周知的技术中，硫氰酸银或其复合物已经被硝酸银代替，具有优异的消毒结果和降低的副作用，例如对牙齿组织的毒性降低 和口膜，并且牙齿的暴露部分的较少变黑。

公开(公告)号：US5091825A

公开(公告)日：1992-02-25

申请号：US343756

申请日：1989-04-26

申请人： William H. Hill ,  Dale W. Cawelti

发明人： William H. Hill ,  Dale W. Cawelti

IPC分类号： H01L21/00

CPC分类号： H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/4809 ,  H01L2224/48096 ,  H01L2224/48472 ,  H01L2224/49052 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/14

摘要： Wire bonds are closely spaced about the edge of a semiconductor chip device (150) in an orthogonal array. Even though the wires may have a fan out pattern to their second bond locations, close spacing of the first bond pads is achieved by use of rectangular pads (154) having their long dimensions all perpendicular to the chip edge, making all of the first bonds along lines perpendicular to the chip edge and then bending the wire to extend to the second bond.

摘要翻译： 引线键以正交阵列围绕半导体芯片器件（150）的边缘紧密间隔开。 即使电线可能具有到其第二接合位置的扇形图案，通过使用其长度尺寸全部垂直于芯片边缘的矩形焊盘（154）来实现第一接合焊盘的紧密间隔，使得所有第一接合 沿着与芯片边缘垂直的线，然后弯曲导线以延伸到第二接合。