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    Apparatus for underfilling semiconductor devices
    9.
    发明授权
    Apparatus for underfilling semiconductor devices 失效
    用于底部填充半导体器件的设备

    公开(公告)号：US06352423B1

    公开(公告)日：2002-03-05

    申请号：US09567165

    申请日：2000-05-08

    申请人： Alec J. Babiarz ,  Carlos Edward Bouras ,  Drusilla Bertone Cursi ,  Alan Ray Lewis ,  Jason Thomas Vint

    发明人： Alec J. Babiarz ,  Carlos Edward Bouras ,  Drusilla Bertone Cursi ,  Alan Ray Lewis ,  Jason Thomas Vint

    IPC分类号： H01L2144

    CPC分类号： H01L21/67126 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/01077 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00

    摘要： A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to encapsulate a plurality of electrical interconnections formed between the semiconductor device and the substrate. A seal is provided between the semiconductor device and the substrate to seal the gap along multiple sides of the device, while the gap is left unsealed along at least one side of the device to permit fluid communication with the gap. The viscous underfill material is dispensed adjacent the at least one side of the device along which the gap is unsealed, and a pressure differential is created across the underfill material to draw the underfill material into the gap and thereby encapsulate the electrical interconnections.

    摘要翻译： 一种在多面半导体器件与具有粘性底部填充材料的衬底之间填充间隙的方法和装置。 将粘性底部填充材料移动到间隙中以封装形成在半导体器件和衬底之间的多个电互连。 在半导体器件和衬底之间提供密封件，以沿着器件的多个边缘密封间隙，同时间隙沿着器件的至少一侧被开封以允许与间隙的流体连通。 粘性底部填充材料邻近装置的至少一侧被分配，沿间隙开口封闭，并且在底部填充材料之间产生压差，以将底部填充材料拉入间隙中，从而封装电气互连。

    Method for underfilling semiconductor devices
    10.
    发明授权
    Method for underfilling semiconductor devices 有权
    底部填充半导体器件的方法

    公开(公告)号：US06255142B1

    公开(公告)日：2001-07-03

    申请号：US09430408

    申请日：1999-10-29

    申请人： Alec J. Babiarz ,  Carlos Edward Bouras ,  Drusilla Bertone Cursi ,  Alan Ray Lewis ,  Jason Thomas Vint

    发明人： Alec J. Babiarz ,  Carlos Edward Bouras ,  Drusilla Bertone Cursi ,  Alan Ray Lewis ,  Jason Thomas Vint

    IPC分类号： H01L2144

    CPC分类号： H01L21/67126 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/01077 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00

    摘要： A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to encapsulate a plurality of electrical interconnections formed between the semiconductor device and the substrate. A seal is provided between the semiconductor device and the substrate to seal the gap along multiple sides of the device, while the gap is left unsealed along at least one side of the device to permit fluid communication with the gap. The viscous underfill material is dispensed adjacent the at least one side of the device along which the gap is unsealed, and a pressure differential is created across the underfill material to draw the underfill material into the gap and thereby encapsulate the electrical interconnections.

    摘要翻译： 一种在多面半导体器件与具有粘性底部填充材料的衬底之间填充间隙的方法和装置。 将粘性底部填充材料移动到间隙中以封装形成在半导体器件和衬底之间的多个电互连。 在半导体器件和衬底之间提供密封件，以沿着器件的多个边缘密封间隙，同时间隙沿着器件的至少一侧被开封以允许与间隙的流体连通。 粘性底部填充材料邻近装置的至少一侧被分配，沿间隙开口封闭，并且在底部填充材料之间产生压差，以将底部填充材料拉入间隙中，从而封装电气互连。