公开(公告)号：US09146196B2

公开(公告)日：2015-09-29

申请号：US12936643

申请日：2009-07-09

申请人： Alec Babiarz ,  Stephane Etienne ,  Owen Yikon Sit

发明人： Alec Babiarz ,  Stephane Etienne ,  Owen Yikon Sit

IPC分类号： G06K9/00 ,  G01N21/95

CPC分类号： H01L22/26 ,  G01N21/95 ,  H01L21/563 ,  H01L21/67126 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： Systems and methods for automated inspection of fillet formation along on or more peripheral edges (13a) of a packaged microelectronic device (14) that is attached to a supporting substrate (16), such system (10) including a feedback loop for controlling fillet formation More specifically, the system (10) includes a dispensing system (18) configured for dispensing underfill material (22) onto the supporting substrate (16) The system (19) further includes an automated optical inspection (AOI) system (19) configured for determining a value of a measurable attribute of the fillet (12), such as whether the fillet (12) is properly dimensioned, i e, sized and shaped A feedback loop (66) is included between the dispensing system (18) and automated optical inspection system (19).

摘要翻译： 用于自动检查连接到支撑衬底（16）的封装的微电子器件（14）的沿着或更多的周边边缘（13a）的圆角形状的系统和方法，所述系统（10）包括用于控制圆角形成的反馈回路 更具体地，系统（10）包括配置用于将底部填充材料（22）分配到支撑衬底（16）上的分配系统（18）。系统（19）还包括自动光学检查（AOI）系统（19） 确定所述圆角（12）的可测量属性的值，诸如所述圆角（12）是否适当地定尺寸，即尺寸和形状。所述分配系统（18）和自动光学检查（18）之间包括反馈回路（66） 系统（19）。

公开(公告)号：US08181468B2

公开(公告)日：2012-05-22

申请号：US12817546

申请日：2010-06-17

申请人： Erik Fiske ,  Horatio Quinones ,  Philip P. Maiorca ,  Alec Babiarz ,  Robert Ciardella

发明人： Erik Fiske ,  Horatio Quinones ,  Philip P. Maiorca ,  Alec Babiarz ,  Robert Ciardella

IPC分类号： F25B21/02

CPC分类号： B05C5/001 ,  B05C5/0225 ,  B05C5/0237 ,  B05C11/1034 ,  H05K13/046

摘要： Apparatus and methods for dispensing small amounts of a viscous material onto a workpiece. The narrow-profile dispensing apparatus includes a fluid chamber, a nozzle, and a valve seat disk representing individual components that are removable from a main body of the dispensing apparatus for cleaning and/or replacement. The nozzle is coupled with the fluid chamber by a heat transfer body that may be cooled by, for example, a cooling fluid routed through an air pathway defined in the heat transfer body. The main body of the dispensing apparatus may be cooled by air exhausted from an air cavity of a pneumatic actuator regulating the movement of a needle to control the flow of viscous material in the dispensing apparatus.

摘要翻译： 将少量粘性物质分配到工件上的装置和方法。 窄型分配装置包括流体室，喷嘴和阀座盘，其表示从用于清洁和/或更换的分配装置的主体可移除的各个部件。 喷嘴通过传热体与流体室耦合，传热体可以通过例如通过传热体中限定的空气通路布置的冷却流体来冷却。 分配装置的主体可以由调节针的移动的气动致动器的空气腔排出的空气来冷却，以控制分配装置中的粘性物质的流动。

公开(公告)号：US20050001869A1

公开(公告)日：2005-01-06

申请号：US10838508

申请日：2004-05-04

申请人： Ron Abernathy ,  Alec Babiarz ,  Nicholas Barendt ,  Robert Ciardella ,  James Cooper ,  Kenneth Espenschied ,  Erik Fiske ,  Christopher Giusti ,  Patrick Jenkins ,  Alan Lewis ,  Raymond Merritt ,  Naoya Nagano ,  Horatio Quinones ,  Thomas Ratledge ,  Joe Sherman ,  Floriana Suriawidjaja ,  Todd Weston

发明人： Ron Abernathy ,  Alec Babiarz ,  Nicholas Barendt ,  Robert Ciardella ,  James Cooper ,  Kenneth Espenschied ,  Erik Fiske ,  Christopher Giusti ,  Patrick Jenkins ,  Alan Lewis ,  Raymond Merritt ,  Naoya Nagano ,  Horatio Quinones ,  Thomas Ratledge ,  Joe Sherman ,  Floriana Suriawidjaja ,  Todd Weston

IPC分类号： B05D1/26 ,  B05B12/02 ,  B05C5/00 ,  B05C5/02 ,  B05C9/14 ,  B05C11/10 ,  B05D3/00 ,  H05K3/34 ,  B41J29/38

CPC分类号： B05C11/1034 ,  B05C5/001 ,  B05C5/0225 ,  B05C11/10 ,  G05D7/0629 ,  H05K3/28 ,  H05K3/3484 ,  H05K2203/0736

摘要： A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.

摘要翻译： 粘性材料非接触喷射系统具有安装成相对于表面相对运动的喷射分配器。 控制器可操作以使喷射分配器喷射作为粘性材料点施加到表面的粘性物质液滴。 诸如相机或称重秤的装置连接到控制器，并且提供表示应用于表面的点的与尺寸有关的物理特性的反馈信号。 响应于尺寸相关的物理特性反馈，随后施加的点的尺寸相关的物理特性由加热和冷却或喷射分配器中的活塞行程调节来控制。 还提供分配材料体积控制和速度偏移补偿。

公开(公告)号：US20110063606A1

公开(公告)日：2011-03-17

申请号：US12936643

申请日：2009-07-09

申请人： Alec Babiarz ,  Stephane Etienne ,  Owen Yikon Sit

发明人： Alec Babiarz ,  Stephane Etienne ,  Owen Yikon Sit

IPC分类号： G01N21/00

CPC分类号： H01L22/26 ,  G01N21/95 ,  H01L21/563 ,  H01L21/67126 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： Systems and methods for automated inspection of fillet formation along on or more peripheral edges (13a) of a packaged microelectronic device (14) that is attached to a supporting substrate (16), such system (10) including a feedback loop for controlling fillet formation More specifically, the system (10) includes a dispensing system (18) configured for dispensing underfill material (22) onto the supporting substrate (16) The system (19) further includes an automated optical inspection (AOI) system (19) configured for determining a value of a measurable attribute of the fillet (12), such as whether the fillet (12) is properly dimensioned, i e, sized and shaped A feedback loop (66) is included between the dispensing system (18) and automated optical inspection system (19)

摘要翻译： 用于自动检查连接到支撑衬底（16）的封装的微电子器件（14）的沿着或更多的周边边缘（13a）的圆角形状的系统和方法，所述系统（10）包括用于控制圆角形成的反馈回路 更具体地，系统（10）包括配置用于将底部填充材料（22）分配到支撑衬底（16）上的分配系统（18）。系统（19）还包括自动光学检查（AOI）系统（19） 确定所述圆角（12）的可测量属性的值，诸如所述圆角（12）是否适当地定尺寸，即尺寸和形状。所述分配系统（18）和自动光学检查（18）之间包括反馈回路（66） 系统（19）

公开(公告)号：US20070145164A1

公开(公告)日：2007-06-28

申请号：US11315457

申请日：2005-12-22

申请人： Mani Ahmadi ,  Alec Babiarz ,  Robert Ciardella ,  Liang Fang ,  Erik Fiske ,  Horatio Quinones ,  Thomas Ratledge

发明人： Mani Ahmadi ,  Alec Babiarz ,  Robert Ciardella ,  Liang Fang ,  Erik Fiske ,  Horatio Quinones ,  Thomas Ratledge

IPC分类号： B05B1/30

CPC分类号： B05C5/0275 ,  B05C5/0225 ,  B05C11/1034

摘要： A jetting dispenser has a dispenser body with a fluid channel and a fluid channel outlet within the fluid channel. A valve member is movable within the fluid channel for selective contact with a valve seat near the fluid channel outlet. A jetting nozzle is adapted to be coupled to the dispenser body, adjacent the channel outlet, and has a nozzle body with a plurality of nozzle outlets in fluid communication with the channel outlet via a plurality of fluid passages through the nozzle body. The valve member is moved by a valve driver to contact the valve seat and impart momentum to liquid material supplied to the dispenser such that a plurality of droplets of liquid material are simultaneously jetted from the plurality of nozzle outlets.

摘要翻译： 喷射分配器具有分配器本体，其具有流体通道和流体通道内的流体通道出口。 阀构件可在流体通道内移动，用于与流体通道出口附近的阀座选择性接触。 喷射喷嘴适于联接到分配器主体，邻近通道出口，并且具有喷嘴主体，该喷嘴主体具有多个喷嘴出口，其经​​由多个通过喷嘴体的流体通道与通道出口流体连通。 阀构件由阀驱动器移动以接触阀座并且向供给到分配器的液体材料赋予动量，使得多个液体材料液滴从多个喷嘴出口同时喷射。

公开(公告)号：US08796075B2

公开(公告)日：2014-08-05

申请号：US13548965

申请日：2012-07-13

申请人： Alec Babiarz ,  Horatio Quinones ,  Thomas L. Ratledge

发明人： Alec Babiarz ,  Horatio Quinones ,  Thomas L. Ratledge

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  B23K37/00 ,  H01L21/324 ,  H01L24/27 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01029 ,  H05K13/0465 ,  H01L2924/00 ,  H01L2924/3512

摘要： Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.

摘要翻译： 在真空辅助下应用底部填充物的方法。 该方法可以包括将底部填充物分配到靠近附接到衬底的电子设备的至少一个外部边缘的衬底上。 电子设备和基板之间的空间通过底部填充物中的至少一个间隙被排出。 该方法还包括加热底部填充物以使底部填充物流入空间。 因为在开始流动之前在空间的开放部分中提供真空条件，所以底部填充排泄的发生率降低。

公开(公告)号：US20110114673A1

公开(公告)日：2011-05-19

申请号：US13009927

申请日：2011-01-20

申请人： Erik Fiske ,  Horatio Quinones ,  Phil Maiorca ,  Alec Babiarz ,  Robert Ciardella

发明人： Erik Fiske ,  Horatio Quinones ,  Phil Maiorca ,  Alec Babiarz ,  Robert Ciardella

IPC分类号： B67D7/80

CPC分类号： B05C5/001 ,  B05C5/0225 ,  B05C5/0237 ,  B05C11/1034 ,  H05K13/046

摘要： Apparatus and methods for dispensing small amounts of a viscous material onto a workpiece. The narrow-profile dispensing apparatus includes a fluid chamber, a nozzle, and a valve seat disk representing individual components that are removable from a main body of the dispensing apparatus for cleaning and/or replacement. The nozzle is coupled with the fluid chamber by a heat transfer body that may be cooled by, for example, a cooling fluid routed through an air pathway defined in the heat transfer body. The main body of the dispensing apparatus may be cooled by air exhausted from an air cavity of a pneumatic actuator regulating the movement of a needle to control the flow of viscous material in the dispensing apparatus.

摘要翻译： 将少量粘性物质分配到工件上的装置和方法。 窄型分配装置包括流体室，喷嘴和阀座盘，其表示从用于清洁和/或更换的分配装置的主体可移除的各个部件。 喷嘴通过传热体与流体室耦合，传热体可以通过例如通过传热体中限定的空气通路布置的冷却流体来冷却。 分配装置的主体可以由调节针的移动的气动致动器的空气腔排出的空气来冷却，以控制分配装置中的粘性物质的流动。

公开(公告)号：US20070069041A1

公开(公告)日：2007-03-29

申请号：US11235877

申请日：2005-09-27

申请人： Horatio Quinones ,  Thomas Ratledge ,  Robert Ciardella ,  Alec Babiarz ,  Erik Fiske ,  Mark Meier ,  Chris Giusti ,  Liang Fang

发明人： Horatio Quinones ,  Thomas Ratledge ,  Robert Ciardella ,  Alec Babiarz ,  Erik Fiske ,  Mark Meier ,  Chris Giusti ,  Liang Fang

IPC分类号： A01G27/00 ,  B67D5/08

CPC分类号： H05K13/046

摘要： Systems and methods for dispensing or jetting a viscous material. The systems include an electronic controller and a jetting dispenser operatively coupled with the electronic controller. The systems further include at least one sensor that senses a system dispensing parameter and communicates an output signal representing the sensed parameter to the electronic controller for controlling system operation. In pneumatically-actuated jetting dispensers, a sensor may sense the fluid pressure in the air cavity of the pneumatic actuator. In jetting dispensers with a movable needle valve, a sensor may sense the displacement of the needle shaft. In other jetting dispensers, a sensor may sense the vibration of the jetting dispenser.

摘要翻译： 用于分配或喷射粘性材料的系统和方法。 该系统包括电子控制器和与电子控制器可操作耦合的喷射分配器。 系统还包括至少一个传感器，其感测系统分配参数并将表示所感测参数的输出信号传达到电子控制器以控制系统操作。 在气动致动喷射分配器中，传感器可以感测气动致动器的空气腔中的流体压力。 在具有可移动针阀的喷射分配器中，传感器可以感测针轴的位移。 在其他喷射分配器中，传感器可以感测喷射分配器的振动。

公开(公告)号：US20050082670A1

公开(公告)日：2005-04-21

申请号：US10937053

申请日：2004-09-09

申请人： Horatio Quinones ,  Liang Fang ,  Dave Ellis ,  Erik Fiske ,  Thomas Ratledge ,  Alec Babiarz ,  Robert Ciardella

发明人： Horatio Quinones ,  Liang Fang ,  Dave Ellis ,  Erik Fiske ,  Thomas Ratledge ,  Alec Babiarz ,  Robert Ciardella

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L21/44 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/563 ,  H01L23/3114 ,  H01L23/3171 ,  H01L24/10 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/13022 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01322

摘要： Apparatus and methods for preapplying discrete amounts of underfill material of a component on a component substrate before the solder bumps of the component are joined by reflow with a packaging substrate to create a microelectronics package. The underfill material is preferably applied by a noncontact dispensing technique as discrete amounts at interstitial areas on an active surface of the component substrate defined between nearest-neighbor solder bumps. The underfill material forms a continuous meniscus of underfill material across the interstitial areas not occupied by the solder bumps and forms a collar encircling each of the solder bumps. The cured underfill material strengthens and improves the reliability of the solder joints formed by the bump reflow.

摘要翻译： 在组件的焊料凸起之前，通过用封装衬底回流来连接组件衬底上的分量的底部填充材料的装置和方法，以形成微电子封装。 底部填充材料优选通过非接触分配技术作为在最近邻焊料凸块之间限定的部件衬底的有源表面上的间隙区域处的离散量施加。 底部填充材料在未被焊料凸块占据的间隙区域上形成底部填充材料的连续弯液面，并形成环绕每个焊料凸块的凸缘。 固化的底部填充材料增强并提高由凸点回流形成的焊点的可靠性。

公开(公告)号：US08578729B2

公开(公告)日：2013-11-12

申请号：US13454579

申请日：2012-04-24

申请人： Erik Fiske ,  Horatio Quinones ,  Phillip P. Maiorca ,  Alec Babiarz ,  Robert Ciardella

发明人： Erik Fiske ,  Horatio Quinones ,  Phillip P. Maiorca ,  Alec Babiarz ,  Robert Ciardella

IPC分类号： F25B13/00

CPC分类号： B05C5/001 ,  B05C5/0225 ,  B05C5/0237 ,  B05C11/1034 ,  H05K13/046

摘要： Apparatus and methods for dispensing small amounts of a viscous material onto a workpiece. The narrow-profile dispensing apparatus includes a fluid chamber, a nozzle, and a valve seat disk representing individual components that are removable from a main body of the dispensing apparatus for cleaning and/or replacement. The nozzle is coupled with the fluid chamber by a heat transfer body that may be cooled by, for example, a cooling fluid routed through an air pathway defined in the heat transfer body. The main body of the dispensing apparatus may be cooled by air exhausted from an air cavity of a pneumatic actuator regulating the movement of a needle to control the flow of viscous material in the dispensing apparatus.

摘要翻译： 将少量粘性物质分配到工件上的装置和方法。 窄型分配装置包括流体室，喷嘴和阀座盘，其表示从用于清洁和/或更换的分配装置的主体可移除的各个部件。 喷嘴通过传热体与流体室耦合，传热体可以通过例如通过传热体中限定的空气通路布置的冷却流体来冷却。 分配装置的主体可以由调节针的移动的气动致动器的空气腔排出的空气来冷却，以控制分配装置中的粘性物质的流动。