公开(公告)号：US20160183374A1

公开(公告)日：2016-06-23

申请号：US14575775

申请日：2014-12-18

Applicant: Mani Prakash ,  Thomas T. Holden ,  Jeffory L. Smalley ,  Ram S. Viswanath ,  Bassam N. Coury ,  Dimitrios Ziakas ,  Chong J. Zhao ,  Jonathan W. Thibado ,  Gregorio R. Murtagian ,  Kuang C. Liu ,  Rajasekaran Swaminathan ,  Zhichao Zhang ,  John M. Lynch ,  David J. Llapitan ,  Sanka Ganesan ,  Xiang Li ,  George Vergis

Inventor： Mani Prakash ,  Thomas T. Holden ,  Jeffory L. Smalley ,  Ram S. Viswanath ,  Bassam N. Coury ,  Dimitrios Ziakas ,  Chong J. Zhao ,  Jonathan W. Thibado ,  Gregorio R. Murtagian ,  Kuang C. Liu ,  Rajasekaran Swaminathan ,  Zhichao Zhang ,  John M. Lynch ,  David J. Llapitan ,  Sanka Ganesan ,  Xiang Li ,  George Vergis

IPC: H05K1/18 ,  H01R12/72 ,  H05K1/11 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L23/00 ,  H01L23/498 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01R12/712 ,  H01R12/79 ,  H05K2201/10159 ,  H05K2201/10325 ,  Y02P70/611

Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

Abstract translation: 公开了可配置的中央处理单元（CPU）封装基板。 描述了包括处理设备接口的封装衬底。 封装衬底还包括设置在封装衬底上的存储器件电接口。 封装衬底还包括靠近存储器件电接口设置的可移除存储器机械接口。 可移除存储器机械接口是允许在将存储器件附接到封装衬底之后容易地从封装衬底移除存储器件。

公开(公告)号：US5926367A

公开(公告)日：1999-07-20

申请号：US987427

申请日：1997-12-09

Applicant: Paul A. Gutierrez ,  Thomas T. Holden

Inventor： Paul A. Gutierrez ,  Thomas T. Holden

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F1/189 ,  G06F1/26

Abstract: An apparatus comprising an enclosure, a power supply circuit and a passive heat removal device is described. Specifically, the enclosure having a plurality of sides defines an air plenum wherein select ones of the plurality of sides have openings disposed therein with a fan disposed within a first of the openings. The power supply circuit, disposed within the enclosure, is operative to provide power to electronic components disposed outside of the enclosure, and to dissipate heat into the air plenum. The passive heat removal device, disposed along a first of said plurality of sides, is operative to transfer heat generated by one or more electronic devices thermally coupled to the outside of the enclosure into the air plenum for evacuation by the fan.

Abstract translation: 描述了包括外壳，电源电路和被动散热装置的装置。 具体而言，具有多个侧面的外壳限定了一个空气压力室，其中多个侧面中的一些侧面具有设置在其中的开口，其中风扇设置在第一开口内。 设置在外壳内的电源电路可操作以向设置在外壳外部的电子元件提供电力，并将热量散发到空气通风室中。 沿着所述多个侧面中的第一侧布置的被动除热装置可操作以将由热耦合到外壳的外部的一个或多个电子装置产生的热量传递到空气增压室中，以由风扇排出。