Abstract:
A pressure type flow rate control apparatus is provided wherein flow rate of fluid passing through an orifice is computed as Qc=KP1 (where K is a proportionality constant) or as Qc=KP2m(P1−P2)n (where K is a proportionality constant, m and n constants) by using orifice upstream side pressure P1 and/or orifice downstream side pressure P2. A fluid passage between the downstream side of a control valve and a fluid supply pipe of the pressure type flow rate control apparatus comprises at least 2 fluid passages in parallel, and orifices having different flow rate characteristics are provided for each of these fluid passages, wherein fluid in a small flow quantity area flows to one orifice for flow control of fluid in the small flow quantity area, while fluid in a large flow quantity area flows to the other orifice for flow control of fluid in the large flow quantity area.
Abstract:
A pressure type flow rate control apparatus is provided wherein flow rate of fluid passing through an orifice is computed as Qc=KP1 (where K is a proportionality constant) or as Qc=KP2m (P1−P2)n (where K is a proportionality constant, m and n constants) by using orifice upstream side pressure P1 and/or orifice downstream side pressure P2. A fluid passage between the downstream side of a control valve and a fluid supply pipe of the pressure type flow rate control apparatus comprises at least 2 fluid passages in parallel, and orifices having different flow rate characteristics are provided for each of these fluid passages, wherein fluid in a small flow quantity area flows to one orifice for flow control of fluid in the small flow quantity area, while fluid in a large flow quantity area flows to the other orifice for flow control of fluid in the large flow quantity area.
Abstract:
A fluid supply device and a fluid supply method capable of stably supplying a supercritical fluid includes a fluid supply device for supplying a fluid in a liquid state before being changed to a supercritical fluid toward a processing chamber. The fluid supply device comprises a condenser that condenses and liquefies a fluid in a gas state, a tank that stores the fluid condensed and liquefied by the condenser, a pump that pressure-feeds the liquefied fluid stored in the tank toward the processing chamber, and a heating means provided to a flow path communicating with a discharge side of the pump and for partially changing the liquid in the flow path to a supercritical fluid.
Abstract:
The invention supplies a quantity Q of gas while dividing at flow rate ratio Q1/Q2 from a gas supply facility equipped with a flow controller. A total quantity Q=Q1+Q2 of gas is supplied into a chamber at flow rate Q1 and Q2 through shower plates fixed to ends of branch supply lines by providing open/close valves with a plurality of branch supply lines GL1 and GL2, respectively, to supply the specified quantity of gas from the gas supply facility, and by utilizing bypass line BL1 on the downstream side of the open/close valve OV1 and branched from GL1, bypass line BL2 on the downstream side of the open/close valve OV2 and branched from GL2, pressure type division quantity controller connected to the bypass line BL1 and the bypass line BL2, a sensor measuring pressure inside branch supply line GL1, and another sensor measuring pressure inside branch supply line GL2.
Abstract:
A fluid supply apparatus with a plurality of flow lines branching out from one regulator for adjustment of pressure, the flow lines being arranged in parallel, wherein a measure is taken that the operation, that is, opening or closing of one flow passage will have no transient effect on the steady flow of the other flow passages. For this purpose, each flow passage is provided with a time delay-type mass flow controller MFC so that when one closed fluid passage is opened, the mass flow controller on that flow passage reaches a set flow rate Qs in a specific delay time nullt from the starting point. Also provided are a method and an apparatus for the above in which a plurality of gas types can be controlled in flow rate with high precision by one pressure-type flow control system. To that end, a formula for calculating the flow rate of a gas is theoretically derived that flows with a pressure ratio not higher than the critical pressure ratio. From that formula, the flow factor is defined, so that the formula may be applied to a number of gas types using flow factors. The method includes calculating the flow rate Qc of a gas passing through an orifice according to formula QcnullKP1 (Knullconstant) with a pressure P1 on an upstream side of the orifice set at twice or more higher than pressure P2 on a downstream side, wherein the flow factor FF for each kind of gas is calculated as follows:FFnull(k/nulls)null2/(nullnull1)null1/(nullnull1)nullnull/null(nullnull1)Rnullnull1/2and wherein, if the calculated flow rate of gas type A is QA, and, when gas type B is allowed to flow through the same orifice under the same pressure on the upstream side and at the same temperature on the upstream side, the flow rate QB is calculated as follows:QBnull(FFB/FFA)QAwhere nullsnullconcentration of gas in standard state; nullnullratio of specific heat of gas; Rnullconstant of gas; Knullproportional constant not depending on the type of gas; FFAnullflow factor of gas type A; and FFBnullflow factor of gas type B.
Abstract:
A coating and developing apparatus for coating a substrate with a plurality of color resists and for developing it after exposure, comprises: a scrubbing unit for scrubbing the substrate; a coating unit having a plurality of resist discharge nozzles for respectively discharging a plurality of color resists on the scrubbed substrate; and a developing unit for developing the substrate coated with the color resists after exposure. Accordingly, reduction in size of apparatus and space savings can be achieved, and manufacturing cost can also be reduced.
Abstract:
An apparatus for feeding gases for use in semiconductor manufacturing reduced in size and manufacturing costs and facilitating maintenance and operation of the gas supply system. The apparatus comprises a plurality of gas supply sources, gas source valves provided on the gas lead-out pipes from the respective gas supply sources, flow rate controllers provided on main gas feed pipes into which the lead-out pipes converge, and gas supply valves provided on the outlet side of the flow rate controllers.
Abstract:
A pressure type flow rate control apparatus is provided wherein flow rate of fluid passing through an orifice is computed as Qc=KP1 (where K is a proportionality constant) or as Qc=KP2m(P1−P2)n (where K is a proportionality constant, m and n constants) by using orifice upstream side pressure P1 and/or orifice downstream side pressure P2. A fluid passage between the downstream side of a control valve and a fluid supply pipe of the pressure type flow rate control apparatus comprises at least 2 fluid passages in parallel, and orifices having different flow rate characteristics are provided for each of these fluid passages, wherein fluid in a small flow quantity area flows to one orifice for flow control of fluid in the small flow quantity area, while fluid in a large flow quantity area flows to the other orifice for flow control of fluid in the large flow quantity area.
Abstract:
The invention supplies a quantity Q of gas while dividing at flow rate ratio Q1/Q2 from a gas supply facility equipped with a flow controller. A total quantity Q=Q1+Q2 of gas is supplied into a chamber at flow rate Q1 and Q2 through shower plates fixed to ends of branch supply lines by providing open/close valves with a plurality of branch supply lines GL1 and GL2, respectively, to supply the specified quantity of gas from the gas supply facility, and by utilizing bypass line BL1 on the downstream side of the open/close valve OV1 and branched from GL1, bypass line BL2 on the downstream side of the open/close valve OV2 and branched from GL2, pressure type division quantity controller connected to the bypass line BL1 and the bypass line BL2, a sensor measuring pressure inside branch supply line GL1, and another sensor measuring pressure inside branch supply line GL2.
Abstract:
A prober of this invention includes a probe card, a main chuck, a shaft member fixed on and extending downwardly from the main chuck, an X table and Y table for retaining the shaft member by use of a guide to be freely movable in a vertical direction, and a contact body fixed on the shaft member. The undersurface of the contact body is made parallel to the mounting surface of the main chuck. The prober further includes an elevation body whose center coincides with an extension line downwardly extending from the test center of the probe card, and an elevation body elevating mechanism for vertically moving the elevation body and a ball provided on the upper portion of the elevation body is slidably set in contact with the undersurface of the contact body.