公开(公告)号：US07514772B2

公开(公告)日：2009-04-07

申请号：US11380128

申请日：2006-04-25

申请人： Tomoki Kobayashi ,  Toshiji Shimada ,  Akinobu Inoue ,  Atsunori Kajiki ,  Hiroyuki Kato ,  Hiroshi Shimizu

发明人： Tomoki Kobayashi ,  Toshiji Shimada ,  Akinobu Inoue ,  Atsunori Kajiki ,  Hiroyuki Kato ,  Hiroshi Shimizu

IPC分类号： H01L23/02

CPC分类号： H01L25/0655 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/97 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2224/48227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1531 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A resin layer in which adhesion to a conductive film is higher than that of a sealing resin to the conductive film is disposed on the sealing resin in which it is difficult to form the conductive film, and wiring patterns electrically connected to electronic components are disposed on the resin layer.

摘要翻译： 在难以形成导电膜的密封树脂上设置有对导电膜的与导电膜的密封树脂的粘附性高的树脂层，并且与电子部件电连接的布线图案配置在 树脂层。

公开(公告)号：US20060231624A1

公开(公告)日：2006-10-19

申请号：US11390705

申请日：2006-03-28

申请人： Tomoki Kobayashi ,  Toshiji Shimada ,  Hiroyuki Kato ,  Hiroshi Shimizu

发明人： Tomoki Kobayashi ,  Toshiji Shimada ,  Hiroyuki Kato ,  Hiroshi Shimizu

IPC分类号： G06K7/08

CPC分类号： G06K7/10346 ,  G06K7/10336 ,  Y10T29/49018 ,  Y10T428/25 ,  Y10T428/32 ,  Y10T428/325

摘要： A reader/writer comprises a circuit board, a communication control portion mounted on the circuit board and configured to perform communication with IC tags, sealing resin for sealing the communication control portion; and an antenna electrically connected to the communication control portion, in which a resin layer is disposed on the sealing resin, the resin layer having a higher adhesiveness to a conductive film used as the antenna than that of the sealing resin, and the antenna is disposed on the resin layer.

摘要翻译： 读写器包括电路板，安装在电路板上并被配置为与IC标签进行通信的通信控制部分，用于密封通信控制部分的密封树脂; 电连接到通信控制部分的天线，其中树脂层设置在密封树脂上，树脂层与用作天线的导电膜的粘合性高于密封树脂，并且天线被布置 在树脂层上。

公开(公告)号：US20060244131A1

公开(公告)日：2006-11-02

申请号：US11380128

申请日：2006-04-25

申请人： Tomoki Kobayashi ,  Toshiji Shimada ,  Akinobu Inoue ,  Atsunori Kajiki ,  Hiroyuki Kato ,  Hiroshi Shimizu

发明人： Tomoki Kobayashi ,  Toshiji Shimada ,  Akinobu Inoue ,  Atsunori Kajiki ,  Hiroyuki Kato ,  Hiroshi Shimizu

IPC分类号： H01L23/34

CPC分类号： H01L25/0655 ,  H01L21/561 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/97 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2224/48227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1531 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A resin layer in which adhesion to a conductive film is higher than that of a sealing resin to the conductive film is disposed on the sealing resin in which it is difficult to form the conductive film, and wiring patterns electrically connected to electronic components are disposed on the resin layer.

摘要翻译： 在难以形成导电膜的密封树脂上设置有对导电膜的与导电膜的密封树脂的粘附性高的树脂层，并且与电子部件电连接的布线图案配置在 树脂层。

公开(公告)号：US07913906B2

公开(公告)日：2011-03-29

申请号：US11390705

申请日：2006-03-28

申请人： Tomoki Kobayashi ,  Toshiji Shimada ,  Hiroyuki Kato ,  Hiroshi Shimizu

发明人： Tomoki Kobayashi ,  Toshiji Shimada ,  Hiroyuki Kato ,  Hiroshi Shimizu

IPC分类号： G06K7/08

CPC分类号： G06K7/10346 ,  G06K7/10336 ,  Y10T29/49018 ,  Y10T428/25 ,  Y10T428/32 ,  Y10T428/325

摘要： A reader/writer comprises a circuit board, a communication control portion mounted on the circuit board and configured to perform communication with IC tags, sealing resin for sealing the communication control portion; and an antenna electrically connected to the communication control portion, in which a resin layer is disposed on the sealing resin, the resin layer having a higher adhesiveness to a conductive film used as the antenna than that of the sealing resin, and the antenna is disposed on the resin layer.

摘要翻译： 读写器包括电路板，安装在电路板上并被配置为与IC标签进行通信的通信控制部分，用于密封通信控制部分的密封树脂; 电连接到通信控制部分的天线，其中树脂层设置在密封树脂上，树脂层与用作天线的导电膜的粘合性高于密封树脂，并且天线被布置 在树脂层上。

公开(公告)号：US07621457B2

公开(公告)日：2009-11-24

申请号：US11333000

申请日：2006-01-17

申请人： Koji Ato ,  Tomoki Kobayashi ,  Toshiji Shimada

发明人： Koji Ato ,  Tomoki Kobayashi ,  Toshiji Shimada

IPC分类号： G06K19/06 ,  G06K7/08

CPC分类号： G06K7/0008 ,  H01L2223/6677 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105

摘要： A reader/writer includes a substrate, a communication control part on the substrate, a molded resin layer sealing the communication control part and an antenna connected to the communication control part. The antenna is provided on the molded resin layer.

摘要翻译： 读取器/写入器包括基板，基板上的通信控制部分，密封通信控制部分的模制树脂层和连接到通信控制部分的天线。 天线设置在模制树脂层上。

公开(公告)号：US20060157568A1

公开(公告)日：2006-07-20

申请号：US11333000

申请日：2006-01-17

申请人： Koji Ato ,  Tomoki Kobayashi ,  Toshiji Shimada

发明人： Koji Ato ,  Tomoki Kobayashi ,  Toshiji Shimada

IPC分类号： G06K7/08

CPC分类号： G06K7/0008 ,  H01L2223/6677 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105

摘要： A reader/writer includes a substrate, a communication control part on the substrate, a molded resin layer sealing the communication control part and an antenna connected to the communication control part. The antenna is provided on the molded resin layer.

公开(公告)号：US20110073648A1

公开(公告)日：2011-03-31

申请号：US12961948

申请日：2010-12-07

申请人： Tomoki KOBAYASHI ,  Toshiji SHIMADA ,  Hiroyuki KATO ,  Hiroshi SHIMIZU

发明人： Tomoki KOBAYASHI ,  Toshiji SHIMADA ,  Hiroyuki KATO ,  Hiroshi SHIMIZU

IPC分类号： G06K7/01 ,  H01P11/00

CPC分类号： G06K7/10346 ,  G06K7/10336 ,  Y10T29/49018 ,  Y10T428/25 ,  Y10T428/32 ,  Y10T428/325

摘要： A reader/writer comprises a circuit board, a communication control portion mounted on the circuit board and configured to perform communication with IC tags, sealing resin for sealing the communication control portion; and an antenna electrically connected to the communication control portion, in which a resin layer is disposed on the sealing resin, the resin layer having a higher adhesiveness to a conductive film used as the antenna than that of the sealing resin, and the antenna is disposed on the resin layer.

摘要翻译： 读写器包括电路板，安装在电路板上并被配置为与IC标签进行通信的通信控制部分，用于密封通信控制部分的密封树脂; 电连接到通信控制部分的天线，其中树脂层设置在密封树脂上，树脂层与用作天线的导电膜的粘合性高于密封树脂，并且天线被布置 在树脂层上。