-
公开(公告)号：US06365963B1
公开(公告)日：2002-04-02
申请号：US09648272
申请日：2000-08-25
申请人： Toshiyasu Shimada
发明人： Toshiyasu Shimada
IPC分类号： H01L2302
CPC分类号： H01L23/49816 , H01L21/563 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/01079 , H01L2924/07802 , H01L2924/07811 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A stacked-chip semiconductor device includes a rigid insulator board having therein a central opening and thereon a wiring pattern, and a base insulator bonded to the rigid insulator board and having a wiring pattern. Both the wiring patterns are connected together via through-holes formed in the rigid insulator board. A first semiconductor chip is mounted on the base insulator film within the opening of the rigid insulator board, whereas a second semiconductor chip is mounted on the rigid insulator board overlying the opening.
摘要翻译： 堆叠式芯片半导体器件包括刚性绝缘体板，其中具有中心开口并且其上具有布线图案，以及接合到刚性绝缘体板并且具有布线图案的基底绝缘体。 两个布线图案通过形成在刚性绝缘板上的通孔连接在一起。 第一半导体芯片安装在刚性绝缘体板的开口内的基底绝缘膜上，而第二半导体芯片安装在覆盖开口的刚性绝缘体板上。
-
公开(公告)号：US06538335B2
公开(公告)日：2003-03-25
申请号：US10057572
申请日：2002-01-24
申请人： Toshiyasu Shimada , Rieka Ohuchi
发明人： Toshiyasu Shimada , Rieka Ohuchi
IPC分类号： H01L2348
CPC分类号： H01L24/81 , H01L21/563 , H01L23/49811 , H01L24/29 , H01L24/83 , H01L2224/13019 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73103 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81345 , H01L2224/81385 , H01L2224/81801 , H01L2224/83192 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/325 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A semiconductor apparatus includes a mount pad formed on a substrate and a bump formed on a semiconductor device. A plurality of needle-like or branch-like protrusions is formed on at least one of the mount pad and the bump. The plurality of protrusions of one of the mount pad and the bump engages with the other. The plurality of protrusions protrudes in directions crossing each other, or protrudes to random directions.
-
公开(公告)号：USD367848S
公开(公告)日：1996-03-12
申请号：US34927
申请日：1994-12-29
-
4.发明授权
公开(公告)号：US5591966A
公开(公告)日：1997-01-07
申请号：US463858
申请日：1995-06-05
IPC分类号： H01L23/48 , G02B6/42 , H01L31/02 , H01L31/0203 , H01L31/0232 , H04B10/07 , H04B10/40 , H04B10/50 , H04B10/60 , H04B10/00
CPC分类号： G02B6/4204 , H01L31/0203 , H01L31/0232 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49109 , H01L2924/1815 , H01L2924/3025
摘要： An optical element supported to an optical element supporting lead is sealed by a package having a lens. A height t2 from the rear surface of the optical element supporting lead at the portion projected outside from the package to the rear surface of the package is set to be substantially equal to a height t1 from the surface of the optical element to a top of a lens or the difference between the heights t1 and t2 is set small. Thus, the package can be assembled into a printed circuit board or the like by an insertion machine. Moreover, a power-saving and a mass-production become possible.
摘要翻译： 支撑在光学元件支撑引线上的光学元件由具有透镜的封装件密封。 在从包装件向包装外侧突出的部分处的光学元件支撑引线的后表面的高度t2设定为与从光学元件的表面到顶部的高度t1相等 高度t1和t2之间的差设定得较小。 因此，可以通过插入机将包装组装到印刷电路板等中。 此外，省电和批量生产成为可能。
-
-
-
搜索结果
4 条记录 (耗时 0.01 秒)
