公开(公告)号：US20070120732A1

公开(公告)日：2007-05-31

申请号：US11449692

申请日：2006-06-09

申请人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

发明人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

IPC分类号： G01S13/00 ,  G01S7/28

CPC分类号： G01S7/032 ,  G01S13/34 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01P7/065 ,  H01L2924/00

摘要： Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

摘要翻译： 迄今为止，在定位了多个波导端子的高频模​​块中使用多个封装，导致诸如封装之间的连接线的特性劣化，安装和连接连接线时的组装方便性降低的问题， 增加成本等等。 为了解决这些问题，在多层电介质基板中形成具有金属化部分或全部的多个空腔。 多层电介质基板设置有多个波导端子，微带线路 - 波导转换器，RF线，偏置和控制信号布线以及偏置和控制信号焊盘。 高频电路安装在腔内并用密封和盖子密封。 这旨在减少包装数量，提高性能，改进制造和降低成本。

公开(公告)号：US07756503B2

公开(公告)日：2010-07-13

申请号：US11449692

申请日：2006-06-09

申请人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

发明人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

IPC分类号： H04B1/26

CPC分类号： G01S7/032 ,  G01S13/34 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01P7/065 ,  H01L2924/00

摘要： Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

摘要翻译： 迄今为止，在定位了多个波导端子的高频模​​块中使用多个封装，导致诸如封装之间的连接线的特性劣化，安装和连接连接线时的组装方便性降低的问题， 增加成本等等。 为了解决这些问题，在多层电介质基板中形成具有金属化部分或全部的多个空腔。 多层电介质基板设置有多个波导端子，微带线路 - 波导转换器，RF线，偏置和控制信号布线以及偏置和控制信号焊盘。 高频电路安装在腔内并用密封和盖子密封。 这旨在减少包装数量，提高性能，改进制造和降低成本。

公开(公告)号：US20070040735A1

公开(公告)日：2007-02-22

申请号：US10555651

申请日：2005-03-24

申请人： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

发明人： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

IPC分类号： G01S7/28

CPC分类号： H05K1/167 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/183 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A multilayer dielectric substrate includes a first signal via, a second signal via, an internal-layer signal line, an internal-layer ground conductor, and ground vias. The first signal via is connected to a bias-and-control-signal terminal of a high-frequency semiconductor, and is arranged within a region corresponding to the electromagnetic shielding members. The second signal via is arranged outside the region, and is connected to an external terminal for a bias and control signal. The internal-layer signal line connects between the first and the second signal vias. The internal-layer ground conductor is arranged around the first and the second signal vias and the internal-layer signal line. The ground vias are arranged around the first and the second signal vias and the internal-layer signal line, on the internal-layer ground conductor. A resistance film is provided on at least one of an upper surface and a lower surface of the internal-layer signal line.

摘要翻译： 多层介质基板包括第一信号通孔，第二信号通孔，内层信号线，内层接地导体和接地通孔。 第一信号通孔连接到高频半导体的偏置和控制信号端子，并且被布置在对应于电磁屏蔽构件的区域内。 第二信号通孔布置在区域外部，并且连接到用于偏置和控制信号的外部端子。 内层信号线连接在第一和第二信号通孔之间。 内层接地导体围绕第一和第二信号通孔和内层信号线布置。 接地通孔围绕第一和第二信号通孔和内层信号线布置在内层接地导体上。 电阻膜设置在内层信号线的上表面和下表面中的至少一个上。

公开(公告)号：US20050140470A1

公开(公告)日：2005-06-30

申请号：US11070231

申请日：2005-03-03

申请人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

发明人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

IPC分类号： H01L23/12 ,  H01L23/66 ,  H01L25/04 ,  H01L25/18 ,  H01P1/32 ,  H01P1/20

CPC分类号： G01S7/032 ,  G01S13/34 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01P7/065 ,  H01L2924/00

摘要： Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

公开(公告)号：US07336221B2

公开(公告)日：2008-02-26

申请号：US10555651

申请日：2005-03-24

申请人： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

发明人： Koichi Matsuo ,  Tsutomu Tamaki ,  Takuya Suzuki

IPC分类号： G01S7/28

CPC分类号： H05K1/167 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/16195 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/183 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/10371 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A multilayer dielectric substrate includes a first signal via, a second signal via, an internal-layer signal line, an internal-layer ground conductor, and ground vias. The first signal via is connected to a bias-and-control-signal terminal of a high-frequency semiconductor, and is arranged within a region corresponding to the electromagnetic shielding members. The second signal via is arranged outside the region, and is connected to an external terminal for a bias and control signal. The internal-layer signal line connects between the first and the second signal vias. The internal-layer ground conductor is arranged around the first and the second signal vias and the internal-layer signal line. The ground vias are arranged around the first and the second signal vias and the internal-layer signal line, on the internal-layer ground conductor. A resistance film is provided on at least one of an upper surface and a lower surface of the internal-layer signal line.

摘要翻译： 多层介质基板包括第一信号通孔，第二信号通孔，内层信号线，内层接地导体和接地通孔。 第一信号通孔连接到高频半导体的偏置和控制信号端子，并且被布置在对应于电磁屏蔽构件的区域内。 第二信号通孔布置在区域外部，并且连接到用于偏置和控制信号的外部端子。 内层信号线连接在第一和第二信号通孔之间。 内层接地导体围绕第一和第二信号通孔和内层信号线布置。 接地通孔围绕第一和第二信号通孔和内层信号线布置在内层接地导体上。 电阻膜设置在内层信号线的上表面和下表面中的至少一个上。

公开(公告)号：US07164905B2

公开(公告)日：2007-01-16

申请号：US11070231

申请日：2005-03-03

申请人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

发明人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

IPC分类号： H04M11/00 ,  H04Q7/20

CPC分类号： G01S7/032 ,  G01S13/34 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01P7/065 ,  H01L2924/00

摘要： Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

公开(公告)号：US08040286B2

公开(公告)日：2011-10-18

申请号：US12158088

申请日：2007-02-01

申请人： Koichi Matsuo ,  Kazuyoshi Inami ,  Mamoru Yoshida ,  Takeshi Sueda ,  Shigeo Udagawa ,  Susumu Sato ,  Tsutomu Tamaki ,  Takuya Suzuki ,  Kousuke Yasooka ,  Minoru Hashimoto

发明人： Koichi Matsuo ,  Kazuyoshi Inami ,  Mamoru Yoshida ,  Takeshi Sueda ,  Shigeo Udagawa ,  Susumu Sato ,  Tsutomu Tamaki ,  Takuya Suzuki ,  Kousuke Yasooka ,  Minoru Hashimoto

IPC分类号： H01Q13/10

CPC分类号： H01P1/2135 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01P5/02 ,  H01P5/1007 ,  H01Q21/0068 ,  H01Q21/0087 ,  H01Q21/064 ,  H01L2924/00014

摘要： A high-frequency module has an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.

摘要翻译： 高频模块具有通过使用扩散接合将布置有辐射狭缝的槽板一体地连接到具有形成有多个形成有用于向槽板供电的波导的薄板的板的天线。 天线的波导通过设置在树脂基板上的波导与高频封装的介质波导连接，从而以低成本配置缝隙天线，并将缝隙天线的电源槽连接到波导端子 的高频封装具有低损耗。

公开(公告)号：US20090079648A1

公开(公告)日：2009-03-26

申请号：US12158088

申请日：2007-02-01

申请人： Koichi Matsuo ,  Kazuyoshi Inami ,  Mamoru Yoshida ,  Takeshi Sueda ,  Shigeo Udagawa ,  Susumu Sato ,  Tsutomu Tamaki ,  Takuya Suzuki ,  Kousuke Yasooka ,  Minoru Hashimoto

发明人： Koichi Matsuo ,  Kazuyoshi Inami ,  Mamoru Yoshida ,  Takeshi Sueda ,  Shigeo Udagawa ,  Susumu Sato ,  Tsutomu Tamaki ,  Takuya Suzuki ,  Kousuke Yasooka ,  Minoru Hashimoto

IPC分类号： H01Q13/10

CPC分类号： H01P1/2135 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01P5/02 ,  H01P5/1007 ,  H01Q21/0068 ,  H01Q21/0087 ,  H01Q21/064 ,  H01L2924/00014

摘要： To provide a high-frequency module having an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.

摘要翻译： 为了提供一种高频模块，其具有通过使用扩散接合将通过将布置有辐射狭缝的槽板整体连接到具有多个形成有用于向槽板供电的波导的薄板的板构成的天线。 天线的波导通过设置在树脂基板上的波导与高频封装的介质波导连接，从而以低成本配置缝隙天线，并将缝隙天线的电源槽连接到波导端子 的高频封装具有低损耗。

公开(公告)号：US06876846B2

公开(公告)日：2005-04-05

申请号：US09934481

申请日：2001-08-23

申请人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

发明人： Tsutomu Tamaki ,  Takuya Suzuki ,  Koichi Matsuo ,  Hiroshi Kai

IPC分类号： H01L23/12 ,  H01L23/66 ,  H01L25/04 ,  H01L25/18 ,  H01S4/00

CPC分类号： G01S7/032 ,  G01S13/34 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01P7/065 ,  H01L2924/00

摘要： Heretofore, a plurality of packages were used in a high frequency module in which a plurality of waveguide terminals were positioned resulting in problems, such as degradation of characteristics in the connection lines between packages, lower ease of assembly when mounting and connecting the connection lines, increased cost, and so forth. To solve these problems, a plurality of cavities having a part or the entire side metallized is formed in a multi-layer dielectric substrate. The multi-layer dielectric substrate is provided with a plurality of waveguide terminals, microstrip line-waveguide converters, RF lines, bias and control signal wiring, and bias and control signal pads. A high frequency circuit is mounted within the cavity and sealed with a seal and cover. This is intended to reduce the number of package, improve performance, improve fabrication, and lower the cost.

摘要翻译： 迄今为止，在定位了多个波导端子的高频模​​块中使用多个封装，导致诸如封装之间的连接线的特性劣化，安装和连接连接线时的组装方便性降低的问题， 增加成本等等。 为了解决这些问题，在多层电介质基板中形成具有金属化部分或全部的多个空腔。 多层电介质基板设置有多个波导端子，微带线路 - 波导转换器，RF线，偏置和控制信号布线以及偏置和控制信号焊盘。 高频电路安装在腔内并用密封和盖子密封。 这旨在减少包装数量，提高性能，改进制造和降低成本。

公开(公告)号：US07190243B2

公开(公告)日：2007-03-13

申请号：US10994678

申请日：2004-11-23

申请人： Tsutomu Tamaki

发明人： Tsutomu Tamaki

IPC分类号： H01P5/02

CPC分类号： H01P1/042 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/368

摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.