公开(公告)号：US08419977B2

公开(公告)日：2013-04-16

申请号：US12424413

申请日：2009-04-15

申请人： John Jansen ,  Tsuyoshi Tokiwa ,  Eiji Sawa

发明人： John Jansen ,  Tsuyoshi Tokiwa ,  Eiji Sawa

IPC分类号： H01B1/00

CPC分类号： G03G15/0818 ,  B65H27/00 ,  B65H2401/11 ,  C08L33/06 ,  C09D5/24 ,  C09D175/06 ,  G03G15/0233 ,  G03G15/1685 ,  G03G2215/0861 ,  C08L2666/04

摘要： A conductive coating is described, suitable for coating a developer, charge or transfer roller in a developing apparatus to give a charge providing layer. The coating comprises a conductive polymer in a matrix. A roller is also described, suitable for a developing apparatus comprising, from the center to the periphery, a conductive mandrel, a conductive elastic base layer and a charge providing layer.

摘要翻译： 描述了一种导电涂层，适用于在显影装置中涂覆显影剂，充电或转印辊以产生电荷提供层。 涂层包含基质中的导电聚合物。 还描述了一种适用于从中心到外围包括导电心轴，导电弹性基底层和电荷提供层的显影装置的辊。

公开(公告)号：US06575354B2

公开(公告)日：2003-06-10

申请号：US09986478

申请日：2001-11-08

申请人： Hisahiro Tanaka ,  Matsuo Masuda ,  Tsuyoshi Tokiwa

发明人： Hisahiro Tanaka ,  Matsuo Masuda ,  Tsuyoshi Tokiwa

IPC分类号： B23K3102

CPC分类号： H01L23/49582 ,  C25D3/60 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/85011 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The present invention relates to a method for producing a tin-silver alloy plating film having an excellent wettability and improved in solderability and said method comprises a step of heat treating the surface of the tin-silver alloy plating film preferably the heat treating temperature is 70-210° C.

摘要翻译： 本发明涉及一种具有优异润湿性和改善焊接性的锡 - 银合金电镀膜的制造方法，所述方法包括对锡 - 银合金镀膜表面进行热处理的步骤，优选热处理温度为70℃ -210℃

公开(公告)号：US20090257790A1

公开(公告)日：2009-10-15

申请号：US12424413

申请日：2009-04-15

申请人： John Jansen ,  Tsuyoshi Tokiwa ,  Eiji Sawa

发明人： John Jansen ,  Tsuyoshi Tokiwa ,  Eiji Sawa

IPC分类号： G03G15/06 ,  H01B1/20 ,  B05D5/12

CPC分类号： G03G15/0818 ,  B65H27/00 ,  B65H2401/11 ,  C08L33/06 ,  C09D5/24 ,  C09D175/06 ,  G03G15/0233 ,  G03G15/1685 ,  G03G2215/0861 ,  C08L2666/04

摘要： A conductive coating is described, suitable for coating a developer, charge or transfer roller in a developing apparatus to give a charge providing layer. The coating comprises a conductive polymer in a matrix. A roller is also described, suitable for a developing apparatus comprising, from the centre to the periphery, a conductive mandrel, a conductive elastic base layer and a charge providing layer.

摘要翻译： 描述了一种导电涂层，适用于在显影装置中涂覆显影剂，充电或转印辊以产生电荷提供层。 涂层包含基质中的导电聚合物。 还描述了一种适用于从中心到外围包括导电心轴，导电弹性基底层和电荷提供层的显影装置的辊。

公开(公告)号：US06646330B2

公开(公告)日：2003-11-11

申请号：US09953915

申请日：2001-09-18

申请人： Takashi Kubara ,  Hisahiro Tanaka ,  Matsuo Masuda ,  Tsuyoshi Tokiwa

发明人： Takashi Kubara ,  Hisahiro Tanaka ,  Matsuo Masuda ,  Tsuyoshi Tokiwa

IPC分类号： H01L23495

CPC分类号： H01L21/4821 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a lead frame for semiconductor devices having an outer lead part improved in solder wettability which comprises i. a substrate comprising an alloy comprising at least one member selected from the group consisting of nickel, copper, iron and (nickel and copper and iron), ii. an inner lead part having a surface treated layer A, the surface treated layer A comprising silver or an alloy comprising silver, and iii. an outer lead part having a surface treated layer B, the surface treated layer B comprising silver and tin, or copper and tin, wherein the surface treated layer B has on its surface an oxidized layer comprising tin and oxygen, the atomic ratio of oxygen to tin in the oxidized layer is 0.5-1.8 and the thickness of the layer is not more than 20 nm.

摘要翻译： 本发明涉及一种用于半导体器件的引线框架，其具有改善焊料润湿性的外引线部分，其包括： 包括含有选自镍，铜，铁和（镍和铜和铁）中的至少一种的合金的基体），ii。 具有表面处理层A的内部引线部分，表面处理层A包含银或包含银的合金和iii。 具有表面处理层B的外部引线部分，包含银和锡的表面处理层B或铜和锡，其中表面处理层B在其表面上具有包含锡和氧的氧化层，氧与原子比 氧化层中的锡为0.5-1.8，层的厚度不大于20nm。

公开(公告)号：US06395583B1

公开(公告)日：2002-05-28

申请号：US09548351

申请日：2000-04-12

申请人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

发明人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

IPC分类号： H01L2144

CPC分类号： H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A lead frame made from Ni, a Ni alloy, Cu, a Cu alloy, Fe or an Fe alloy, comprising an inner lead part with a surface treatment layer of Ag or a Ag-containing alloy and an outer lead part with a surface treatment layer of an alloy containing Ag and Sn, wherein the latter surface treatment layer has a brightness of not less than 0.6 and Sn has the body-centered tetragonal lattice with the crystal orientation indices of from 1.5 to 5 at the (220) plane, not more than 0.9 at the (211) plane and not less than 0.5 at the (200) plane. The surface treatment layer is plated with utilization of a plating solution which contains one or more selected from alkane sulfonic acid, alkanol sulfonic acid and sulfamine acid as the acid component, one or more of tin methane-sulfonate and SnO as a tin salt, and one or more slected from silver methane-sulfonate, Ag2O and AgO as a silver salt. The outer lead part may be subjected to a preliminary etching treatment with utilization of a treatment agent of one or more selected from chloric acid, nitric acid and sulfic acid prior to forming the surface treatment layer. The formed surface treatment layer may be treated by a treating agent containing sodium triphosphate.

摘要翻译： 由Ni，Ni合金，Cu，Cu合金，Fe或Fe合金制成的引线框架，包括具有Ag或含Ag合金的表面处理层的内部引线部分和具有表面处理的外部引线部分 含有Ag和Sn的合金层，其中后表面处理层具有不小于0.6的亮度，并且Sn具有在（220）面处晶体取向指数为1.5至5的体心四方晶格，而不是 （211）面上大于0.9，（200）面不大于0.5。 使用含有选自烷烃磺酸，链烷醇磺酸和磺胺酸中的一种或多种作为酸成分的电镀溶液，一种或多种锡 - 甲磺酸锡和SnO作为锡盐，对所述表面处理层进行镀覆，以及 从银甲磺酸银，Ag2O和AgO中选择一种或多种作为银盐。 在形成表面处理层之前，可以利用选自氯酸，硝酸和硫酸的一种或多种处理剂对外部引线部进行预蚀刻处理。 形成的表面处理层可以通过含有三磷酸钠的处理剂进行处理。

公开(公告)号：US6087714A

公开(公告)日：2000-07-11

申请号：US298841

申请日：1999-04-26

申请人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

发明人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

IPC分类号： H01L23/495 ,  H01L23/28 ,  H01L23/29

CPC分类号： H01L24/48 ,  H01L23/49582 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181

摘要： In a lead frame formed out of at least one metal selected from the group consisting of nickel and nickel alloys, copper and copper alloys and iron and iron alloys, the inner lead part is provided with a surface treatment layer of Ag or an alloy containing silver and the outer lead part is provided at least with a surface treatment layer of an alloy containing silver and tin of the body-centered cubic structure preferentially oriented in the (101) plane and/or the (211) plane. According to the above-mentioned structure, a semiconductor device that uses a lead frame for electronic parts which does not contain lead, one of the environmentally harmful pollutants, has good characteristics including solder wettability and bonding strength and is of low cost and a process for producing the device are provided.

摘要翻译： 在由选自镍和镍合金，铜和铜合金以及铁和铁合金中的至少一种金属形成的引线框架中，内部引线部分设置有Ag或含有银的合金的表面处理层 并且所述外引线部分至少设置有在（101）面和/或（211）面中优先取向的体心立方结构的含有银和锡的合金的表面处理层。 根据上述结构，使用不含有铅的电子部件用引线框的半导体装置，其中一种对环境有害的污染物具有焊料润湿性和接合强度等特性，成本低，成本低的方法 提供生产设备。

公开(公告)号：US20090257789A1

公开(公告)日：2009-10-15

申请号：US12422888

申请日：2009-04-13

申请人： John JANSEN ,  Tsuyoshi Tokiwa ,  Eiji Sawa

发明人： John JANSEN ,  Tsuyoshi Tokiwa ,  Eiji Sawa

IPC分类号： G03G15/08 ,  B05D5/06

CPC分类号： G03G15/0818 ,  B65H27/00 ,  B65H2401/11 ,  C08L33/06 ,  C09D5/24 ,  C09D175/06 ,  G03G15/0233 ,  G03G15/1685 ,  G03G2215/0861 ,  C08L2666/04

摘要： Developing roller comprising a conductive mandrel with at least an elastic conductive base layer and a charge providing layer. The base layer is located closer to the mandrel than the charge providing layer. The base layer is roughened before the charge providing layer is applied to the base layer.

摘要翻译： 显影辊包括具有至少弹性导电基底层和电荷提供层的导电芯棒。 基底层比电荷提供层更靠近心轴。 在将电荷提供层施加到基底层之前，将基底层粗糙化。

公开(公告)号：US07962077B2

公开(公告)日：2011-06-14

申请号：US12422888

申请日：2009-04-13

申请人： John Jansen ,  Tsuyoshi Tokiwa ,  Eiji Sawa

发明人： John Jansen ,  Tsuyoshi Tokiwa ,  Eiji Sawa

IPC分类号： G03G15/08

CPC分类号： G03G15/0818 ,  B65H27/00 ,  B65H2401/11 ,  C08L33/06 ,  C09D5/24 ,  C09D175/06 ,  G03G15/0233 ,  G03G15/1685 ,  G03G2215/0861 ,  C08L2666/04

摘要： Developing roller comprising a conductive mandrel with at least an elastic conductive base layer and a charge providing layer. The base layer is located closer to the mandrel than the charge providing layer. The base layer is roughened before the charge providing layer is applied to the base layer.

摘要翻译： 显影辊包括具有至少弹性导电基底层和电荷提供层的导电芯棒。 基底层比电荷提供层更靠近心轴。 在将电荷提供层施加到基底层之前，将基底层粗糙化。