公开(公告)号：US20090011143A1

公开(公告)日：2009-01-08

申请号：US12142857

申请日：2008-06-20

申请人： Ryuuichi YATSUNAMI ,  Satoru MIYANISHI ,  Yasuhiro NOTOHARA ,  Hisahiro TANAKA

发明人： Ryuuichi YATSUNAMI ,  Satoru MIYANISHI ,  Yasuhiro NOTOHARA ,  Hisahiro TANAKA

IPC分类号： B05D3/06 ,  B05C5/00 ,  B05C11/00

CPC分类号： H05K3/1241 ,  H05K1/092 ,  H05K3/02 ,  H05K3/1283 ,  H05K3/389 ,  H05K2203/0126 ,  H05K2203/0285 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/1131 ,  H05K2203/1173 ,  H05K2203/1476

摘要： A pattern forming apparatus includes a liquid material application mechanism that includes an opening for applying a liquid material on a substrate, and a laser processing mechanism that includes an irradiation section for irradiating the liquid material applied on the substrate with laser light to immobilize the liquid material so that a pattern is formed. The laser processing mechanism is integrated with the liquid material application mechanism.

摘要翻译： 图案形成装置包括：液体材料施加机构，其包括用于在基板上施加液体材料的开口;以及激光处理机构，其包括用于用激光照射施加在基板上的液体材料的照射部分，以固定液体材料 使得形成图案。 激光加工机构与液体材料应用机构相结合。

公开(公告)号：US20080311414A1

公开(公告)日：2008-12-18

申请号：US12138561

申请日：2008-06-13

申请人： Hisahiro TANAKA ,  Yasuhiro NOTOHARA ,  Ryuichi YATSUNAMI ,  Satoru MIYANISHI

发明人： Hisahiro TANAKA ,  Yasuhiro NOTOHARA ,  Ryuichi YATSUNAMI ,  Satoru MIYANISHI

IPC分类号： B32B15/00 ,  B05D3/02

CPC分类号： C03C17/002 ,  C03C17/36 ,  C03C17/3607 ,  C03C17/3618 ,  C03C17/3644 ,  C03C17/3649 ,  C03C17/3689 ,  C03C17/3697 ,  C03C2218/11 ,  C03C2218/328 ,  C23C18/08 ,  C23C18/1216 ,  C23C18/14

摘要： An under-layer 2 comprising a coupling agent having a metal element to be transformed to an oxide is disposed on the surface of an inorganic oxide substrate 1, and a liquid containing micro-fine metal particles dispersed therein is coated on the under-layer 2 to form a micro-fine metal particle layer 3. Then, temperature is elevated to a metallizing temperature of the micro-fine metal particles, to form a thin metal film layer 5.

摘要翻译： 在无机氧化物基板1的表面上设置有包含具有要转化为氧化物的金属元素的偶联剂的底层2，其中分散有微细金属微粒的液体涂覆在底层2上 形成微细金属粒子层3.然后，将微细金属粒子的温度升高到金属化温度，形成薄的金属膜层5。

公开(公告)号：US20080024563A1

公开(公告)日：2008-01-31

申请号：US11781530

申请日：2007-07-23

申请人： Kiyoaki MATSUI ,  Eiji FUJII ,  Shintaro HARA ,  Osamu WATANABE ,  Hisahiro TANAKA

发明人： Kiyoaki MATSUI ,  Eiji FUJII ,  Shintaro HARA ,  Osamu WATANABE ,  Hisahiro TANAKA

IPC分类号： B41J2/045 ,  H02N2/00

CPC分类号： B41J2/14233 ,  B41J2202/03 ,  H01L41/0805 ,  H01L41/0973 ,  H01L41/316

摘要： A piezoelectric body (piezoelectric layer 14) is configured to include a first piezoelectric layer 14a, a second piezoelectric layer 14b, and a third piezoelectric layer 14c. A piezoelectric constant of each of the first and third piezoelectric layer 14a and 14c is set to be smaller than that of the second piezoelectric layer 14b. Thus, it is possible to reduce an internal stress generated at an interface between first and second electrode layers 13 and 15 corresponding to the first and third piezoelectric layer 14a and 14c, and generation of a crack caused by high voltage application or driving performed for a long time is expected to be greatly reduced.

摘要翻译： 压电体（压电层14）被构造成包括第一压电层14a，第二压电层14b和第三压电层14c。 第一和第三压电层14a和14c中的每一个的压电常数被设定为小于第二压电层14b的压电常数。 因此，可以减少在与第一和第三压电层14a和14c相对应的第一和第二电极层13和15之间的界面处产生的内应力，并且产生由高压施加或驱动引起的裂纹 预计很长一段时间会大大减少。

公开(公告)号：US06159623A

公开(公告)日：2000-12-12

申请号：US82550

申请日：1998-05-21

申请人： Hisahiro Tanaka

发明人： Hisahiro Tanaka

IPC分类号： C25D3/50 ,  C25D3/52 ,  C25D7/12 ,  H01L23/50 ,  B32B15/01

CPC分类号： C25D3/52 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  Y10T428/12875 ,  H01L2924/00014 ,  H01L2924/00

摘要： A palladium plating film having excellent soldering characteristics, including excellent solder wettability, high solder wetting speed, and especially the maintenance of these characteristics in a high-temperature atmosphere, is produced by using a palladium plating solution. The palladium plating film can be used, for example, for the plating of electrical and electronic parts. The palladium plating solution used contains a soluble palladium salt and a quaternary compound, and, if necessary, further contains a pyridine derivative or a salt thereof, and optionally further contains at least one compound selected from ammonium chloride, ammonium hydrogenphosphate, ammonium nitrate, ammonium sulfate, ammonium chloride and boric acid or a soluble selenium salt.

摘要翻译： 通过使用钯电镀液制造具有优异焊接特性的钯电镀膜，其具有优异的焊料润湿性，高焊锡润湿速度，特别是在高温气氛中维持这些特性。 钯电镀膜可以用于例如电气和电子部件的电镀。 使用的镀钯溶液含有可溶性钯盐和季铵化合物，如果需要，还含有吡啶衍生物或其盐，并且任选地还含有至少一种选自氯化铵，磷酸氢铵，硝酸铵，铵 硫酸盐，氯化铵和硼酸或可溶性硒盐。

公开(公告)号：US20070207840A1

公开(公告)日：2007-09-06

申请号：US11706961

申请日：2007-02-16

申请人： Seiji Kurauchi ,  Toshiaki Kobayashi ,  Yuichiro Nishioka ,  Hiroyuki Arai ,  Hisahiro Tanaka

发明人： Seiji Kurauchi ,  Toshiaki Kobayashi ,  Yuichiro Nishioka ,  Hiroyuki Arai ,  Hisahiro Tanaka

IPC分类号： H04M1/00

CPC分类号： G11B31/00 ,  B60R11/02 ,  B60R11/0247 ,  B60R11/0264 ,  B60R2011/008 ,  B60R2011/0294 ,  G11B33/027 ,  H04M1/6091

摘要： An in-vehicle apparatus including: an apparatus body; a front surface of the apparatus body; and a lid configured to open and close the front surface. A microphone directed to the front side of the front surface in the condition where the lid is opened is provided at the front surface of the apparatus body. A gap for communication between the location, where the microphone is provided, of the front surface and the outside is secured between the front surface and the lid in the condition where the front surface of the apparatus body is closed with the lid.

摘要翻译： 一种车载设备，包括：设备主体; 设备主体的前表面; 以及构造成打开和关闭前表面的盖子。 在打开盖子的状态下，指向前表面前侧的麦克风设置在装置本体的前表面。 在装置主体的前表面用盖子关闭的状态下，前表面和外侧之间的麦克风位置之间的通信间隙被固定在前表面和盖子之间。

公开(公告)号：US06677056B2

公开(公告)日：2004-01-13

申请号：US10274033

申请日：2002-10-21

申请人： Hisahiro Tanaka ,  Matsuo Masuda

发明人： Hisahiro Tanaka ,  Matsuo Masuda

IPC分类号： B32B1501

CPC分类号： H01L23/49582 ,  B32B15/01 ,  C22C13/00 ,  C25D3/60 ,  C25D5/18 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  Y10S428/935 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A tin-silver alloy plating film improved in solderability and flex cracking characteristics is provided by producing it by an electroplating process which uses a current having a pulse waveform of a current passing period of not less than 3 ms and not more than 500 ms and a stopping period of not less than 1 ms and not more than 500 ms with a proviso that the stopping period is equal to or shorter than the passing period.

摘要翻译： 通过使用电流通过期间不小于3ms且不大于500ms的脉冲波形的电流的电镀工艺制造可提高焊接性和挠曲裂纹特性的锡 - 银合金电镀膜，以及 停止期间不小于1ms且不大于500ms，条件是停止期间等于或短于通过期间。

公开(公告)号：US06666964B2

公开(公告)日：2003-12-23

申请号：US10026660

申请日：2001-12-27

申请人： Hisahiro Tanaka

发明人： Hisahiro Tanaka

IPC分类号： C25D502

CPC分类号： H05K3/244 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/112 ,  H05K2201/0394 ,  H05K2201/09472 ,  Y10T29/49165 ,  H01L2924/00

摘要： A circuit board comprising an insulating substrate, via-holes made in the insulating substrate, and a wiring conductor having at least one layer disposed on the insulating substrate. The circuit board is characterized in that a gold-plated layer of the wiring conductor exposed to the inside of the via-hole is thinner than a gold-plated layer of the wiring conductor exposed to a portion other than the inside of the via-hole in the insulating substrate. A method of manufacturing the circuit board is characterized in that gold electroplating of the wiring conductor is performed with the open-end of the via-hole contacted on a shielding board in a plating bath. The present invention provides a circuit board capable of satisfying the requirements for long-lasting strength of solder ball junction and good wire bonding ability at the same time.

摘要翻译： 一种电路板，包括绝缘衬底，在绝缘衬底中制成的通孔，以及布线导体，其具有设置在绝缘衬底上的至少一层。 电路板的特征在于，露出到通孔内部的布线导体的镀金层比暴露于通孔内部以外的部分的布线导体的镀金层薄 在绝缘基板中。 制造电路板的方法的特征在于，在电镀槽中的屏蔽板上接触的通孔的开口端进行布线导体的金电镀。 本发明提供一种电路板，能够同时满足焊球接头的持久强度和良好的引线接合能力的要求。

公开(公告)号：US06646330B2

公开(公告)日：2003-11-11

申请号：US09953915

申请日：2001-09-18

申请人： Takashi Kubara ,  Hisahiro Tanaka ,  Matsuo Masuda ,  Tsuyoshi Tokiwa

发明人： Takashi Kubara ,  Hisahiro Tanaka ,  Matsuo Masuda ,  Tsuyoshi Tokiwa

IPC分类号： H01L23495

CPC分类号： H01L21/4821 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a lead frame for semiconductor devices having an outer lead part improved in solder wettability which comprises i. a substrate comprising an alloy comprising at least one member selected from the group consisting of nickel, copper, iron and (nickel and copper and iron), ii. an inner lead part having a surface treated layer A, the surface treated layer A comprising silver or an alloy comprising silver, and iii. an outer lead part having a surface treated layer B, the surface treated layer B comprising silver and tin, or copper and tin, wherein the surface treated layer B has on its surface an oxidized layer comprising tin and oxygen, the atomic ratio of oxygen to tin in the oxidized layer is 0.5-1.8 and the thickness of the layer is not more than 20 nm.

摘要翻译： 本发明涉及一种用于半导体器件的引线框架，其具有改善焊料润湿性的外引线部分，其包括： 包括含有选自镍，铜，铁和（镍和铜和铁）中的至少一种的合金的基体），ii。 具有表面处理层A的内部引线部分，表面处理层A包含银或包含银的合金和iii。 具有表面处理层B的外部引线部分，包含银和锡的表面处理层B或铜和锡，其中表面处理层B在其表面上具有包含锡和氧的氧化层，氧与原子比 氧化层中的锡为0.5-1.8，层的厚度不大于20nm。

公开(公告)号：US06395583B1

公开(公告)日：2002-05-28

申请号：US09548351

申请日：2000-04-12

申请人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

发明人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

IPC分类号： H01L2144

CPC分类号： H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A lead frame made from Ni, a Ni alloy, Cu, a Cu alloy, Fe or an Fe alloy, comprising an inner lead part with a surface treatment layer of Ag or a Ag-containing alloy and an outer lead part with a surface treatment layer of an alloy containing Ag and Sn, wherein the latter surface treatment layer has a brightness of not less than 0.6 and Sn has the body-centered tetragonal lattice with the crystal orientation indices of from 1.5 to 5 at the (220) plane, not more than 0.9 at the (211) plane and not less than 0.5 at the (200) plane. The surface treatment layer is plated with utilization of a plating solution which contains one or more selected from alkane sulfonic acid, alkanol sulfonic acid and sulfamine acid as the acid component, one or more of tin methane-sulfonate and SnO as a tin salt, and one or more slected from silver methane-sulfonate, Ag2O and AgO as a silver salt. The outer lead part may be subjected to a preliminary etching treatment with utilization of a treatment agent of one or more selected from chloric acid, nitric acid and sulfic acid prior to forming the surface treatment layer. The formed surface treatment layer may be treated by a treating agent containing sodium triphosphate.

摘要翻译： 由Ni，Ni合金，Cu，Cu合金，Fe或Fe合金制成的引线框架，包括具有Ag或含Ag合金的表面处理层的内部引线部分和具有表面处理的外部引线部分 含有Ag和Sn的合金层，其中后表面处理层具有不小于0.6的亮度，并且Sn具有在（220）面处晶体取向指数为1.5至5的体心四方晶格，而不是 （211）面上大于0.9，（200）面不大于0.5。 使用含有选自烷烃磺酸，链烷醇磺酸和磺胺酸中的一种或多种作为酸成分的电镀溶液，一种或多种锡 - 甲磺酸锡和SnO作为锡盐，对所述表面处理层进行镀覆，以及 从银甲磺酸银，Ag2O和AgO中选择一种或多种作为银盐。 在形成表面处理层之前，可以利用选自氯酸，硝酸和硫酸的一种或多种处理剂对外部引线部进行预蚀刻处理。 形成的表面处理层可以通过含有三磷酸钠的处理剂进行处理。

公开(公告)号：US6087714A

公开(公告)日：2000-07-11

申请号：US298841

申请日：1999-04-26

申请人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

发明人： Takashi Kubara ,  Matsuo Masuda ,  Tsuyoshi Tokiwa ,  Hisahiro Tanaka

IPC分类号： H01L23/495 ,  H01L23/28 ,  H01L23/29

CPC分类号： H01L24/48 ,  H01L23/49582 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181

摘要： In a lead frame formed out of at least one metal selected from the group consisting of nickel and nickel alloys, copper and copper alloys and iron and iron alloys, the inner lead part is provided with a surface treatment layer of Ag or an alloy containing silver and the outer lead part is provided at least with a surface treatment layer of an alloy containing silver and tin of the body-centered cubic structure preferentially oriented in the (101) plane and/or the (211) plane. According to the above-mentioned structure, a semiconductor device that uses a lead frame for electronic parts which does not contain lead, one of the environmentally harmful pollutants, has good characteristics including solder wettability and bonding strength and is of low cost and a process for producing the device are provided.

摘要翻译： 在由选自镍和镍合金，铜和铜合金以及铁和铁合金中的至少一种金属形成的引线框架中，内部引线部分设置有Ag或含有银的合金的表面处理层 并且所述外引线部分至少设置有在（101）面和/或（211）面中优先取向的体心立方结构的含有银和锡的合金的表面处理层。 根据上述结构，使用不含有铅的电子部件用引线框的半导体装置，其中一种对环境有害的污染物具有焊料润湿性和接合强度等特性，成本低，成本低的方法 提供生产设备。