PROGRAMMABLE METALLIZATION CELLS AND METHODS OF FORMING THE SAME
    1.
    发明申请
    PROGRAMMABLE METALLIZATION CELLS AND METHODS OF FORMING THE SAME 审中-公开
    可编程金属化电池及其形成方法

    公开(公告)号:US20130009126A1

    公开(公告)日:2013-01-10

    申请号:US13615830

    申请日:2012-09-14

    IPC分类号: H01L45/00

    摘要: A programmable metallization cell (PMC) that includes an active electrode; a nanoporous layer disposed on the active electrode, the nanoporous layer comprising a plurality of nanopores and a dielectric material; and an inert electrode disposed on the nanoporous layer. Other embodiments include forming the active electrode from silver iodide, copper iodide, silver sulfide, copper sulfide, silver selenide, or copper selenide and applying a positive bias to the active electrode that causes silver or copper to migrate into the nanopores. Methods of formation are also disclosed.

    摘要翻译: 包括有源电极的可编程金属化电池(PMC); 设置在所述有源电极上的纳米多孔层,所述纳米多孔层包含多个纳米孔和电介质材料; 以及设置在纳米多孔层上的惰性电极。 其它实施方案包括由碘化银,碘化铜,硫化银,硫化铜,硒化银或硒化铜形成活性电极,并向活性电极施加正偏压,使活性电极引起银或铜迁移到纳米孔中。 还公开了形成方法。

    PROGRAMMABLE METALLIZATION CELLS AND METHODS OF FORMING THE SAME
    7.
    发明申请
    PROGRAMMABLE METALLIZATION CELLS AND METHODS OF FORMING THE SAME 有权
    可编程金属化电池及其形成方法

    公开(公告)号:US20100117052A1

    公开(公告)日:2010-05-13

    申请号:US12269514

    申请日:2008-11-12

    IPC分类号: H01L47/00 H01L21/82

    摘要: A programmable metallization cell (PMC) that includes an active electrode; a nanoporous layer disposed on the active electrode, the nanoporous layer comprising a plurality of nanopores and a dielectric material; and an inert electrode disposed on the nanoporous layer. Other embodiments include forming the active electrode from silver iodide, copper iodide, silver sulfide, copper sulfide, silver selenide, or copper selenide and applying a positive bias to the active electrode that causes silver or copper to migrate into the nanopores. Methods of formation are also disclosed.

    摘要翻译: 包括有源电极的可编程金属化电池(PMC); 设置在所述有源电极上的纳米多孔层,所述纳米多孔层包含多个纳米孔和电介质材料; 以及设置在纳米多孔层上的惰性电极。 其它实施方案包括由碘化银,碘化铜,硫化银,硫化铜,硒化银或硒化铜形成活性电极,并向活性电极施加正偏压,使活性电极引起银或铜迁移到纳米孔中。 还公开了形成方法。

    Programmable resistive memory cell with sacrificial metal
    8.
    发明授权
    Programmable resistive memory cell with sacrificial metal 有权
    具有牺牲金属的可编程电阻存储单元

    公开(公告)号:US08435827B2

    公开(公告)日:2013-05-07

    申请号:US13348255

    申请日:2012-01-11

    IPC分类号: H01L21/00

    摘要: Programmable metallization memory cells include an electrochemically active electrode and an inert electrode and an ion conductor solid electrolyte material between the electrochemically active electrode and the inert electrode. A sacrificial metal is disposed between the electrochemically active electrode and the inert electrode. The sacrificial metal has a more negative standard electrode potential than the filament forming metal.

    摘要翻译: 可编程金属化存储单元包括在电化学活性电极和惰性电极之间的电化学活性电极和惰性电极以及离子导体固体电解质材料。 牺牲金属设置在电化学活性电极和惰性电极之间。 牺牲金属具有比成丝金属更负的标准电极电位。

    ELECTRODEPOSITION OF CoNiP FILMS
    9.
    发明申请
    ELECTRODEPOSITION OF CoNiP FILMS 审中-公开
    CoNiP膜的电沉积

    公开(公告)号:US20120080317A1

    公开(公告)日:2012-04-05

    申请号:US12894238

    申请日:2010-09-30

    IPC分类号: B32B9/00 C25D9/04

    CPC分类号: C25D3/562 C09D1/00 C09D5/4488

    摘要: A method of forming CoNiP on a substrate that includes the steps of placing a substrate in an electroplating bath, the electroplating bath containing an electroplating composition, the electroplating composition including: a nickel source; a cobalt source; and at least about 0.1 M phosphorus source; and applying a deposition current to the substrate, wherein application of the deposition current to the substrate will cause a CoNiP layer having a thickness of at least about 500 nanometers to be electrodeposited on the substrate.

    摘要翻译: 一种在衬底上形成CoNiP的方法,包括将衬底放置在电镀浴中的步骤,所述电镀浴含有电镀组合物,所述电镀组合物包括:镍源; 钴源; 和至少约0.1M磷源; 以及向衬底施加沉积电流,其中将沉积电流施加到衬底将使得具有至少约500纳米厚度的CoNiP层电沉积在衬底上。