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公开(公告)号：US20080246135A1
公开(公告)日：2008-10-09
申请号：US11976488
申请日：2007-10-25
申请人： Lin-Yin Wong , Mao-Hua Yeh , Wang-Hsiang Tsai
发明人： Lin-Yin Wong , Mao-Hua Yeh , Wang-Hsiang Tsai
IPC分类号： H01L23/488
CPC分类号： H05K1/185 , H01L24/24 , H01L24/73 , H01L24/82 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/18165 , H01L2924/19105 , H05K1/023 , H05K1/117 , H05K3/4602 , H05K3/4694 , H05K2201/09845 , H05K2201/10734 , H05K2203/1572 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads; the first circuit board comprises a first surface, an opposite second surface, a plurality of exposed electro-connecting ends, a plurality of first conductive pads on the first surface, a plurality of conductive vias, and at least one circuit layer, therewith the electrode pads of the first chip electrically connecting to the electro-connecting ends and the first conductive pads directly through the conductive vias and the circuit layer; and a second package structure electrically connecting to the first package structure through a plurality of first solder balls to make a package on package. The stacked package module of this invention has characters of compact size, high performance, high flexibility, and detachability.
摘要翻译： 公开了一种堆叠封装模块，其包括：第一封装结构，其包括嵌入其中的第一芯片的第一电路板，其中所述第一芯片具有多个电极焊盘; 第一电路板包括第一表面，相对的第二表面，多个暴露的电连接端，第一表面上的多个第一导电焊盘，多个导电通孔，以及至少一个电路层，其中电极 第一芯片的焊盘直接通过导电通孔和电路层电连接到电连接端和第一导电焊盘; 以及第二封装结构，其通过多个第一焊球电连接到所述第一封装结构，以使封装成封装。 本发明的堆叠式封装模块具有尺寸紧凑，性能高，灵活性高，可拆卸性好的特点。
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公开(公告)号：US07968991B2
公开(公告)日：2011-06-28
申请号：US11976488
申请日：2007-10-25
申请人： Lin-Yin Wong , Mao-Hua Yeh , Wang-Hsiang Tsai
发明人： Lin-Yin Wong , Mao-Hua Yeh , Wang-Hsiang Tsai
CPC分类号： H05K1/185 , H01L24/24 , H01L24/73 , H01L24/82 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/18165 , H01L2924/19105 , H05K1/023 , H05K1/117 , H05K3/4602 , H05K3/4694 , H05K2201/09845 , H05K2201/10734 , H05K2203/1572 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads; the first circuit board comprises a first surface, an opposite second surface, a plurality of exposed electro-connecting ends, a plurality of first conductive pads on the first surface, a plurality of conductive vias, and at least one circuit layer, therewith the electrode pads of the first chip electrically connecting to the electro-connecting ends and the first conductive pads directly through the conductive vias and the circuit layer; and a second package structure electrically connecting to the first package structure through a plurality of first solder balls to make a package on package. The stacked package module of this invention has characters of compact size, high performance, high flexibility, and detachability.
摘要翻译： 公开了一种堆叠封装模块，其包括：第一封装结构，其包括嵌入其中的第一芯片的第一电路板，其中所述第一芯片具有多个电极焊盘; 第一电路板包括第一表面，相对的第二表面，多个暴露的电连接端，第一表面上的多个第一导电焊盘，多个导电通孔，以及至少一个电路层，其中电极 第一芯片的焊盘直接通过导电通孔和电路层电连接到电连接端和第一导电焊盘; 以及第二封装结构，其通过多个第一焊球电连接到所述第一封装结构，以使封装成封装。 本发明的堆叠式封装模块具有尺寸紧凑，性能高，灵活性高，可拆卸性好的特点。
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公开(公告)号：US20080230886A1
公开(公告)日：2008-09-25
申请号：US11976489
申请日：2007-10-25
申请人： Lin-Yin Wong , Mao-Hua Yeh , Wang-Hsiang Tsai
发明人： Lin-Yin Wong , Mao-Hua Yeh , Wang-Hsiang Tsai
IPC分类号： H01L23/488
CPC分类号： H01L25/105 , H01L23/13 , H01L23/3128 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/73 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2924/14 , H01L2924/15311 , H01L2924/18165 , H05K1/144 , H05K1/185 , H05K3/3436 , H05K3/4602 , H05K2201/041 , H05K2201/10674 , H01L2924/00 , H01L2924/00012
摘要： A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads, the first circuit board comprises a first surface, an opposite second surface, a plurality of first conductive pads on the first surface, a plurality of second conductive pads on the second surface, a plurality of conductive vias, and at least one circuit layer, and the electrodes of the first chip directly electrically connect to the conductive pads on the surfaces of the circuit board through the conductive vias and the circuit layer within the circuit board; and a second package structure electrically connecting to the first package structure through a plurality of solder balls to make package on package. The stacked package module provided by this invention has characteristics of compact size, high performance, and high flexibility.
摘要翻译： 公开了一种堆叠封装模块，其包括：第一封装结构，其包括嵌入其中的第一芯片的第一电路板，其中所述第一芯片具有多个电极焊盘，所述第一电路板包括第一表面，相对的第二表面 ，第一表面上的多个第一导电焊盘，第二表面上的多个第二导电焊盘，多个导电通孔和至少一个电路层，并且第一芯片的电极直接电连接到导电焊盘 在电路板的表面上通过导电通孔和电路板内的电路层; 以及第二封装结构，其通过多个焊球电连接到所述第一封装结构，以使封装成封装。 本发明提供的堆叠封装模块具有尺寸紧凑，性能高，灵活性高的特点。
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