公开(公告)号：US07968991B2

公开(公告)日：2011-06-28

申请号：US11976488

申请日：2007-10-25

申请人： Lin-Yin Wong ,  Mao-Hua Yeh ,  Wang-Hsiang Tsai

发明人： Lin-Yin Wong ,  Mao-Hua Yeh ,  Wang-Hsiang Tsai

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K7/00 ,  H05K1/18

CPC分类号： H05K1/185 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/18165 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/117 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/09845 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads; the first circuit board comprises a first surface, an opposite second surface, a plurality of exposed electro-connecting ends, a plurality of first conductive pads on the first surface, a plurality of conductive vias, and at least one circuit layer, therewith the electrode pads of the first chip electrically connecting to the electro-connecting ends and the first conductive pads directly through the conductive vias and the circuit layer; and a second package structure electrically connecting to the first package structure through a plurality of first solder balls to make a package on package. The stacked package module of this invention has characters of compact size, high performance, high flexibility, and detachability.

摘要翻译： 公开了一种堆叠封装模块，其包括：第一封装结构，其包括嵌入其中的第一芯片的第一电路板，其中所述第一芯片具有多个电极焊盘; 第一电路板包括第一表面，相对的第二表面，多个暴露的电连接端，第一表面上的多个第一导电焊盘，多个导电通孔，以及至少一个电路层，其中电极 第一芯片的焊盘直接通过导电通孔和电路层电连接到电连接端和第一导电焊盘; 以及第二封装结构，其通过多个第一焊球电连接到所述第一封装结构，以使封装成封装。 本发明的堆叠式封装模块具有尺寸紧凑，性能高，灵活性高，可拆卸性好的特点。

公开(公告)号：US07656015B2

公开(公告)日：2010-02-02

申请号：US12283538

申请日：2008-09-12

申请人： Lin-Yin Wong ,  Mao-Hua Yeh

发明人： Lin-Yin Wong ,  Mao-Hua Yeh

IPC分类号： H01L23/02

CPC分类号： H01L23/5389 ,  H01L23/3677 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/00

摘要： Provided is a packaging substrate with a heat-dissipating structure, including a core layer with a first surface and an opposite second surface having a first metal layer and a second metal layer respectively. Portions of the first metal layer are exposed from a second cavity penetrating the core layer and second metal layer. Portions of the second metal layer are exposed from a first cavity penetrating the core layer and first metal layer. Semiconductor chips each having an active surface with electrode pads thereon and an opposite inactive surface are received in the first and second cavities and attached to the second metal layer and the first metal layer respectively. Conductive vias disposed in build-up circuit structures electrically connect to the electrode pads of the semiconductor chips. A heat-dissipating through hole penetrating the core layer and build-up circuit structures connects the metal layers and contact pads.

摘要翻译： 本发明提供一种具有散热结构的封装基板，其包括具有第一表面的芯层和分别具有第一金属层和第二金属层的相对的第二表面。 第一金属层的一部分从穿透芯层和第二金属层的第二腔露出。 第二金属层的一部分从穿透芯层和第一金属层的第一腔露出。 各自具有其上具有电极焊盘的有源表面和相对的无效表面的半导体芯片被接收在第一和第二腔中，并分别附着到第二金属层和第一金属层。 设置在积聚电路结构中的导电通孔电连接到半导体芯片的电极焊盘。 穿透核心层和积聚电路结构的散热通孔连接金属层和接触垫。

公开(公告)号：US20080230886A1

公开(公告)日：2008-09-25

申请号：US11976489

申请日：2007-10-25

申请人： Lin-Yin Wong ,  Mao-Hua Yeh ,  Wang-Hsiang Tsai

发明人： Lin-Yin Wong ,  Mao-Hua Yeh ,  Wang-Hsiang Tsai

IPC分类号： H01L23/488

CPC分类号： H01L25/105 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18165 ,  H05K1/144 ,  H05K1/185 ,  H05K3/3436 ,  H05K3/4602 ,  H05K2201/041 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads, the first circuit board comprises a first surface, an opposite second surface, a plurality of first conductive pads on the first surface, a plurality of second conductive pads on the second surface, a plurality of conductive vias, and at least one circuit layer, and the electrodes of the first chip directly electrically connect to the conductive pads on the surfaces of the circuit board through the conductive vias and the circuit layer within the circuit board; and a second package structure electrically connecting to the first package structure through a plurality of solder balls to make package on package. The stacked package module provided by this invention has characteristics of compact size, high performance, and high flexibility.

摘要翻译： 公开了一种堆叠封装模块，其包括：第一封装结构，其包括嵌入其中的第一芯片的第一电路板，其中所述第一芯片具有多个电极焊盘，所述第一电路板包括第一表面，相对的第二表面 ，第一表面上的多个第一导电焊盘，第二表面上的多个第二导电焊盘，多个导电通孔和至少一个电路层，并且第一芯片的电极直接电连接到导电焊盘 在电路板的表面上通过导电通孔和电路板内的电路层; 以及第二封装结构，其通过多个焊球电连接到所述第一封装结构，以使封装成封装。 本发明提供的堆叠封装模块具有尺寸紧凑，性能高，灵活性高的特点。

公开(公告)号：US20090072384A1

公开(公告)日：2009-03-19

申请号：US12283538

申请日：2008-09-12

申请人： Lin-Yin Wong ,  Mao-Hua Yeh

发明人： Lin-Yin Wong ,  Mao-Hua Yeh

IPC分类号： H01L23/36

CPC分类号： H01L23/5389 ,  H01L23/3677 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/00

摘要： Provided is a packaging substrate with a heat-dissipating structure, including a core layer with a first surface and an opposite second surface having a first metal layer and a second metal layer respectively. Portions of the first metal layer are exposed from a second cavity penetrating the core layer and second metal layer. Portions of the second metal layer are exposed from a first cavity penetrating the core layer and first metal layer. Semiconductor chips each having an active surface with electrode pads thereon and an opposite inactive surface are received in the first and second cavities and attached to the second metal layer and the first metal layer respectively. Conductive vias disposed in build-up circuit structures electrically connect to the electrode pads of the semiconductor chips. A heat-dissipating through hole penetrating the core layer and build-up circuit structures connects the metal layers and contact pads.

摘要翻译： 本发明提供一种具有散热结构的封装基板，其包括具有第一表面的芯层和分别具有第一金属层和第二金属层的相对的第二表面。 第一金属层的一部分从穿透芯层和第二金属层的第二腔露出。 第二金属层的一部分从穿透芯层和第一金属层的第一腔露出。 各自具有其上具有电极焊盘的有源表面和相对的无效表面的半导体芯片被接收在第一和第二腔中，并分别附着到第二金属层和第一金属层。 设置在积聚电路结构中的导电通孔电连接到半导体芯片的电极焊盘。 穿透核心层和积聚电路结构的散热通孔连接金属层和接触垫。

公开(公告)号：US20080246135A1

公开(公告)日：2008-10-09

申请号：US11976488

申请日：2007-10-25

申请人： Lin-Yin Wong ,  Mao-Hua Yeh ,  Wang-Hsiang Tsai

发明人： Lin-Yin Wong ,  Mao-Hua Yeh ,  Wang-Hsiang Tsai

IPC分类号： H01L23/488

CPC分类号： H05K1/185 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/18165 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/117 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/09845 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads; the first circuit board comprises a first surface, an opposite second surface, a plurality of exposed electro-connecting ends, a plurality of first conductive pads on the first surface, a plurality of conductive vias, and at least one circuit layer, therewith the electrode pads of the first chip electrically connecting to the electro-connecting ends and the first conductive pads directly through the conductive vias and the circuit layer; and a second package structure electrically connecting to the first package structure through a plurality of first solder balls to make a package on package. The stacked package module of this invention has characters of compact size, high performance, high flexibility, and detachability.

摘要翻译： 公开了一种堆叠封装模块，其包括：第一封装结构，其包括嵌入其中的第一芯片的第一电路板，其中所述第一芯片具有多个电极焊盘; 第一电路板包括第一表面，相对的第二表面，多个暴露的电连接端，第一表面上的多个第一导电焊盘，多个导电通孔，以及至少一个电路层，其中电极 第一芯片的焊盘直接通过导电通孔和电路层电连接到电连接端和第一导电焊盘; 以及第二封装结构，其通过多个第一焊球电连接到所述第一封装结构，以使封装成封装。 本发明的堆叠式封装模块具有尺寸紧凑，性能高，灵活性高，可拆卸性好的特点。