公开(公告)号：US5379644A

公开(公告)日：1995-01-10

申请号：US919526

申请日：1992-07-24

申请人： Hiroaki Yanagida ,  Masaru Miyayama ,  Norio Muto ,  Minoru Sugita ,  Teruyuki Nakatsuji ,  Yasushi Otsuka

发明人： Hiroaki Yanagida ,  Masaru Miyayama ,  Norio Muto ,  Minoru Sugita ,  Teruyuki Nakatsuji ,  Yasushi Otsuka

IPC分类号： G01B7/16 ,  G01L1/22 ,  G01L1/18

CPC分类号： G01B7/18 ,  G01L1/2287

摘要： A strain or stress gauge 1A is presented for measuring the stress of a structure or a member. The gauge 1A comprises a bundle of electric conductive fibers 3, and a pair of terminals 4, for measuring an electric resistance of the bundle of electric conductive fibers provided on both ends thereof. It presents a strain or stress gauge having a simple structure, which can be produced inexpensively, and its size can be chosen freely. It is possible to know not only the state of a strain or stress but also the history of stress in a structure or a structural member which, by the characteristics of a specific curve relating the stress/strain relationship of the gauge.

摘要翻译： 提出了应变计或应力计1A用于测量结构或构件的应力。 仪表1A包括一束导电纤维3和一对端子4，用于测量其两端设置的导电纤维束的电阻。 它具有可以廉价生产的具有简单结构的应变计或应力计，其尺寸可以自由选择。 可以通过与量规的应力/应变关系相关联的特定曲线的特性来知道应变或应力的状态，而且可以知道结构或结构构件中的应力历史。

公开(公告)号：US5945741A

公开(公告)日：1999-08-31

申请号：US812358

申请日：1997-03-05

申请人： Kenji Ohsawa ,  Makoto Ito ,  Yasushi Otsuka ,  Kazuhiro Sato

发明人： Kenji Ohsawa ,  Makoto Ito ,  Yasushi Otsuka ,  Kazuhiro Sato

IPC分类号： H01L23/24 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L24/50 ,  H01L23/24 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/351

摘要： A semiconductor device employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive reinforcing plate. Advantageously the conductive reinforcing plate reduces electrical noise from interfering with the semiconductor device and prevents the semiconductor device from radiating undesired signals. The interconnecting films also reduce cross-talk between signal lines of the semiconductor device.

摘要翻译： 半导体器件在薄膜电路上使用互连膜作为延伸到薄膜电路的周边的接地线，其中进一步连接到导电加强板。 有利的是，导电加强板可降低干扰半导体器件的电噪声，并防止半导体器件辐射不期望的信号。 互连膜还减少了半导体器件的信号线之间的串扰。

公开(公告)号：US5444603A

公开(公告)日：1995-08-22

申请号：US273129

申请日：1994-07-14

申请人： Yasushi Otsuka ,  Masayoshi Unno ,  Hideki Ohashi

发明人： Yasushi Otsuka ,  Masayoshi Unno ,  Hideki Ohashi

IPC分类号： B60Q1/068 ,  B60Q1/06 ,  F16B39/284

CPC分类号： B60Q1/0683 ,  B60Q2900/20 ,  Y02T10/88 ,  Y10S411/918

摘要： A push-on fixer for screw engagement in which a plurality of radially extending notches are formed in a circumferential edge region of a circular hole formed at a center portion of a thin discoid body, and a plurality of inner plate spring pieces are formed on the circumferential edge region of the circular hole so as to allow insertion of an aiming screw into the circular hole and so as to clamp the inserted aiming screw, is provided. An aiming screw is inserted into an aiming screw insertion hole of a lamp body of an automobile head lamp, and is retained so as to be prevented from coming out of the lamp body. A plurality of outer plate spring pieces which press against a push-on fixer abutment surface of the lamp body and a plurality of clamp release claws for releasing the clamping of the screw by the screw clamp plate spring pieces are formed on the outer circumferential edge of the thin discoid body.

摘要翻译： 一种用于螺钉接合的推压定位器，其中在形成在薄盘状体的中心部分处的圆形孔的圆周边缘区域中形成有多个径向延伸的凹口，以及多个内板弹簧片 提供圆孔的圆周边缘区域，以便允许将瞄准螺钉插入到圆形孔中并且夹紧插入的瞄准螺钉。 将瞄准螺钉插入汽车前灯的灯体的瞄准螺钉插入孔中，并且被保持以防止从灯体出来。 多个外壳板弹簧片压靠在灯体的推动定位器抵接表面上，并且多个夹紧释放爪用于通过螺旋夹板弹簧片释放螺钉的夹紧而形成在外周边缘上 薄的圆盘状体。

公开(公告)号：US4951178A

公开(公告)日：1990-08-21

申请号：US414497

申请日：1989-09-29

申请人： Katsutada Shirai ,  Yasushi Otsuka

发明人： Katsutada Shirai ,  Yasushi Otsuka

IPC分类号： B60Q1/076 ,  F21S8/10 ,  F21V14/08 ,  B60Q1/00

CPC分类号： F21S48/1784 ,  B60Q1/076 ,  F21S48/1131

摘要： A headlight for a motor vehicle which can selectively be used as an ordinary headlight or a fog light. A yellow cover is slidably mounted slidable along the axial direction of the bulb of the headlight so that it can be moved between a position where is surrounds the bulb, in which light emitted by the bulb must pass through the cover before reaching the reflector, and a position where the light from the bulb can proceed directly to the reflector without passing through the cover.

摘要翻译： 可以选择性地用作普通大灯或雾灯的机动车辆的前灯。 黄色的盖可滑动地安装，可以沿着头灯的灯泡的轴向方向滑动，使得其可以在包围灯泡的位置之间移动，灯泡在其中发射的光必须在到达反射器之前通过盖子;以及 来自灯泡的光可以直接进入反射器而不通过盖的位置。

公开(公告)号：US6093970A

公开(公告)日：2000-07-25

申请号：US361955

申请日：1999-07-27

申请人： Kenji Ohsawa ,  Makoto Ito ,  Yasushi Otsuka ,  Kazuhiro Sato

发明人： Kenji Ohsawa ,  Makoto Ito ,  Yasushi Otsuka ,  Kazuhiro Sato

IPC分类号： H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/48

CPC分类号： H01L24/50 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49572 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/3025 ,  H01L2924/351

摘要： An improved semiconductor device and method of manufacturing employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive reinforcing plate 25. Advantageously, the conductive reinforcing plate reduces electrical noise from interfering with the semiconductor device and prevents the semiconductor device from radiating undesired signals. The interconnecting films also reduce cross-talk between signal lines of the semiconductor device.

摘要翻译： 改进的半导体器件和制造方法在薄膜电路上使用互连膜作为接地线，其延伸到膜电路的外围，其中进一步连接到导电加强板25.有利地，导电加强板减少电噪声干扰 与半导体器件并且防止半导体器件辐射不期望的信号。 互连膜还减少了半导体器件的信号线之间的串扰。

公开(公告)号：US06818986B2

公开(公告)日：2004-11-16

申请号：US09983253

申请日：2001-10-23

申请人： Yuichiro Ikenaga ,  Yasushi Otsuka

发明人： Yuichiro Ikenaga ,  Yasushi Otsuka

IPC分类号： H01L2348

CPC分类号： H01L23/544 ,  G01R31/2884 ,  G01R31/311 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/12036 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： An IC (semiconductor device) comprises a package substrate provided on its face side with a plurality of wiring patterns such as electrode lands and wirings and provided on its back side with a plurality of electrode bumps corresponding to the wiring patterns, an IC chip mounted on the face side of the package substrate in a face-up manner, a sealing resin sealing the IC chip, and an indication provided on the back side of the package substrate for indicating the position of the IC chip. A method of inspecting a failure reason in the case of some failure of the IC chip comprises the steps of forming an opening by removing from the back side the package substrate in the region surrounded by the indication, mounting the IC chip on a test substrate, passing an electric current to the IC chip for operation, and inspecting and analyzing the reason of failure by a photo-emission analyzing method. The photo-emission analysis can be conducted without processing an upper layer wiring portion or the like of the IC chip.

摘要翻译： IC（半导体器件）包括在其正面侧设置有诸如电极焊盘和布线的多个布线图案的封装基板，并且在其背面上设置有与布线图案对应的多个电极凸块，IC芯片安装在 封装基板的正面朝向，密封IC芯片的密封树脂以及用于指示IC芯片的位置的封装基板背面的指示。 在IC芯片发生故障的情况下检查故障原因的方法包括以下步骤：通过在由指示包围的区域中从封装基板的背面去除形成开口，将IC芯片安装在测试基板上， 将电流传送到IC芯片进行操作，并通过光发射分析方法检查和分析故障原因。 可以在不处理IC芯片的上层布线部分等的情况下进行光发射分析。