公开(公告)号：US20090201708A1

公开(公告)日：2009-08-13

申请号：US12364568

申请日：2009-02-03

申请人： Yasuyuki OHKOUCHI ,  Kuniaki Mamitsu

发明人： Yasuyuki OHKOUCHI ,  Kuniaki Mamitsu

IPC分类号： H02M7/5387

CPC分类号： H01L25/18 ,  H01L24/33 ,  H01L25/072 ,  H01L25/112 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  H02M7/003 ,  Y10T307/587 ,  Y10T307/593 ,  H01L2924/00

摘要： A semiconductor module has switching semiconductor elements connected in parallel to each other and at least a free wheeling semiconductor element reversely connected in parallel to the switching semiconductor elements. The free wheeling semiconductor element is placed between the switching semiconductor elements. At both end parts of the semiconductor elements, each of the switching semiconductor elements is placed. A longitudinal side of each of the switching semiconductor elements and the free wheeling semiconductor element is placed in parallel to a short side of the semiconductor module. An electric-power conversion device has a plurality of arms. Each arm is composed of the semiconductor elements.

摘要翻译： 半导体模块具有彼此并联连接的开关半导体元件和至少与开关半导体元件并联反向连接的续流半导体元件。 自由轮半导体元件被放置在开关半导体元件之间。 在半导体元件的两端部，配置各个开关用半导体元件。 每个开关半导体元件和续流半导体元件的纵向侧面平行于半导体模块的短边放置。 电力转换装置具有多个臂。 每个臂由半导体元件组成。

公开(公告)号：US07012401B2

公开(公告)日：2006-03-14

申请号：US10825295

申请日：2004-04-16

申请人： Yasuyuki Ohkouchi ,  Kenji Funahashi

发明人： Yasuyuki Ohkouchi ,  Kenji Funahashi

IPC分类号： H02P5/34

CPC分类号： B60L11/1803 ,  B60L1/003 ,  B60L11/1811 ,  B60L11/1868 ,  Y02T10/7005 ,  Y02T10/7066 ,  Y02T10/7072 ,  Y02T90/127 ,  Y02T90/14 ,  Y02T90/16

摘要： An inverter includes an upper ECU, a communication microcomputer receiving an instruction from the upper ECU, a motor control microcomputer receiving an instruction from the communication microcomputer, a gate driving circuit controlled by the motor control microcomputer, and a switching element driven by the gate driving circuit for converting a direct current of a high-voltage battery into an alternating current to drive a motor. The communications between the upper ECU and the communication microcomputer is performed according to a CAN protocol. The communications between the communication microcomputer and the motor control microcomputer is performed according to a low-speed serial communication protocol. An insulation boundary is defined between the communication microcomputer and the motor control microcomputer to isolate a low-voltage side electric component receiving electric power of the low-voltage battery from a high-voltage side electric component receiving electric power of the high-voltage battery. And, a photo coupler is disposed on the insulation boundary to assure insulation and transmit signals.

摘要翻译： 逆变器包括上部ECU，接收来自上部ECU的指令的通信微型计算机，接收来自通信微型计算机的指令的电动机控制微型计算机，由电动机控制微型计算机控制的门驱动电路以及由门驱动驱动的开关元件 电路，用于将高压电池的直流电转换为交流电流以驱动电动机。 根据CAN协议执行上部ECU和通信微型计算机之间的通信。 根据低速串行通信协议进行通信微型计算机与电动机控制微型计算机之间的通信。 在通信微型计算机和电机控制微机之间限定绝缘边界，以将低压电池的低压侧电气部件接收电力与高电压电池的高压侧电气部件接收电力隔离。 并且，光耦合器设置在绝缘边界上以确保绝缘和发射信号。

公开(公告)号：US20050223727A1

公开(公告)日：2005-10-13

申请号：US11147156

申请日：2005-06-08

申请人： Kenji Funahashi ,  Ken Hamada ,  Hiroyuki Kawata ,  Yasuyuki Ohkouchi

发明人： Kenji Funahashi ,  Ken Hamada ,  Hiroyuki Kawata ,  Yasuyuki Ohkouchi

IPC分类号： F01C21/10 ,  F04B35/04 ,  F04B39/12 ,  F04C29/00 ,  H02K5/22 ,  H02K11/04 ,  F25B1/00 ,  F25B49/00 ,  F25D23/12 ,  H02P8/00

CPC分类号： F04B39/121 ,  F01C21/10 ,  F04B35/04 ,  F04B2203/0204 ,  F04C29/0085 ,  F04C2240/808 ,  F25B2400/077 ,  H02K5/225 ,  H02K11/33

摘要： A bus-bar integrated plate and outer frame section, arranged into a double-deck structure and having numerous bus bars molded with a resin molding plate portion, is provided as a wiring for connecting power switching elements and a smoothing capacitor, fixed on an outer surface of a cylindrical wall of a motor housing, to a printed circuit board serving as a control circuit.

摘要翻译： 提供了布置成双层结构并具有由树脂成型板部分模制的多个汇流条的汇流条集成板和外框架部分，用于连接功率开关元件和平滑电容器的布线，固定在外部 电动机壳体的圆柱形壁的表面连接到用作控制电路的印刷电路板。

公开(公告)号：US07207187B2

公开(公告)日：2007-04-24

申请号：US10422958

申请日：2003-04-25

申请人： Kenji Funahashi ,  Ken Hamada ,  Hiroyuki Kawata ,  Yasuyuki Ohkouchi

发明人： Kenji Funahashi ,  Ken Hamada ,  Hiroyuki Kawata ,  Yasuyuki Ohkouchi

IPC分类号： F25D25/00 ,  F25D62/505 ,  F25D62/113 ,  F25D62/259

CPC分类号： F04B39/121 ,  F01C21/10 ,  F04B35/04 ,  F04B2203/0204 ,  F04C29/0085 ,  F04C2240/808 ,  F25B2400/077 ,  H02K5/225 ,  H02K11/33

摘要： A bus-bar integrated plate and outer frame section, arranged into a double-deck structure and having numerous bus bars molded with a resin molding plate portion, is provided as a wiring for connecting power switching elements and a smoothing capacitor, fixed on an outer surface of a cylindrical wall of a motor housing, to a printed circuit board serving as a control circuit.

摘要翻译： 提供了布置成双层结构并具有由树脂成型板部分模制的多个汇流条的汇流条集成板和外框架部分，用于连接功率开关元件和平滑电容器的布线，固定在外部 电动机壳体的圆柱形壁的表面连接到用作控制电路的印刷电路板。

公开(公告)号：US07106592B2

公开(公告)日：2006-09-12

申请号：US10946210

申请日：2004-09-22

申请人： Seiji Inoue ,  Yasuyuki Ohkouchi

发明人： Seiji Inoue ,  Yasuyuki Ohkouchi

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/49833 ,  H01L23/642 ,  H01L24/33 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L25/117 ,  H01L25/16 ,  H01L2023/4081 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

公开(公告)号：US07957135B2

公开(公告)日：2011-06-07

申请号：US12364568

申请日：2009-02-03

申请人： Yasuyuki Ohkouchi ,  Kuniaki Mamitsu

发明人： Yasuyuki Ohkouchi ,  Kuniaki Mamitsu

IPC分类号： H05K7/20 ,  H01L29/00

CPC分类号： H01L25/18 ,  H01L24/33 ,  H01L25/072 ,  H01L25/112 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  H02M7/003 ,  Y10T307/587 ,  Y10T307/593 ,  H01L2924/00

摘要： A semiconductor module has switching semiconductor elements connected in parallel to each other and at least a free wheeling semiconductor element reversely connected in parallel to the switching semiconductor elements. The free wheeling semiconductor element is placed between the switching semiconductor elements. At both end parts of the semiconductor elements, each of the switching semiconductor elements is placed. A longitudinal side of each of the switching semiconductor elements and the free wheeling semiconductor element is placed in parallel to a short side of the semiconductor module. An electric-power conversion device has a plurality of arms. Each arm is composed of the semiconductor elements.

摘要翻译： 半导体模块具有彼此并联连接的开关半导体元件和至少与开关半导体元件并联反向连接的续流半导体元件。 自由轮半导体元件被放置在开关半导体元件之间。 在半导体元件的两端部，配置各个开关用半导体元件。 每个开关半导体元件和续流半导体元件的纵向侧面平行于半导体模块的短边放置。 电力转换装置具有多个臂。 每个臂由半导体元件组成。

公开(公告)号：US20050040515A1

公开(公告)日：2005-02-24

申请号：US10946210

申请日：2004-09-22

申请人： Seiji Inoue ,  Yasuyuki Ohkouchi

发明人： Seiji Inoue ,  Yasuyuki Ohkouchi

IPC分类号： H01L23/40 ,  H01L23/433 ,  H01L23/473 ,  H01L23/498 ,  H01L25/07 ,  H01L25/11 ,  H01L23/58

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/49833 ,  H01L23/642 ,  H01L24/33 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L25/117 ,  H01L25/16 ,  H01L2023/4081 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

摘要翻译： 提供能够实现优异的散热能力的冷却剂冷却型半导体器件，同时具有简单的结构。 虽然多个半导体模块被布置成使得这些半导体模块的主表面方向沿着其厚度方向以间隔彼此平行地定位。 这些半导体模块被具有固定构件的具有折叠部分的冷却剂管夹持。 因此，半导体模块的两个表面可以由具有均匀夹持力的单个冷却剂管冷却。

公开(公告)号：US06845012B2

公开(公告)日：2005-01-18

申请号：US10314139

申请日：2002-12-09

申请人： Yasuyuki Ohkouchi

发明人： Yasuyuki Ohkouchi

IPC分类号： H01L23/40 ,  H01L23/433 ,  H01L23/473 ,  H01L23/498 ,  H01L25/07 ,  H01L25/11 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/49833 ,  H01L23/642 ,  H01L24/33 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L25/117 ,  H01L25/16 ,  H01L2023/4081 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules 1 are arranged in such a manner that main surface directions of these semiconductor modules 1 are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules 1 are sandwiched by coolant tube 2 having folded portions with fixing members 6, 7, 10. As a consequence, both surfaces of the semiconductor module 1 can be cooled by a single coolant tube with a uniform pinching force.

摘要翻译： 提供能够实现优异的散热能力的冷却剂冷却型半导体器件，同时具有简单的结构。 虽然多个半导体模块1以这样的方式布置，即这些半导体模块1的主表面方向沿其厚度方向以间隔彼此平行地定位。 这些半导体模块1被具有固定构件6,7,10的折叠部分的冷却剂管2夹持。因此，半导体模块1的两个表面可以由具有均匀夹持力的单个冷却剂管冷却。