公开(公告)号：US20140054255A1

公开(公告)日：2014-02-27

申请号：US14114393

申请日：2012-04-09

Applicant: Hiroshi Hosokoshiyama ,  Yosuke Watanabe ,  Yosuke Watanabe

Inventor： Hiroshi Hosokoshiyama ,  Yosuke Watanabe ,  Yosuke Watanabe

IPC: B29D22/00 ,  B29B11/14 ,  B29C45/28

CPC classification number: B29D22/003 ,  B29B11/14 ,  B29B2911/1402 ,  B29B2911/1404 ,  B29B2911/14066 ,  B29B2911/14073 ,  B29B2911/1408 ,  B29B2911/14086 ,  B29B2911/1412 ,  B29B2911/14326 ,  B29C45/1603 ,  B29C45/1646 ,  B29C45/2806 ,  B29C49/0073 ,  B29C49/06 ,  B29C49/10 ,  B29C49/221 ,  B29K2105/253 ,  B29K2995/0021 ,  B29K2995/0067 ,  B29K2995/0069 ,  B29L2031/7158 ,  B65D1/0207 ,  B65D1/0215

Abstract: Disclosed is an injection molding device and process for a test tube shaped preform, that can laminate a colored layer at certain positions with a certain thickness accurately. Included is a nozzle section, in which a molten main resin and second resin are joined together to form a joined resin mass, the nozzle section including: an outer flow channel through which the main resin flows, an inner flow channel through which the second resin flows, a cylindrical column-shaped flow channel where the second resin joins the main resin, a first confluence where the main resin flows into the joined flow channel, a second confluence where the second resin flows into the joined flow channel wherein the first confluence is downstream of the second confluence, and a cylindrical shutoff pin inserted in the joined flow channel to open or close one or both the first and second confluences.

Abstract translation: 公开了一种用于试管状预成型件的注射成型装置和方法，其可以在某些位置以一定的厚度精确地层压着色层。 包括一个喷嘴部分，其中熔化的主要树脂和第二树脂被接合在一起以形成接合的树脂块，该喷嘴部分包括：主流动的主流动的外部流动通道，第二树脂 流动，其中第二树脂与主树脂接合的圆柱形柱状流动通道，主要树脂流入接合流动通道的第一汇合处，第二聚合流体，其中第二树脂流入接合流动通道，其中第一汇合为 在第二汇合点的下游，以及插入连接的流动通道中以打开或关闭第一和第二汇合中的一个或两个的圆柱形截止销。

公开(公告)号：US10300670B2

公开(公告)日：2019-05-28

申请号：US15829384

申请日：2017-12-01

Applicant: Hiroshi Hosokoshiyama ,  Junichi Chiba ,  Yosuke Watanabe

Inventor： Hiroshi Hosokoshiyama ,  Junichi Chiba ,  Yosuke Watanabe

IPC: B29C45/16 ,  B29D22/00 ,  B29C49/00 ,  B29C49/22 ,  B65D1/02 ,  B29B11/14 ,  B29K105/00 ,  B29C49/06 ,  B29L31/00 ,  B29C49/10 ,  B29C45/28

Abstract: Technical problems of this invention is to create an injection molding device and an injection molding process for a test tube shaped preform, that can laminate a colored layer at certain positions of a wall of the reform with a certain thickness in a manner of a high degree of accuracy.A feature associated with the injection molding device to solve these problem comprising a nozzle section, in which a molten main resin and a molten second resin are join together to form a joined resin mass, the nozzle section comprising: an outer flow channel through which the main resin flows, an inner flow channel through which the second resin flows, a cylindrical column-shaped joined flow channel where the second resin from the inner flow channel joins the main resin from the outer flow channel, a first confluence disposed at a point where the main resin from the outer flow channel flows into the joined flow channel, a second confluence disposed at a point where the second resin flows into the joined flow channel wherein the first confluence is located downstream of the second confluence with a predetermined space left in between, and a cylindrical shutoff pin inserted slidably in the joined flow channel, wherein this shutoff pin is capable of shutting off or opening either or both of the first confluence and/or the second confluence, depending on the sliding position.

公开(公告)号：US09862157B2

公开(公告)日：2018-01-09

申请号：US14114393

申请日：2012-04-09

Applicant: Hiroshi Hosokoshiyama ,  Junichi Chiba ,  Yosuke Watanabe

Inventor： Hiroshi Hosokoshiyama ,  Junichi Chiba ,  Yosuke Watanabe

IPC: B29C45/16 ,  B29D22/00 ,  B29C49/00 ,  B29C49/22 ,  B65D1/02 ,  B29B11/14 ,  B29K105/00 ,  B29C49/06 ,  B29L31/00 ,  B29C49/10 ,  B29C45/28

CPC classification number: B29D22/003 ,  B29B11/14 ,  B29B2911/1402 ,  B29B2911/1404 ,  B29B2911/14066 ,  B29B2911/14073 ,  B29B2911/1408 ,  B29B2911/14086 ,  B29B2911/1412 ,  B29B2911/14326 ,  B29C45/1603 ,  B29C45/1646 ,  B29C45/2806 ,  B29C49/0073 ,  B29C49/06 ,  B29C49/10 ,  B29C49/221 ,  B29K2105/253 ,  B29K2995/0021 ,  B29K2995/0067 ,  B29K2995/0069 ,  B29L2031/7158 ,  B65D1/0207 ,  B65D1/0215

Abstract: Disclosed is an injection molding device and process for a test tube shaped preform, that can laminate a colored layer at certain positions with a certain thickness accurately. Included is a nozzle section, in which a molten main resin and second resin are joined together to form a joined resin mass, the nozzle section including: an outer flow channel through which the main resin flows, an inner flow channel through which the second resin flows, a cylindrical column-shaped flow channel where the second resin joins the main resin, a first confluence where the main resin flows into the joined flow channel, a second confluence where the second resin flows into the joined flow channel wherein the first confluence is downstream of the second confluence, and a cylindrical shutoff pin inserted in the joined flow channel to open or close one or both the first and second confluences.

公开(公告)号：US08786992B2

公开(公告)日：2014-07-22

申请号：US12727559

申请日：2010-03-19

Applicant: Yoko Sumiyoshi ,  Junichi Fujiwara ,  Yosuke Watanabe

Inventor： Yoko Sumiyoshi ,  Junichi Fujiwara ,  Yosuke Watanabe

IPC: H01T4/08 ,  H01T4/06 ,  H01T4/10 ,  H01T4/16 ,  H01H9/06

CPC classification number: H02H9/06 ,  H01T4/08

Abstract: An electrical apparatus, which is immovable in a facility, comprises plural electric circuits. Each electric circuit has one or more resistance elements and is connected to each input terminal connected a power source. The electric circuits are arranged positionally closely with each other. In each electric circuit, a desired functional circuit is connected in series to the resistance element, and a protection circuit is connected in series to the resistance element and connected in parallel with the functional circuit. A discharge member is provided in each electric circuit and arranged between each input terminal and the functional circuit. The discharge member includes a discharge gap which allows the discharge member to face with the discharge member of an adjacently arranged electric circuit.The discharge gap discharge deliberately to the adjacently positioned discharge member when a voltage applied to a selected electric circuit exceeds a predetermined voltage value.

Abstract translation: 在设施中不可移动的电气设备包括多个电路。 每个电路具有一个或多个电阻元件，并且连接到连接到电源的每个输入端子。 电路彼此位置紧密地排列。 在每个电路中，期望的功能电路与电阻元件串联连接，并且保护电路与电阻元件串联连接并与功能电路并联。 在每个电路中设置放电构件，并且布置在每个输入端子和功能电路之间。 放电构件包括放电间隙，其允许放电构件面对相邻布置的电路的放电构件。 当施加到所选择的电路上的电压超过预定电压值时，放电间隙放电到相邻定位的放电构件。

公开(公告)号：US20110058286A1

公开(公告)日：2011-03-10

申请号：US12727559

申请日：2010-03-19

Applicant: Yoko SUMIYOSHI ,  Junichi FUJIWARA ,  Yosuke WATANABE

Inventor： Yoko SUMIYOSHI ,  Junichi FUJIWARA ,  Yosuke WATANABE

IPC: H02H9/04

CPC classification number: H02H9/06 ,  H01T4/08

Abstract: An electrical apparatus, which is immovable in a facility, comprises plural electric circuits. Each electric circuit has one or more resistance elements and is connected to each input terminal connected a power source. The electric circuits are arranged positionally closely with each other. In each electric circuit, a desired functional circuit is connected in series to the resistance element, and a protection circuit is connected in series to the resistance element and connected in parallel with the functional circuit. A discharge member is provided in each electric circuit and arranged between each input terminal and the functional circuit. The discharge member includes a discharge gap which allows the discharge member to face with the discharge member of an adjacently arranged electric circuit. The discharge gap discharge deliberately to the adjacently positioned discharge member when a voltage applied to any of the electric circuits exceeds a predetermined voltage value.

Abstract translation: 在设施中不可移动的电气设备包括多个电路。 每个电路具有一个或多个电阻元件，并且连接到连接到电源的每个输入端子。 电路彼此位置紧密地排列。 在每个电路中，期望的功能电路与电阻元件串联连接，并且保护电路与电阻元件串联连接并与功能电路并联。 在每个电路中设置放电构件，并且布置在每个输入端子和功能电路之间。 放电构件包括放电间隙，其允许放电构件面对相邻布置的电路的放电构件。 当施加到任何电路的电压超过预定电压值时，放电间隙放电到相邻定位的放电构件。

公开(公告)号：US07345170B2

公开(公告)日：2008-03-18

申请号：US10500451

申请日：2003-04-03

Applicant: Taketo Hayashi ,  Takehiko Kawakami ,  Yoshihiko Iwanaga ,  Yosuke Watanabe

Inventor： Taketo Hayashi ,  Takehiko Kawakami ,  Yoshihiko Iwanaga ,  Yosuke Watanabe

IPC: C07D473/18

CPC classification number: C07D473/18

Abstract: The present invention can provide a solvate, a cubic crystal and a columnar crystal of 2-amino-6-benzyloxypurine by crystallization from (1) a solvent containing at least one kind of solvent selected from the group consisting of alcohol and water, (2) alcohol or (3) a water-containing solvent.

Abstract translation: 本发明可以通过从（1）含有选自醇和水中的至少一种溶剂的溶剂（2）得到2-氨基-6-苄氧基嘌呤的溶剂合物，立方晶体和柱状晶体，（2） ）醇或（3）含水溶剂。

公开(公告)号：US20060079155A1

公开(公告)日：2006-04-13

申请号：US11244172

申请日：2005-10-06

Applicant: Masaru Nakamura ,  Yosuke Watanabe ,  Satoshi Kobayashi ,  Noboru Takeda ,  Masanori Yoshida ,  Takashi Sanpei ,  Masahiro Murata

Inventor： Masaru Nakamura ,  Yosuke Watanabe ,  Satoshi Kobayashi ,  Noboru Takeda ,  Masanori Yoshida ,  Takashi Sanpei ,  Masahiro Murata

IPC: B24B1/00

CPC classification number: H01L21/302 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B24B7/228 ,  H01L21/02021

Abstract: A wafer grinding method for grinding the surface to be ground of a wafer having an arcuatedly chamfered outer peripheral surface, comprising an outer peripheral portion removal step for removing the outer peripheral portion of the wafer by applying a laser beam from one surface side of the wafer along the outer periphery at a location on the inside of the outer periphery by a predetermined distance; and a grinding step for grinding the surface to be ground of the wafer whose outer peripheral portion has been removed, to a predetermined finish thickness.

Abstract translation: 一种用于研磨具有圆弧倒角外周面的晶片被研磨表面的晶片研磨方法，包括外周部分去除步骤，用于通过从晶片的一个表面侧施加激光来去除晶片的外周部分 沿着所述外周的内侧的位置沿所述外周延伸预定距离; 以及研磨步骤，用于将已经除去外周部分的晶片的被研磨表面研磨至预定的精加工厚度。

公开(公告)号：US20060079069A1

公开(公告)日：2006-04-13

申请号：US11242019

申请日：2005-10-04

Applicant: Yusuke Nagai ,  Yukio Morishige ,  Yosuke Watanabe

Inventor： Yusuke Nagai ,  Yukio Morishige ,  Yosuke Watanabe

IPC: H01L21/324 ,  H01L21/42 ,  H01L21/477 ,  H01L21/26 ,  H01L21/30 ,  H01L21/46

CPC classification number: H01L21/268 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  H01L21/78

Abstract: A silicon wafer laser processing method for forming a deteriorated layer along dividing lines formed on a silicon wafer in the inside of the silicon wafer by applying a laser beam along the dividing lines, wherein the wavelength of the laser beam is set to 1,100 to 2,000 nm.

公开(公告)号：US09068055B2

公开(公告)日：2015-06-30

申请号：US14110043

申请日：2012-04-24

Applicant: Yosuke Watanabe ,  Orhan Ozturk ,  Yasuo Uekita

Inventor： Yosuke Watanabe ,  Orhan Ozturk ,  Yasuo Uekita

IPC: C08K5/20 ,  B60C1/00 ,  C08K5/17 ,  C08L21/00

CPC classification number: C07C235/68 ,  B29B7/7495 ,  B60C1/00 ,  B60C1/0008 ,  B60C1/0016 ,  B60C1/0025 ,  B60C1/0041 ,  C08K3/013 ,  C08K5/17 ,  C08K5/20 ,  Y10T152/10495 ,  Y10T152/1081 ,  C08L21/00 ,  C08K3/0033

Abstract: A rubber composition obtained by kneading at least one selected from the group consisting of (A1), (B1), (C1) and (D1), a rubber component and a filler, and a method of improving the viscoelastic property of vulcanized rubber, comprising a first step of kneading at least one selected from the group consisting of (A1), (B1), (C1) and (D1), a rubber component, a filler and a sulfur component and a second step of thermally treating the kneaded material obtained in the previous step. (A1): a compound represented by formula (I) (B1): a salt of a compound represented by formula (I) (C1): a solvate of a compound represented by formula (I) (D1): a solvate of a salt of a compound represented by formula (I).

Abstract translation: 通过捏合从（A1），（B1），（C1）和（D1）组成的组中选择的至少一种橡胶组分和填料获得的橡胶组合物和改进硫化橡胶的粘弹性的方法， 包括：捏合从（A1），（B1），（C1）和（D1）组成的组中选出的至少一种的橡胶组分，填料和硫组分的第一步骤，以及第二步， 在上一步中获得的材料。 （A1）：由式（I）表示的化合物（B1）：由式（I）表示的化合物的盐（C1）：由式（I）（D1）表示的化合物的溶剂合物： 由式（I）表示的化合物的盐。

公开(公告)号：US08222284B2

公开(公告)日：2012-07-17

申请号：US12665740

申请日：2008-07-07

Applicant: Hiroko Kusano ,  Dinesh Shyamdeo Mishra ,  Yoshikazu Tashiro ,  Yosuke Watanabe ,  Hong Zhuang

Inventor： Hiroko Kusano ,  Dinesh Shyamdeo Mishra ,  Yoshikazu Tashiro ,  Yosuke Watanabe ,  Hong Zhuang

IPC: A61K31/433

CPC classification number: A61K31/433 ,  A61K9/0019 ,  A61K9/19

Abstract: The present invention provides formulation parameters and manufacturing conditions for stable pharmaceutical compositions comprising N-{4-(2,2-dimethyl-propionyl)-(5R)-5-[(2-ethylamino-ethanesulfonylamino)-methyl]-5-phenyl-4,5-dihydro-[1,3,4]thiadiazol-2-yl}-2,2-dimethyl-propionamide that minimize undesirable chiral conversion to the less active S enantiomeric form.

Abstract translation: 本发明提供了包含N- {4-（2,2-二甲基 - 丙酰基） - （5R）-5 - [（2-乙基氨基 - 乙磺酰基氨基） - 甲基] -5-苯基的稳定药物组合物的制剂参数和制备条件 -4,5-二氢 - [1,3,4]噻二唑-2-基} -2,2-二甲基 - 丙酰胺，其使不期望的手性转化为较不活泼的S对映体形式。