公开(公告)号：US07808796B2

公开(公告)日：2010-10-05

申请号：US11852888

申请日：2007-09-10

申请人： Hidefumi Hatanaka ,  Tsutomu Adachi ,  Youichi Yokote ,  Miho Imashioya ,  Tomohiko Taniguchi

发明人： Hidefumi Hatanaka ,  Tsutomu Adachi ,  Youichi Yokote ,  Miho Imashioya ,  Tomohiko Taniguchi

IPC分类号： H05K7/00

CPC分类号： H05K1/183 ,  H01L23/552 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/49109 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/09845 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10689 ,  Y10T29/49133 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component module comprises a circuit board having a cavity in one principal surface thereof. The electronic component module also comprises a first semiconductor device accommodated within the cavity and a second semiconductor device disposed on the one principal surface of the circuit board so as to cover the first semiconductor device in plan view. The electronic component module further comprises a resin material disposed to cover at least a side surface of the second semiconductor device.

摘要翻译： 电子部件模块包括其一个主表面中具有空腔的电路板。 电子部件模块还包括容纳在腔内的第一半导体器件和设置在电路板的一个主表面上的第二半导体器件，以便在平面图中覆盖第一半导体器件。 电子部件模块还包括设置成覆盖第二半导体器件的至少侧面的树脂材料。

公开(公告)号：US20080192443A1

公开(公告)日：2008-08-14

申请号：US11852888

申请日：2007-09-10

申请人： Hidefumi HATANAKA ,  Tsutomu ADACHI ,  Youichi YOKOTE ,  Miho IMASHIOYA ,  Tomohiko TANIGUCHI

发明人： Hidefumi HATANAKA ,  Tsutomu ADACHI ,  Youichi YOKOTE ,  Miho IMASHIOYA ,  Tomohiko TANIGUCHI

IPC分类号： H05K7/00 ,  H05K3/30

CPC分类号： H05K1/183 ,  H01L23/552 ,  H01L24/49 ,  H01L24/97 ,  H01L25/105 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/49109 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/09845 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10689 ,  Y10T29/49133 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component module comprises a circuit board having a cavity in one principal surface thereof. The electronic component module also comprises a first semiconductor device accommodated within the cavity and a second semiconductor device disposed on the one principal surface of the circuit board so as to cover the first semiconductor device in plan view. The electronic component module further comprises a resin material disposed to cover at least a side surface of the second semiconductor device.

摘要翻译： 电子部件模块包括其一个主表面中具有空腔的电路板。 电子部件模块还包括容纳在腔内的第一半导体器件和设置在电路板的一个主表面上的第二半导体器件，以便在平面图中覆盖第一半导体器件。 电子部件模块还包括设置成覆盖第二半导体器件的至少侧面的树脂材料。