公开(公告)号：US07701728B2

公开(公告)日：2010-04-20

申请号：US11574566

申请日：2005-10-28

申请人： Hidefumi Hatanaka ,  Tomohiko Taniguchi

发明人： Hidefumi Hatanaka ,  Tomohiko Taniguchi

IPC分类号： H05K7/14

CPC分类号： H05K9/002 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/284 ,  H05K9/006 ,  H05K2201/10674 ,  H01L2224/81 ,  H01L2224/0401

摘要： An IC element 2 having an oscillation circuit and an amplification circuit is mounted on a wiring board 1, the IC element 2 is covered with a sealing resin layer 4 having a window 4a on an upper surface of the IC element 2, and a shielding layer 5 is made to adhere to the sealing resin layer 4 and the window 4a from above. In a simple configuration, the entrance of electromagnetic waves into the IC element 2 is reduced, which allows a transmission signal from the IC element 2 to be stabilized.

摘要翻译： 具有振荡电路和放大电路的IC元件2安装在布线板1上，IC元件2由IC元件2的上表面上具有窗口4a的密封树脂层4覆盖，屏蔽层 5从上方粘附到密封树脂层4和窗口4a。 在简单的结构中，电磁波入IC元件2的入口减少，这允许来自IC元件2的透射信号稳定。

公开(公告)号：US20080019112A1

公开(公告)日：2008-01-24

申请号：US11574566

申请日：2005-10-28

申请人： Hidefumi Hatanaka ,  Tomohiko Taniguchi

发明人： Hidefumi Hatanaka ,  Tomohiko Taniguchi

IPC分类号： H04B15/00 ,  H05K9/00

CPC分类号： H05K9/002 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/284 ,  H05K9/006 ,  H05K2201/10674 ,  H01L2224/81 ,  H01L2224/0401

摘要： An IC element 2 having an oscillation circuit and an amplification circuit is mounted on a wiring board 1, the IC element 2 is covered with a sealing resin layer 4 having a window 4a on an upper surface of the IC element 2, and a shielding layer 5 is made to adhere to the sealing resin layer 4 and the window 4a from above. In a simple configuration, the entrance of electromagnetic waves into the IC element 2 is reduced, which allows a transmission signal from the IC element 2 to be stabilized.

摘要翻译： 具有振荡电路和放大电路的IC元件2安装在布线板1上，IC元件2被IC元件2的上表面上具有窗口4a的密封树脂层4覆盖，屏蔽 层5从上方附着到密封树脂层4和窗口4a上。 在简单的结构中，电磁波入IC元件2的入口减少，这允许来自IC元件2的透射信号稳定。

公开(公告)号：US20050040905A1

公开(公告)日：2005-02-24

申请号：US10857442

申请日：2004-05-28

申请人： Hidefumi Hatanaka ,  Ryoma Sasagawa

发明人： Hidefumi Hatanaka ,  Ryoma Sasagawa

IPC分类号： H03L1/04 ,  H03L1/00

CPC分类号： H03L1/04

摘要： An inventive temperature-compensated crystal oscillator has a construction such that a crystal oscillator element (5) is accommodated in a container (1) and an IC element (7) for controlling an oscillation output on the basis of the oscillation of the crystal oscillator element (5) is mounted on a lower surface of the container (1). A plurality of electrode pads (10) at least including plural crystal electrode pads connected to the crystal oscillator element (5), plural writing control electrode pads, and an oscillation output electrode pad, a ground electrode pad, a power source voltage electrode pad and an oscillation control electrode pad connected to surface mounting external terminals are arranged in a matrix configuration of m rows×n columns (wherein m and n are natural numbers not smaller than 2) in an IC element mounting area. The IC element (7) is electrically connected to the electrode pads (10). The temperature-compensated crystal oscillator is excellent in IC element bonding reliability, and meets the need for the size reduction of the entire structure.

摘要翻译： 本发明的温度补偿晶体振荡器具有将晶体振子元件（5）容纳在容器（1）中的结构和用于基于晶体振荡元件的振荡来控制振荡输出的IC元件（7） （5）安装在容器（1）的下表面上。 多个电极焊盘（10）至少包括连接到晶体振子元件（5）的多个晶体电极焊盘，多个写控制电极焊盘和振荡输出电极焊盘，接地电极焊盘，电源电压电极焊盘和 连接到表面安装外部端子的振荡控制电极焊盘以在IC元件安装区域中的m行x列（其中m和n是不小于2的自然数）的矩阵配置布置。 IC元件（7）电连接到电极焊盘（10）。 温度补偿晶体振荡器具有优异的IC元件接合可靠性，并且满足整个结构的尺寸减小的需要。

公开(公告)号：US20130250527A1

公开(公告)日：2013-09-26

申请号：US13820080

申请日：2011-10-25

申请人： Hidefumi Hatanaka ,  Katsura Hayashi

发明人： Hidefumi Hatanaka ,  Katsura Hayashi

IPC分类号： H01L23/29 ,  H05K1/18

CPC分类号： H01L23/29 ,  H01L23/295 ,  H01L23/3135 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2924/01019 ,  H01L2924/09701 ,  H03H9/1007 ,  H03H9/1078 ,  H03H9/1085 ,  H05K1/181 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05666

摘要： An electronic device is provided wherein the characteristics thereof are prevented from deteriorating. The electronic device (1) is provided with: a chip component (2) having an electronic element (22); a wiring board (3) on which the chip component (2) is mounted with a space therebetween, the space for containing the electronic element (22); a resin layer (4) provided from the surface of the chip component (2) to the surface of the wiring board (3) so as to surround the space; and an inorganic insulating layer (5), which is provided at the resin layer (4) and is positioned at the side of the space. Since entry of water vapor into the space can be reduced not only by means of the resin layer (4) but also by means of the inorganic insulating layer (5), the electronic device (1) having high airtight sealing performance can be provided.

摘要翻译： 提供了一种防止其特性劣化的电子设备。 电子装置（1）具有：具有电子元件（22）的芯片部件（2）; 芯片组件（2）在其上安装有空间的布线板（3），用于容纳电子元件（22）的空间; 从所述芯片部件（2）的表面向所述布线基板（3）的表面设置以围绕所述空间的树脂层（4） 和无机绝缘层（5），其设置在所述树脂层（4）处并位于所述空间侧。 由于不仅可以通过树脂层（4）还可以通过无机绝缘层（5）将水蒸汽进入空间，所以可以提供具有高密封性能的电子设备（1）。

公开(公告)号：US07739906B2

公开(公告)日：2010-06-22

申请号：US12392896

申请日：2009-02-25

申请人： Hidefumi Hatanaka ,  Kaoru Matsuo

发明人： Hidefumi Hatanaka ,  Kaoru Matsuo

IPC分类号： E01C23/00

CPC分类号： G01D11/245 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/1461 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： A sensor module includes a substrate having a cavity in a surface thereof; a first sensor inside the cavity; a second sensor inside the cavity; and a lid body sealing the cavity and including an internal surface. The second sensor includes a first electrode located on an internal surface of the lid body and a second electrode located in the cavity.

摘要翻译： 传感器模块包括其表面具有空腔的基板; 腔内的第一传感器; 腔内的第二传感器; 以及密封腔并包括内表面的盖体。 第二传感器包括位于盖体的内表面上的第一电极和位于空腔中的第二电极。

公开(公告)号：US20090091904A1

公开(公告)日：2009-04-09

申请号：US12293110

申请日：2007-03-29

申请人： Hidefumi Hatanaka ,  Kaoru Matsuo

发明人： Hidefumi Hatanaka ,  Kaoru Matsuo

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H01L25/165 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L25/03 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/1021 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/09972 ,  H05K2201/10492 ,  Y10T29/49137 ,  H01L2224/81 ,  H01L2924/00012

摘要： An electronic component 3 with a shielding function whose upper surface is held at a reference potential, an electronic component 13, and a semiconductor component 4 are mounted on a wiring board 2, and are covered with an insulating resin portion 5 while a conductive layer 6 is formed on an upper surface of the insulating resin portion 5. The conductive layer 6 is held at the reference potential by being connected to a portion, which is held at the reference potential, of the electronic component 3 with a shielding function exposed from the insulating resin portion 5. There can be provided a small-sized circuit module superior in an electromagnetic shielding function.

摘要翻译： 具有上表面保持在基准电位的屏蔽功能的电子部件3，电子部件13和半导体部件4安装在布线基板2上，并且被绝缘树脂部分5覆盖，同时导电层6 形成在绝缘树脂部分5的上表面上。导电层6通过连接到电子部件3的保持在参考电位的部分而被保持在参考电位，屏蔽功能暴露于 绝缘树脂部分5.可以提供一种电磁屏蔽功能优异的小型电路模块。

公开(公告)号：US09165849B2

公开(公告)日：2015-10-20

申请号：US13820080

申请日：2011-10-25

申请人： Hidefumi Hatanaka ,  Katsura Hayashi

发明人： Hidefumi Hatanaka ,  Katsura Hayashi

IPC分类号： H05K1/18 ,  H01L23/29 ,  H01L23/31 ,  H03H9/10

CPC分类号： H01L23/29 ,  H01L23/295 ,  H01L23/3135 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2924/01019 ,  H01L2924/09701 ,  H03H9/1007 ,  H03H9/1078 ,  H03H9/1085 ,  H05K1/181 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05666

摘要： An electronic device is provided wherein the characteristics thereof are prevented from deteriorating. The electronic device (1) is provided with: a chip component (2) having an electronic element (22); a wiring board (3) on which the chip component (2) is mounted with a space therebetween, the space for containing the electronic element (22); a resin layer (4) provided from the surface of the chip component (2) to the surface of the wiring board (3) so as to surround the space; and an inorganic insulating layer (5), which is provided at the resin layer (4) and is positioned at the side of the space. Since entry of water vapor into the space can be reduced not only by means of the resin layer (4) but also by means of the inorganic insulating layer (5), the electronic device (1) having high airtight sealing performance can be provided.

摘要翻译： 提供了一种防止其特性劣化的电子设备。 电子装置（1）具有：具有电子元件（22）的芯片部件（2）; 芯片组件（2）在其上安装有空间的布线板（3），用于容纳电子元件（22）的空间; 从所述芯片部件（2）的表面向所述布线基板（3）的表面设置以围绕所述空间的树脂层（4） 和无机绝缘层（5），其设置在所述树脂层（4）处并位于所述空间侧。 由于不仅可以通过树脂层（4）还可以通过无机绝缘层（5）将水蒸汽进入空间，所以可以提供具有高密封性能的电子设备（1）。

公开(公告)号：US20090211352A1

公开(公告)日：2009-08-27

申请号：US12392896

申请日：2009-02-25

申请人： Hidefumi Hatanaka ,  Kaoru Matsuo

发明人： Hidefumi Hatanaka ,  Kaoru Matsuo

IPC分类号： G01M17/02

CPC分类号： G01D11/245 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/1461 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00

摘要： A sensor module includes a substrate having a cavity in a surface thereof; a first sensor inside the cavity; a second sensor inside the cavity; and a lid body sealing the cavity and including an internal surface. The second sensor includes a first electrode located on an internal surface of the lid body and a second electrode located in the cavity.

摘要翻译： 传感器模块包括其表面具有空腔的基板; 腔内的第一传感器; 腔内的第二传感器; 以及密封腔并包括内表面的盖体。 第二传感器包括位于盖体的内表面上的第一电极和位于空腔中的第二电极。

公开(公告)号：US07266869B2

公开(公告)日：2007-09-11

申请号：US10900977

申请日：2004-07-27

申请人： Hidefumi Hatanaka ,  Ryoma Sasagawa

发明人： Hidefumi Hatanaka ,  Ryoma Sasagawa

IPC分类号： H04R17/00 ,  H01L41/04

CPC分类号： H03H9/1021 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16195 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/0552 ,  H05K1/181 ,  H05K1/183 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method for manufacturing a piezoelectric oscillator. The method having the step of preparing a master substrate partitioned into plural substrate regions. Mounting on each of the substrate regions a piezoelectric vibrator and an IC for controlling an oscillation output of the piezoelectric vibrator. The master substrate is then divided into individual substrate regions by cutting the master substrate on the outside circumferences of the individual substrate regions, thereby obtaining a plurality of piezoelectric oscillators.

摘要翻译： 一种压电振荡器的制造方法。 该方法具有准备分割成多个基板区域的母基板的步骤。 在每个基板区域上安装用于控制压电振动器的振荡输出的压电振动器和IC。 然后，通过在各个基板区域的外周上切割母基板，将主基板分割为单独的基板区域，从而获得多个压电振荡器。

公开(公告)号：US20050055814A1

公开(公告)日：2005-03-17

申请号：US10900977

申请日：2004-07-27

申请人： Hidefumi Hatanaka ,  Ryoma Sasagawa

发明人： Hidefumi Hatanaka ,  Ryoma Sasagawa

IPC分类号： H03H3/02 ,  H03H9/05 ,  H03H9/10 ,  H05K1/18 ,  H04R17/00 ,  H05K3/20

CPC分类号： H03H9/1021 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16195 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/0552 ,  H05K1/181 ,  H05K1/183 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599

摘要： A master substrate 15 is prepared which is partitioned into plural substrate regions A, formed with a window 16 in each of the substrate regions A, and provided with a throw-away region B between a respective pair of adjoining substrate regions A, the throw-away region including a write control terminal 12. A package 1 including a recess 11 is loaded from one side of the master substrate so as to be mounted on the substrate region A in a manner to close the window 16. A quartz-crystal oscillator device 5 is accommodated in the recess 11 of each package 1, while an aperture of the recess 11 is sealed with a closure 4. An IC 6 is inserted through the window 16 from the other side of the master substrate 15 so as to be mounted to a lower side of the package 1. Temperature compensation data for the quartz-crystal oscillator device 5 are written to a memory in the IC 6 via the write control terminal 12. The throw-away regions B are cut off from the individual substrate regions A by cutting the master substrate 15 on outside circumferences of the individual substrate regions A. The individual substrate regions A are separated from one another thereby obtaining plural piezoelectric oscillators at a time.

摘要翻译： 制备主衬底15，其分成在每个衬底区域A中形成有窗口16的多个衬底区域A，并且在相应的一对邻接衬底区域A之间设置有丢弃区域B， 包括写入控制端子12.包括凹部11的封装1从主基板的一侧装载，以便以关闭窗口16的方式安装在基板区域A.石英晶体振荡器装置 5被容纳在每个包装1的凹部11中，而凹部11的孔用封闭件4密封.IC 6从主基板15的另一侧穿过窗口16被安装到 封装1的下侧。用于石英晶体振荡器装置5的温度补偿数据经由写入控制端子12被写入到IC6中的存储器。从各个基板区域A切断了丢弃区域B 通过切割 主基板15在各个基板区域A的外周上。各个基板区域A彼此分离，从而一次获得多个压电振荡器。