摘要:
A wearable electronic device according to example embodiments includes a display panel configured to display an image, a main board including a processor configured to control an operation of the wearable electronic device, a metal frame defining a perimeter of the wearable electronic device, the metal frame including a metal material, the metal frame having first and second terminals, the first terminal being adjacent to the second terminal with a slit therebetween, a loop antenna between the display panel and the main board, the loop antenna configured to connect to the first and second terminals of the metal frame, and a near field communication (NFC) chip configured to connect to the metal frame and the loop antenna, the NFC chip configured to perform a near field communication by transmitting or receiving an NFC signal using the metal frame and the loop antenna.
摘要:
A wearable electronic device according to example embodiments includes a display panel configured to display an image, a main board including a processor configured to control an operation of the wearable electronic device, a metal frame defining a perimeter of the wearable electronic device, the metal frame including a metal material, the metal frame having first and second terminals, the first terminal being adjacent to the second terminal with a slit therebetween, a loop antenna between the display panel and the main board, the loop antenna configured to connect to the first and second terminals of the metal frame, and a near field communication (NFC) chip configured to connect to the metal frame and the loop antenna, the NFC chip configured to perform a near field communication by transmitting or receiving an NFC signal using the metal frame and the loop antenna.
摘要:
A housing of a mobile device including a frame defining a perimeter of the mobile device, the frame including a first metal material and configured to operate as a first antenna for a first wireless communication, and a cover configured to cover one surface of the mobile device, the cover including a second metal material, and the cover and at least a portion of the frame configured to operate as a second antenna for a second wireless communication may be provided.
摘要:
Disclosed is an arrowhead in which a plurality of expandable blades can be quickly and reliably retracted or expanded without using an additional means to bundle the expanding blades, thereby enhancing the penetrating capability or killing capability of an arrow. Particularly, a portion of a shaft forming the arrowhead is provided with a rack gear portion installed thereon and a lower end of each of the expanding blades is provided with a pinion gear portion, such that the rack gear portion and the pinion gear portion engage with each other and such a rack-pinion action controls the operation of retracting or expanding the expanding blades.
摘要:
A video recorder connected to a plurality of cameras and a plurality of client devices and a method of controlling the video recorder are provided. The method includes: setting a plurality of buffers, in a memory of the video recorder, corresponding to the plurality of cameras, respectively, and setting a plurality of positions in at least one buffer of the buffers for loading image data input from a corresponding camera of the plurality of cameras; loading, in the at least one buffer, the image data on given positions of the plurality of positions; and transmitting the loaded image data to the plurality of client devices so that each of the plurality of client devices receives the image data input from a same corresponding camera.
摘要:
Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.
摘要:
Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.
摘要:
A mobile apparatus includes a processing planner and a plan processor. The processing planner generates a plurality of resource use plans in response to a context monitoring query (CMQ) of an application, and selects a final plan satisfying a request of the CMQ among the resource use plans. The plan processor executes the final plan. Accordingly, the mobile apparatus may support resource-efficient context monitoring.
摘要:
A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.
摘要:
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.