公开(公告)号：US11441945B2

公开(公告)日：2022-09-13

申请号：US17290066

申请日：2019-11-13

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： James Eilertsen ,  Javier Miguel Sánchez

IPC: G01J3/28 ,  G01J3/02 ,  G01J3/36

Abstract: An example system includes a light source, a first spectrometer, a second spectrometer, and an electronic control module. The light source is operable to emit light within a first range of wavelengths in a field of illumination. The first spectrometer is operable to measure first sample light reflected from an object within a second range of wavelengths and in a first field of detection. The second spectrometer is operable to measure second sample light reflected from the object within a third range of wavelengths and in a second field of detection. The electronic control module operable to determine, based on the measured first sample light and the measured second sample light, a distance between the system and the object, and determine, based on the measured first sample light and the measured second sample light, a spectral distribution of light corresponding to the object.

公开(公告)号：US20210389179A1

公开(公告)日：2021-12-16

申请号：US17289299

申请日：2019-11-13

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： James Eilertsen ,  Javier Miguel Sánchez

IPC: G01J3/42 ,  G01J3/02

Abstract: An example system includes a first spectrometer, a second spectrometer, and an electronic control device communicatively coupled to the first spectrometer and the second spectrometer. The first spectrometer is operable to emit first light using a first light source towards a sample region between the first spectrometer and the second spectrometer. The first spectrometer is also operable to measure first reflected light reflected using a first photodetector from an object in the sample region. The second spectrometer is operable to measure first transmitted light transmitted through the object using a second photodetector. The electronic control device is operable to determine, based on at least one of the measured first reflected light or the measured first transmitted light, a spectral distribution of light corresponding to the object.

公开(公告)号：US10418410B2

公开(公告)日：2019-09-17

申请号：US15766103

申请日：2016-09-22

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Bernhard Buettgen ,  James Eilertsen

IPC: H01L31/101 ,  G01S17/10 ,  H01L27/146 ,  H01L27/148 ,  G01S7/491 ,  G01J3/02

Abstract: Optoelectronic modules operable to collect distance data and spectral data include demodulation pixels operable to collect spectral data and distance data via a time-of flight approach. The demodulation pixels include regions with varying charge-carrier mobilities. Multi-wavelength electromagnetic radiation incident on the demodulation pixels are separated into different portions wherein the respective portions are used to determine the composition of the incident multi-wavelength electromagnetic radiation. Accordingly, the optoelectronic module is used, for example, to collect colour images and 3D images, and/or ambient light levels and distance data. The demodulation pixels comprise contact nodes that generate potential regions that vary in magnitude with the lateral dimension of the semiconductor substrate. The potential regions conduct the photo-generated charges from the photo-sensitive detection region to a charge-collection region. The photo-generated charges are conducted to the charge-collection region with respective drift velocities that vary in magnitude with the thickness of the semiconductor substrate.

公开(公告)号：US11018269B2

公开(公告)日：2021-05-25

申请号：US16073418

申请日：2017-02-21

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L33/58 ,  H01L33/54 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L31/0203 ,  G01S7/481 ,  H01L25/16 ,  G01S17/02 ,  H01L23/00 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  G01S17/04

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US10718923B2

公开(公告)日：2020-07-21

申请号：US15805213

申请日：2017-11-07

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Martin Lukas Balimann ,  James Eilertsen

IPC: G02B7/02 ,  G02B19/00 ,  G02B26/00 ,  G02B1/02 ,  H01S5/183 ,  H01S5/022 ,  H01S5/024 ,  H01S5/42

Abstract: A thermally tunable optoelectronic module includes a light emitting assembly operable to emit light of a particular wavelength or range of wavelengths. The light emitting assembly is disposed to a temperature-dependent wavelength shift. The thermally tunable optoelectronic module further includes an optical assembly aligned to the light emitting assembly, and separated from the light emitting assembly by an alignment distance. The thermally tunable optoelectronic module further includes a thermally tunable spacer disposed between the optical assembly and the light-emitting assembly, the thermally tunable spacer is operable to counteract the temperature-dependent wavelength shift.

公开(公告)号：US11714004B2

公开(公告)日：2023-08-01

申请号：US17289299

申请日：2019-11-13

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： James Eilertsen ,  Javier Miguel Sánchez

IPC: G01J3/42 ,  G01J3/02

CPC classification number: G01J3/42 ,  G01J3/0272 ,  G01J2003/425

Abstract: An example system includes a first spectrometer, a second spectrometer, and an electronic control device communicatively coupled to the first spectrometer and the second spectrometer. The first spectrometer is operable to emit first light using a first light source towards a sample region between the first spectrometer and the second spectrometer. The first spectrometer is also operable to measure first reflected light reflected using a first photodetector from an object in the sample region. The second spectrometer is operable to measure first transmitted light transmitted through the object using a second photodetector. The electronic control device is operable to determine, based on at least one of the measured first reflected light or the measured first transmitted light, a spectral distribution of light corresponding to the object.

公开(公告)号：US10886420B2

公开(公告)日：2021-01-05

申请号：US16091352

申请日：2017-04-05

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/16 ,  H01L31/18 ,  H01L33/58 ,  H01L33/54 ,  H01L31/0216 ,  H01L21/76 ,  H01L27/14 ,  H01L33/56 ,  H01L33/00 ,  H01S5/022

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US20200149884A1

公开(公告)日：2020-05-14

申请号：US16622792

申请日：2018-06-14

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Laurent Nevou ,  Jens Geiger ,  James Eilertsen

IPC: G01C3/02 ,  G01S17/10 ,  G06F3/042 ,  H03K17/96

Abstract: An optoelectronic device has an asymmetric field overlap and is operable to measure proximity independently of object surface reflectivity. In some instances, the optoelectronic device includes a plurality of light-emitting assemblies and a light-sensitive assembly. In some instances, the optoelectronic devices include a plurality of light-sensitive assemblies and a light-emitting assembly. An asymmetric field overlap is attained in various implementations via various field-of-view axis, field-of-view angle, field-of-illumination axis, field-of-illumination angle, optical element and/or pitch configurations.

公开(公告)号：US10566467B2

公开(公告)日：2020-02-18

申请号：US15772581

申请日：2016-11-15

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Ghana Sambandam

IPC: H01L31/0203 ,  H01L31/0216 ,  H01L33/54 ,  H01L33/58 ,  H01L31/0232 ,  H01L31/18

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.

公开(公告)号：US20210396577A1

公开(公告)日：2021-12-23

申请号：US17290066

申请日：2019-11-13

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： James Eilertsen ,  Javier Miguel Sánchez

IPC: G01J3/02 ,  G01J3/28 ,  G01J3/36

Abstract: An example system includes a light source, a first spectrometer, a second spectrometer, and an electronic control module. The light source is operable to emit light within a first range of wavelengths in a field of illumination. The first spectrometer is operable to measure first sample light reflected from an object within a second range of wavelengths and in a first field of detection. The second spectrometer is operable to measure second sample light reflected from the object within a third range of wavelengths and in a second field of detection. The electronic control module operable to determine, based on the measured first sample light and the measured second sample light, a distance between the system and the object, and determine, based on the measured first sample light and the measured second sample light, a spectral distribution of light corresponding to the object.