公开(公告)号：US20170005056A1

公开(公告)日：2017-01-05

申请号：US15266752

申请日：2016-09-15

Applicant: Apple Inc.

Inventor： Anthony Fai ,  Evan R. Boyle ,  Zhiping Yang ,  Zhonghua Wu

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5283 ,  H01L23/5286 ,  H01L23/5384 ,  H01L23/552 ,  H01L23/60 ,  H01L24/06 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/065 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06151 ,  H01L2224/06177 ,  H01L2224/1405 ,  H01L2224/1414 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract translation: 为层叠半导体存储器封装提供了系统和方法。 每个封装可以包括集成电路（“IC”）封装基板，能够通过两个通道将数据传输到堆叠在封装内的存储器管芯。 每个通道可以位于IC封装衬底的一侧，并且来自每个通道的信号可以从它们各自的侧面被引导到存储器管芯。

公开(公告)号：US09853016B2

公开(公告)日：2017-12-26

申请号：US15435719

申请日：2017-02-17

Applicant: Apple Inc.

Inventor： Anthony Fai ,  Evan R. Boyle ,  Zhiping Yang ,  Zhonghua Wu

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5283 ,  H01L23/5286 ,  H01L23/5384 ,  H01L23/552 ,  H01L23/60 ,  H01L24/06 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/065 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06151 ,  H01L2224/06177 ,  H01L2224/1405 ,  H01L2224/1414 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

公开(公告)号：US09466571B2

公开(公告)日：2016-10-11

申请号：US14802750

申请日：2015-07-17

Applicant: Apple Inc.

Inventor： Anthony Fai ,  Evan R. Boyle ,  Zhiping Yang ,  Zhonghua Wu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L23/60 ,  H01L23/528 ,  H01L21/48 ,  H01L25/00 ,  H01L21/56 ,  H01L25/065 ,  H01L25/18 ,  H01L23/552

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5283 ,  H01L23/5286 ,  H01L23/5384 ,  H01L23/552 ,  H01L23/60 ,  H01L24/06 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/065 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06151 ,  H01L2224/06177 ,  H01L2224/1405 ,  H01L2224/1414 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

公开(公告)号：US20150325560A1

公开(公告)日：2015-11-12

申请号：US14802750

申请日：2015-07-17

Applicant: Apple Inc.

Inventor： Anthony Fai ,  Evan R. Boyle ,  Zhiping Yang ,  Zhonghua Wu

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/60 ,  H01L21/56 ,  H01L21/48 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/528

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5283 ,  H01L23/5286 ,  H01L23/5384 ,  H01L23/552 ,  H01L23/60 ,  H01L24/06 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/065 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06151 ,  H01L2224/06177 ,  H01L2224/1405 ,  H01L2224/1414 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract translation: 为层叠半导体存储器封装提供了系统和方法。 每个封装可以包括集成电路（“IC”）封装基板，能够通过两个通道将数据传输到堆叠在封装内的存储器管芯。 每个通道可以位于IC封装衬底的一侧，并且来自每个通道的信号可以从它们各自的侧面被引导到存储器管芯。

公开(公告)号：US20170162546A1

公开(公告)日：2017-06-08

申请号：US15435719

申请日：2017-02-17

Applicant: Apple Inc.

Inventor： Anthony Fai ,  Evan R. Boyle ,  Zhiping Yang ,  Zhonghua Wu

IPC: H01L25/065 ,  H01L23/498 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5283 ,  H01L23/5286 ,  H01L23/5384 ,  H01L23/552 ,  H01L23/60 ,  H01L24/06 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/065 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06151 ,  H01L2224/06177 ,  H01L2224/1405 ,  H01L2224/1414 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

公开(公告)号：US09583452B2

公开(公告)日：2017-02-28

申请号：US15266752

申请日：2016-09-15

Applicant: Apple Inc.

Inventor： Anthony Fai ,  Evan R. Boyle ,  Zhiping Yang ,  Zhonghua Wu

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5283 ,  H01L23/5286 ,  H01L23/5384 ,  H01L23/552 ,  H01L23/60 ,  H01L24/06 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/065 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06151 ,  H01L2224/06177 ,  H01L2224/1405 ,  H01L2224/1414 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract translation: 为层叠半导体存储器封装提供了系统和方法。 每个封装可以包括集成电路（“IC”）封装基板，能够通过两个通道将数据传输到堆叠在封装内的存储器管芯。 每个通道可以位于IC封装衬底的一侧，并且来自每个通道的信号可以从它们各自的侧面被引导到存储器管芯。

公开(公告)号：US09087846B2

公开(公告)日：2015-07-21

申请号：US13801722

申请日：2013-03-13

Applicant: Apple Inc.

Inventor： Anthony Fai ,  Evan R. Boyle ,  Zhiping Yang ,  Zhonghua Wu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/538 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5283 ,  H01L23/5286 ,  H01L23/5384 ,  H01L23/552 ,  H01L23/60 ,  H01L24/06 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/065 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06151 ,  H01L2224/06177 ,  H01L2224/1405 ,  H01L2224/1414 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract translation: 为层叠半导体存储器封装提供了系统和方法。 每个封装可以包括集成电路（“IC”）封装基板，能够通过两个通道将数据传输到堆叠在封装内的存储器管芯。 每个通道可以位于IC封装衬底的一侧，并且来自每个通道的信号可以从它们各自的侧面被引导到存储器管芯。

公开(公告)号：US20140264906A1

公开(公告)日：2014-09-18

申请号：US13801722

申请日：2013-03-13

Applicant: APPLE INC.

Inventor： Anthony Fai ,  Evan R. Boyle ,  Zhiping Yang ,  Zhonghua Wu

IPC: H01L23/538

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5283 ,  H01L23/5286 ,  H01L23/5384 ,  H01L23/552 ,  H01L23/60 ,  H01L24/06 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/065 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06151 ,  H01L2224/06177 ,  H01L2224/1405 ,  H01L2224/1414 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Abstract translation: 为层叠半导体存储器封装提供了系统和方法。 每个封装可以包括集成电路（“IC”）封装基板，能够通过两个通道将数据传输到堆叠在封装内的存储器管芯。 每个通道可以位于IC封装衬底的一侧，并且来自每个通道的信号可以从它们各自的侧面被引导到存储器管芯。

公开(公告)号：US20140264904A1

公开(公告)日：2014-09-18

申请号：US13801104

申请日：2013-03-13

Applicant: Apple Inc.

Inventor： Anthony Fai ,  Evan R. Boyle ,  Zhiping Yang ,  Zhonghua Wu

IPC: H01L23/498 ,  H01L21/50

CPC classification number: H01L23/49827 ,  H01L23/5384 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0268 ,  H05K1/181 ,  H05K3/282 ,  H05K2201/10159 ,  H05K2201/10545 ,  H05K2201/10553 ,  Y02P70/611 ,  H01L2924/00

Abstract: Memory systems and methods for creating the same are disclosed. The memory systems can include pairs of IC packages mounted on either side of a system substrate. Contacts formed on the IC packages can be communicatively coupled with contacts of a paired IC package using vias that extend through the system substrate. The IC packages can further communicate with a controller mounted on one side of the system substrate using the vias as well as conductive traces formed in the system substrate.

Abstract translation: 公开了用于创建其的存储器系统和方法。 存储器系统可以包括安装在系统基板两侧的IC封装对。 形成在IC封装上的触点可以通过使用延伸穿过系统基板的通孔与成对IC封装的触点通信耦合。 IC封装可以使用通孔以及形成在系统基板中的导电迹线进一步与安装在系统基板一侧的控制器进行通信。