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公开(公告)号：US20230052048A1
公开(公告)日：2023-02-16
申请号：US17946547
申请日：2022-09-16
Applicant: Applied Materials, Inc.
Inventor： Ashavani KUMAR , Ashwin CHOCKALINGAM , Sivapackia GANAPATHIAPPAN , Rajeev BAJAJ , Boyi FU , Daniel REDFIELD , Nag B. PATIBANDLA , Mario Dagio CORNEJO , Amritanshu SINHA , Yan ZHAO , Ranga Rao ARNEPALLI , Fred C. REDEKER
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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公开(公告)号：US20160107295A1
公开(公告)日：2016-04-21
申请号：US14885950
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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3.发明申请公开(公告)号：US20200147750A1
公开(公告)日：2020-05-14
申请号：US16746065
申请日：2020-01-17
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Kasiraman KRISHNAN , Mahendra C. ORILALL , Daniel REDFIELD , Fred C. REDEKER , Nag B. PATIBANDLA , Gregory E. MENK , Jason G. FUNG , Russell Edward PERRY , Robert E. DAVENPORT
Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
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4.发明申请公开(公告)号：US20180043613A1
公开(公告)日：2018-02-15
申请号：US15722810
申请日：2017-10-02
Applicant: Applied Materials, Inc.
Inventor： Kasiraman KRISHNAN , Daniel REDFIELD , Russell Edward PERRY , Gregory E. MENK , Rajeev BAJAJ , Fred C. REDEKER , Nag B. PATIBANDLA , Mahendra C. ORILALL , Jason G. FUNG
IPC: B24B37/26 , B24B37/22 , B29L31/00 , B29K105/16
Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.
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公开(公告)号：US20180207770A1
公开(公告)日：2018-07-26
申请号：US15875867
申请日：2018-01-19
Applicant: Applied Materials, Inc.
Inventor： Robert D. TOLLES , Gregory E. MENK , Eric DAVEY , You WANG , Huyen Karen TRAN , Fred C. REDEKER , Veera Raghava Reddy KAKIREDDY , Ekaterina MIKHAYLICHENKO , Jay GURUSAMY
Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.
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Patent Agency Ranking
公开(公告)号：US20180009079A1
公开(公告)日：2018-01-11
申请号：US15546068
申请日：2016-01-29
Applicant: Applied Materials, Inc.
Inventor： Robert D. TOLLES , Mahendra C. ORILALL , Fred C. REDEKER , Rajeev BAJAJ
Abstract: The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.
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公开(公告)号：US20160101500A1
公开(公告)日：2016-04-14
申请号：US14695778
申请日：2015-04-24
Applicant: Applied Materials, Inc.
Inventor： Jason Garcheung FUNG , Rajeev BAJAJ , Kasiraman KRISHNAN , Mahendra C. ORILALL , Fred C. REDEKER , Russell Edward PERRY , Gregory E. MENK , Daniel REDFIELD
IPC: B24B37/26 , B24B55/02 , B24B37/015
CPC classification number: B24B37/26 , B24B37/015 , B24B55/02
Abstract: A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.
Abstract translation: 提供了用于化学机械抛光的抛光垫。 抛光垫包括具有支撑表面的基底区域。 抛光垫还包括形成抛光表面的多个抛光特征，抛光表面与支撑表面相对。 抛光垫还包括形成在抛光垫的内部区域中并且至少部分地围绕抛光垫的中心延伸的一个或多个通道，其中每个通道流体地联接到至少一个端口。
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公开(公告)号：US20140251952A1
公开(公告)日：2014-09-11
申请号：US13791148
申请日：2013-03-08
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Terrance Y. LEE , Fred C. REDEKER
IPC: B24D11/00
CPC classification number: B24B37/245
Abstract: In one embodiment, a polishing pad includes a hydrophilic polymer base having a polishing surface, and a metal oxide coating. The metal oxide coating has nanoparticles of metal oxide disposed on the polishing surface. In another embodiment, a processing station includes a rotatable platen, a polishing head, and a precursor delivery system. The polishing head is configured to retain a substrate against the polishing pad. The precursor delivery system is configured to form an oxide coating on a surface of a polishing pad disposed on the platen. In yet another embodiment, a method for modifying a surface of a polishing pad includes wetting the surface of the polishing pad and delivering a precursor to the wetted surface of the polishing pad surface. The method also includes forming a metal oxide coating having nanoparticles of metal oxide on the surface from the precursor.
Abstract translation: 在一个实施例中，抛光垫包括具有抛光表面的亲水聚合物基底和金属氧化物涂层。 金属氧化物涂层具有设置在抛光表面上的金属氧化物纳米颗粒。 在另一个实施例中，处理站包括可转动的压板，抛光头和前体输送系统。 抛光头被配置为将衬底保持在抛光垫上。 前体递送系统被配置为在设置在压板上的抛光垫的表面上形成氧化物涂层。 在另一个实施例中，用于修改抛光垫表面的方法包括润湿抛光垫的表面并将前体输送到抛光垫表面的润湿表面。 该方法还包括在前体表面上形成具有金属氧化物纳米颗粒的金属氧化物涂层。
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9.发明申请公开(公告)号：US20200001433A1
公开(公告)日：2020-01-02
申请号：US16541641
申请日：2019-08-15
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Ashwin CHOCKALINGAM , Ashavani KUMAR , Fred C. REDEKER , Nag B. PATIBANDLA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US20190224809A1
公开(公告)日：2019-07-25
申请号：US16373121
申请日：2019-04-02
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Nag B. PATIBANDLA , Rajeev BAJAJ , Daniel REDFIELD , Fred C. REDEKER , Mahendra C. ORILALL , Boyi FU , Mayu YAMAMURA , Ashwin CHOCKALINGAM
Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
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