Lid Carveouts for Processor Connection and Alignment

    公开(公告)号:US20230315171A1

    公开(公告)日:2023-10-05

    申请号:US17704912

    申请日:2022-03-25

    CPC classification number: G06F1/206 H05K5/0213 H05K5/0239 H05K7/20209

    Abstract: Package lids with carveouts configured for processor connection and alignment are described. Lid carveouts are configured to align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device. Because the lid carveouts ensure precise alignment and orientation of a cooling device relative to a package lid, the lid design enables targeted cooling of discrete portions of the lid. Lid carveouts are further configured to expose one or more connectors disposed on a surface that supports package internal components. When contacted by corresponding connectors of a cooling device, the lid carveouts enable direct connections between the package and the attached cooling device. By creating a direct connection between package components and an attached cooling device, the lid carveouts enable a high-speed connection for proactive and on-demand cooling actuation.

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