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1.发明授权
公开(公告)号：US5786055A
公开(公告)日：1998-07-28
申请号：US382157
申请日：1995-02-01
申请人： Akinori Sei , Yoshikazu Tsukamoto , Takashi Shiozawa , Shouji Aoki , Tadahiro Oishi , Hitoshi Narushima
发明人： Akinori Sei , Yoshikazu Tsukamoto , Takashi Shiozawa , Shouji Aoki , Tadahiro Oishi , Hitoshi Narushima
IPC分类号： C08G69/48 , C09J177/00 , H01L21/58 , A21H19/00 , C09J7/02
CPC分类号： H01L24/83 , C08G69/48 , C09J177/00 , H01L24/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , Y10T428/149 , Y10T428/2804 , Y10T428/2826 , Y10T428/2848 , Y10T428/31725
摘要： An adhesive for semiconductor device, comprising (a) a polyamide resin having an amine value of 20 to 60 and a weight average molecular weight of 1,000 to 5,000 and (b) a phenolic compound having a weight average molecular weight of 2,000 or less and having a skeleton containing at least 2 methylol groups.
摘要翻译： 一种半导体器件用粘合剂，其包含（a）胺值为20〜60，重均分子量为1,000〜5,000的聚酰胺树脂，（b）重均分子量为2,000以下的酚类化合物，具有 含有至少2个羟甲基的骨架。
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公开(公告)号：US5290614A
公开(公告)日：1994-03-01
申请号：US761939
申请日：1991-09-20
CPC分类号： H01L23/145 , H01L2924/0002 , Y10T428/14 , Y10T428/1471 , Y10T428/2826 , Y10T428/2852 , Y10T428/287 , Y10T428/2874 , Y10T428/2887 , Y10T428/2896
摘要： This invention relates to an adhesive tape for tape automated bonding (TAB). A first type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by comprising at least resol-type phenol resin and polyamide resin, wherein from 2 to 35% of said resol-type resin is contained in the adhesive layer. A second type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by having at least two layers: one comprising at least polyamide resin and being laminated on one surface of said organic-insulating film and; other comprising at least polyamide resin and resol-type resin and being laminated on other surface of said protective film.
摘要翻译： PCT No.PCT / JP91 / 00066 Sec。 371日期1991年9月20日 102（e）1991年9月20日PCT 1991年1月23日PCT PCT。 公开号WO91 / 11821 日本1991年8月8日。本发明涉及一种胶带自动接合用粘合带（TAB）。 根据本发明的用于TAB的粘合带的第一类型具有层压在有机绝缘膜上的保护膜和粘合剂层。 该粘合剂层的特征在于至少包含甲阶酚醛树脂型酚醛树脂和聚酰胺树脂，其中在粘合剂层中含有2〜35％的甲阶酚醛树脂型树脂。 根据本发明的第二种用于TAB的粘合带具有层压在有机绝缘膜上的保护膜和粘合剂层。 该粘合剂层的特征在于具有至少两个层：一个至少包含聚酰胺树脂并层压在所述有机绝缘膜的一个表面上; 其它至少包含聚酰胺树脂和甲阶酚醛树脂，并且层压在所述保护膜的其他表面上。
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公开(公告)号：US5298304A
公开(公告)日：1994-03-29
申请号：US980230
申请日：1992-11-23
CPC分类号： H01L23/145 , H01L2924/0002 , Y10T428/14 , Y10T428/1471 , Y10T428/2826 , Y10T428/2852 , Y10T428/287 , Y10T428/2874 , Y10T428/2887 , Y10T428/2896
摘要： This invention relates to an adhesive tape for tape automated bonding (TAB). A first type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by comprising at least resol-type phenol resin and polyamide resin, wherein from 2 to 35% of said resol-type resin is contained in the adhesive layer. A second type of the adhesive tape for TAB according to the invention has a protective film and an adhesive layer laminated on an organic-insulating film. This adhesive layer is characterized by having at least two layers: one comprising at least polyamide resin and being laminated on one surface of said organic-insulating film and; other comprising at least polyamide resin and resol-type resin and being laminated on other surface of said protective film.
摘要翻译： 本发明涉及一种胶带自动接合用粘合带（TAB）。 根据本发明的用于TAB的粘合带的第一类型具有层压在有机绝缘膜上的保护膜和粘合剂层。 该粘合剂层的特征在于至少包含甲阶酚醛树脂型酚醛树脂和聚酰胺树脂，其中在粘合剂层中含有2〜35％的甲阶酚醛树脂型树脂。 根据本发明的第二种用于TAB的粘合带具有层压在有机绝缘膜上的保护膜和粘合剂层。 该粘合剂层的特征在于具有至少两个层：一个至少包含聚酰胺树脂并层压在所述有机绝缘膜的一个表面上; 其它至少包含聚酰胺树脂和甲阶酚醛树脂，并且层压在所述保护膜的其他表面上。
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4.发明授权
公开(公告)号：US5707730A
公开(公告)日：1998-01-13
申请号：US593891
申请日：1996-01-30
申请人： Tadahiro Oishi , Akira Tezuka
发明人： Tadahiro Oishi , Akira Tezuka
IPC分类号： H01L23/29 , H01L23/31 , H01L23/495 , B32B7/12 , B32B15/04
CPC分类号： H01L24/50 , H01L23/293 , H01L23/3157 , H01L23/49572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , Y10T428/2804 , Y10T428/2826 , Y10T428/2848 , Y10T428/287 , Y10T428/2896
摘要： An adhesive for bonding a reinforcing sheet to a lead-formed surface of a tape carrier package used for forming a semiconductor device, the adhesive being a resin composition which constitutes an interlayer between the lead-formed surface and the reinforcing sheet, comprises a polyamide resin having an amine value of 3.0 to 50 and an epoxy resin, is free from peeling and foaming, undergoes sufficient softening and curing at a temperature lower than about 150.degree. C., has high insulation reliability after cured, and has heat resistance against a temperature up to 260.degree. C.
摘要翻译： 一种用于将增强片接合到用于形成半导体器件的带载体封装的引线形成表面的粘合剂，作为构成引线形成表面和加强片之间的中间层的树脂组合物的粘合剂包括聚酰胺树脂 胺值为3.0〜50的环氧树脂和环氧树脂无剥离发泡，在低于约150℃的温度下进行充分的软化和固化，固化后的绝缘可靠性高，耐温度高 高达260℃
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公开(公告)号：US5701002A
公开(公告)日：1997-12-23
申请号：US599342
申请日：1996-02-08
申请人： Tadahiro Oishi , Toshifumi Onishi , Yasuo Yoshioka
发明人： Tadahiro Oishi , Toshifumi Onishi , Yasuo Yoshioka
CPC分类号： G06K19/02
摘要： An identification card comprises a card body formed from substantially unoriented heated crystallized polyethylene terephthalate resin, and is equipped to generate a recognizable identification signal. A concave portion may be formed on one side of the card body to accommodate, for example, magnetic memory media, to generate the identification signal.
摘要翻译： 识别卡包括由基本上未取向的加热的结晶聚对苯二甲酸乙二醇酯树脂形成的卡体，并且被配备为产生可识别的识别信号。 可以在卡体的一侧形成凹部，以容纳例如磁存储介质，以产生识别信号。
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