摘要:
The disclosure is concerned with a maleimide-diamine resin composition which is well soluble to a low boiling point solvent and is excellent in heat resistance. The composition is featured by containing a maleimide-diamine adduct having the general formula: ##STR1## wherein A is a mono-, di-, tri- or tetravalent organic group containing at least two carbon atoms, R.sub.1 through R.sub.6 are hydrogen atom, a lower alkyl group, a lower alkoxy group, chlorine atom, bromine atom, trifluoromethyl group, or trichloromethyl group, and m is an integer of 0-4.
摘要:
A bisimide-ether compound having the general formula is obtained by reacting an ethylenically unsaturated dicarboxylic acid anhydride, a diamine compound and a phenolic compound having in the molecule at least two hydroxyl groups, or by reacting a prepolymer of the anhydride and diamine compound with the phenolic compound: ##STR1## wherein R.sub.1 is a group containing at least two carbon atoms, R.sub.2 is a group containing at least two carbon atoms, R'.sub.2 is a group containing at least two carbon atoms and a carbon-carbon double bond, R.sub.3 is an aromatic group, the nitrogen atoms of the imide rings being directly connected to different carbon atoms of the group R.sub.1, the carbonyl groups of the imide rings being directly connected to different carbon atoms of the group R.sub.2 or R'.sub.2, the oxygen atoms between the groups R.sub.2 and R.sub.3 being directly connected to an aromatic nucleus of the group R.sub.3, and n is an integer of zero, one or more than 1.
摘要:
A thermosetting resin composition comprising (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds, and a prepolymer thereof obtained by subjecting the composition to a preliminary reaction with heating to the B stage can give a cured product having excellent heat resistance of class C and flexibility.
摘要:
A thermosetting resin composition comprises (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds. A thermosetting prepolymer can be obtained by subjecting the composition to a preliminary reaction with heating to the B stage and this prepolymer can give a cured product having excellent heat resistance of class C and flexibility. An exemplary composition containing 60 parts by wt. of 4,4'-dicyanomidodiphenylmethane and 40 parts by wt. of N,N'-4,4'-diphenylmethane bismaleimide dissolved in methyl Cellosolve is reacted at 70.degree. to 110.degree. C. for about 40 minutes to obtain a prepolymer soluble in methyl ethyl ketone. This prepolymer when admixed with 2-ethyl-4-methyl-imidazole and after removal of the methyl cellusolve will form an insoluble and infusible cured product upon heating at temperatures on the order of 170.degree. to 200.degree. C. for about 80 minutes. The resin composition when admixed with a solvent, is useful for impregnation and when used as a powder, it is useful as a molding resin.
摘要:
A process for producing a fire retardant and heat resistant copper-clad laminated board, characterized in that a maleimide resin type varnish containing a small amount of a specific halogenated diphenyl ether compound is used for impregnation of base material therewith. Copper-clad laminated boards produced according to the present invention may be so improved in fire or flame retardant properties as to be classed 94 V-0 in accordance with UL 94 (vertical burning test), and, nevertheless, are not substantially downgraded in heat resisting properties as well as copper foil peel strength.
摘要:
A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg.sub.1, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg.sub.1 and that of Tg.sub.2 of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg.sub.1 and Tg.sub.2, has excellent dimensional stability, heat resistance and through-hole reliability.
摘要:
A polymer which has excellent heat resistance and mechanical properties which is useful as a molding material, contains the structural units having the following formulae [I] and [II]: ##STR1## wherein A and B each represents an at least divalent organic group having at least one aromatic ring such as a diphenyl ring; and m and n each represents a number of at least 1. The polymer is used in the form of a solution or varnish as an impregnating, laminating, bonding or film-forming coating or prepreg-forming varnish. A resin composition for forming the polymer contains an aromatic cyanamide compound and an aromatic amine which are reacted to form a prepolymer which, upon heating, is converted into a cured polymer having the structural units of formulae [I] and [II].
摘要:
A process for preparing a thermosetting maleimide type prepolymer which comprises reacting (A) a polyfunctional maleimide compound, (B) a bis-maleimide, (C) a diamine and (D) an epoxy compound. The maleimide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.
摘要:
A process for preparing a thermosetting imide type prepolymer which comprises heating a bis-imide (A) and a diamine (B) in the presence of an organic solvent with a boiling point of 70.degree. to 170.degree. C. and heating the reaction mixture together with an epoxy compound (C). The imide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.
摘要:
A process for preparing a thermosetting maleimide type prepolymer which comprises heating (A) a polyfunctional maleimide compound derived from a polyamine prepared from aniline and formalin, (B) a bis-maleimide and (C) a diamine. The thermosetting maleimide type prepolymer prepared according to the process of the present invention is excellent in solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having excellent heat resisting properties.