公开(公告)号：US20090184408A1

公开(公告)日：2009-07-23

申请号：US12382532

申请日：2009-03-18

申请人： Akira Okada ,  Mitsuru Sato

发明人： Akira Okada ,  Mitsuru Sato

IPC分类号： H01L23/00 ,  H01L23/48

CPC分类号： G06K9/0002 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.

摘要翻译： 公开了对静电容量原理执行指纹识别的半导体器件。 跨越半导体芯片的指纹识别区域的手指提供了正确的指纹识别操作，并提高了可靠性。 半导体器件包括具有执行指纹识别的传感器单元的半导体芯片和具有形成在与传感器单元对应的位置的开口的基板。 将半导体芯片倒装贴合到基板上，使得传感器单元对应于开口，除了开口的形成位置之外，在半导体芯片和基板之间设置有未填充材料。

公开(公告)号：US07989938B2

公开(公告)日：2011-08-02

申请号：US12382532

申请日：2009-03-18

申请人： Akira Okada ,  Mitsuru Sato

发明人： Akira Okada ,  Mitsuru Sato

IPC分类号： H01L238/48

CPC分类号： G06K9/0002 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.

摘要翻译： 公开了对静电容量原理执行指纹识别的半导体器件。 跨越半导体芯片的指纹识别区域的手指提供了正确的指纹识别操作，并提高了可靠性。 半导体器件包括具有执行指纹识别的传感器单元的半导体芯片和具有形成在与传感器单元对应的位置的开口的基板。 将半导体芯片倒装贴合到基板上，使得传感器单元对应于开口，除了开口的形成位置之外，在半导体芯片和基板之间设置有未填充材料。

公开(公告)号：US07015579B2

公开(公告)日：2006-03-21

申请号：US10765999

申请日：2004-01-29

申请人： Akira Okada ,  Mitsuru Sato

发明人： Akira Okada ,  Mitsuru Sato

IPC分类号： H01L23/48

CPC分类号： G06K9/0002 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.

公开(公告)号：US07315070B2

公开(公告)日：2008-01-01

申请号：US10960990

申请日：2004-10-12

申请人： Akira Okada ,  Mitsuru Sato ,  Hideo Sato

发明人： Akira Okada ,  Mitsuru Sato ,  Hideo Sato

IPC分类号： H01L29/84 ,  G06K9/00

CPC分类号： H01L27/14678 ,  G06K9/00053 ,  H01L24/32 ,  H01L27/14618 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： A fingerprint sensor package includes an LSI chip for reading a fingerprint, a substrate having an external connection terminal and to which the LSI chip is fixed, and a chip fixing mechanism for fixing the LSI chip in a state where the LSI chip is deformed so as to form a curved surface, provided between the LSI chip and the substrate.

摘要翻译： 指纹传感器封装包括用于读取指纹的LSI芯片，具有外部连接端子并且LSI芯片被固定的基板，以及用于在LSI芯片变形的状态下固定LSI芯片的芯片固定机构，以便 以形成设置在LSI芯片和基板之间的曲面。

公开(公告)号：US20050263836A1

公开(公告)日：2005-12-01

申请号：US10960990

申请日：2004-10-12

申请人： Akira Okada ,  Mitsuru Sato ,  Hideo Sato

发明人： Akira Okada ,  Mitsuru Sato ,  Hideo Sato

IPC分类号： G06T1/00 ,  G06K9/00 ,  H01L23/12 ,  H01L29/84 ,  H04N1/028

CPC分类号： H01L27/14678 ,  G06K9/00053 ,  H01L24/32 ,  H01L27/14618 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： A fingerprint sensor package includes an LSI chip for reading a fingerprint, a substrate having an external connection terminal and to which the LSI chip is fixed, and a chip fixing mechanism for fixing the LSI chip in a state where the LSI chip is deformed so as to form a curved surface, provided between the LSI chip and the substrate.

摘要翻译： 指纹传感器封装包括用于读取指纹的LSI芯片，具有外部连接端子并且LSI芯片被固定的基板，以及用于在LSI芯片变形的状态下固定LSI芯片的芯片固定机构，以便 以形成设置在LSI芯片和基板之间的曲面。

公开(公告)号：US09312160B2

公开(公告)日：2016-04-12

申请号：US13617354

申请日：2012-09-14

申请人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

发明人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

IPC分类号： B25B11/00 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67748 ,  H01L21/6838 ,  H01L21/68707 ,  Y10T29/49998

摘要： A method of attaching a wafer by suction, includes a step of mounting a wafer on a right arm and a left arm of a transfer jig, moving the transfer jig toward a wafer suction stage in such a manner that a facing right arm surface of the right arm slides along and in contact with a first side surface of the wafer suction stage and a facing left arm surface of the left arm slides along and in contact with a second side surface of the wafer suction stage until the wafer comes to lie directly above a mounting surface of the wafer suction stage, mounting the wafer on the mounting surface by moving the transfer jig downward toward the wafer suction stage while maintaining the contacts, and attaching the wafer to the mounting surface by suction.

摘要翻译： 通过抽吸附着晶片的方法包括将晶片安装在转移夹具的右臂和左臂上的步骤，将转移夹具朝向晶片吸入台移动，使得所述转子夹具的相对的右臂表面 右臂与晶片吸入台的第一侧表面滑动并与其接触，并且左臂的面向的左臂表面沿晶片吸入台的第二侧表面滑动并与其接触，直到晶片直接位于上方 晶片吸入台的安装面，通过在保持接触的同时将转移夹具向下移动到晶片吸入台，将晶片安装在安装面上，并通过抽吸将晶片安装在安装面上。

公开(公告)号：US08216608B2

公开(公告)日：2012-07-10

申请号：US12086691

申请日：2007-12-14

申请人： Akira Okada ,  Keiko Katsuki

发明人： Akira Okada ,  Keiko Katsuki

IPC分类号： A61K9/20 ,  A61K33/30 ,  A61K33/00

CPC分类号： A61K33/30 ,  A61K9/0053 ,  A61K9/143 ,  A61K33/06 ,  A61K33/08 ,  A61K33/10 ,  C01F7/004 ,  C01F7/005 ,  C01P2002/22 ,  Y10S514/819 ,  Y10S514/925 ,  Y10S514/926

摘要： A novel particulate composite hydrotalcite which offers antacidic effect comparable to that of a particulate hydrotalcite so far used as a gastric antacid and, further, offers excellent stomach inner wall protection effect. A particulate composite hydrotalcite represented by the following formula (1), (MgaZnb)1-xAlx(OH)2(An−)x/n.mH2O  (1) wherein An− is CO32−, SO42− or Cl−, n is 1 or 2, and x, a, b and m are values that satisfy the following conditions, 0.18≦x≦0.4, 0.5≦a

摘要翻译： 一种新型的复合水滑石颗粒，其提供与目前用作胃酸解的颗粒状水滑石相当的抗酸作用，并且还提供优异的胃内壁保护作用。 由下式（1），（MgaZnb）1-xAlx（OH）2（An-）x / n.mH2O（1）表示的颗粒状复合水滑石，其中An-为CO32-，SO42-或Cl-，n为 1或2，x，a，b和m是满足以下条件的值：0.18＆nlE; x＆nlE; 0.4,0.5＆amp; nlE; a <1,0 n; 0.5,0＆amp; nlE; m <1， 使用颗粒状复合水滑石作为有效成分。 当用作胃酸抗酸剂时，复合水滑石颗粒可抑制肠胃粘膜的损伤。