公开(公告)号：US06441317B1

公开(公告)日：2002-08-27

申请号：US09654085

申请日：2000-09-01

申请人： Akira Tanaka ,  Ryuichi Saito ,  Tadao Kushima ,  Yoshihiko Koike ,  Hideo Shimizu ,  Shigeharu Nonoyama

发明人： Akira Tanaka ,  Ryuichi Saito ,  Tadao Kushima ,  Yoshihiko Koike ,  Hideo Shimizu ,  Shigeharu Nonoyama

IPC分类号： H05K116

CPC分类号： H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01019 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/30107 ,  H01L2924/00

摘要： In a semiconductor module comprising, a semiconductor element, an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged, an electrically insulating cover covering the semiconductor element on the inner surface, and first and second electrically conductive members each of which is connected to the semiconductor element and extends to the exterior of the semiconductor module through the electrically insulating cover, a part of each of the first and second electrically conductive members on the exterior of the semiconductor module is arranged away from the outer surface to electrically isolate the part of the each of the first and second electrically conductive members from the electrically grounded surface.

摘要翻译： 在半导体模块中，包括半导体元件，具有要连接到电接地表面的外表面的电绝缘基底和布置有半导体元件的内表面，覆盖在内部的半导体元件的电绝缘盖 表面以及第一和第二导电构件，每个导电构件连接到半导体元件并且通过电绝缘盖延伸到半导体模块的外部，第一和第二导电构件中的每一个的外部的一部分 半导体模块远离外表面布置，以将第一和第二导电构件中的每一个的一部分与电接地表面电隔离。

公开(公告)号：US07141741B2

公开(公告)日：2006-11-28

申请号：US10665523

申请日：2003-09-22

申请人： Kazuji Yamada ,  Akira Tanaka ,  Ryuichi Saito ,  Yasutoshi Kurihara ,  Tadao Kushima ,  Takashi Haramaki ,  Yoshihiko Koike ,  Takashi Hosokawa ,  Mamoru Sawahata ,  Masahiro Koizumi ,  Jin Onuki ,  Kazuhiro Suzuki ,  Isao Kobayashi ,  Hideo Shimizu ,  Yutaka Higashimura ,  Shigeki Sekine ,  Nobuya Koike ,  Hideya Kokubun

发明人： Kazuji Yamada ,  Akira Tanaka ,  Ryuichi Saito ,  Yasutoshi Kurihara ,  Tadao Kushima ,  Takashi Haramaki ,  Yoshihiko Koike ,  Takashi Hosokawa ,  Mamoru Sawahata ,  Masahiro Koizumi ,  Jin Onuki ,  Kazuhiro Suzuki ,  Isao Kobayashi ,  Hideo Shimizu ,  Yutaka Higashimura ,  Shigeki Sekine ,  Nobuya Koike ,  Hideya Kokubun

IPC分类号： H05K1/03

CPC分类号： H01L23/49562 ,  H01L23/049 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H02M7/003 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor device in which electrodes of a plurality of semiconductor elements are bonded onto at least one of a plurality of electrode patterns on an insulator substrate, the other surface of the insulator substrate being bonded to a heat dissipating base. The upper surface of the heat dissipating base is covered with a member for cutting off the semiconductor elements from the outer environment. Terminals electrically connect the electrodes on said insulator substrate and the electrode placed outside the cutoff member. The material of the heat dissipating base has a linear expanding coefficient larger than that of the semiconductor element and smaller than three times that of the semiconductor element, and a thermal conductivity larger than 100 W/mK. The semiconductor elements are arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.

摘要翻译： 一种半导体器件，其中多个半导体元件的电极被结合到绝缘体基板上的多个电极图案中的至少一个上，绝缘体基板的另一个表面被结合到散热基底。 散热基座的上表面覆盖有用于从外部环境切断半导体元件的构件。 端子电连接所述绝缘体基板上的电极和放置在切断构件外部的电极。 散热基体的材料的线膨胀系数大于半导体元件的线膨胀系数，小于半导体元件的三倍，热导率大于100W / mK。 半导体元件布置在绝缘体基板上的至少一个电极表面和由另一个电极表面划分的至少两个区域中。

公开(公告)号：US06434008B1

公开(公告)日：2002-08-13

申请号：US09385632

申请日：1998-08-27

申请人： Kazuji Yamada ,  Akira Tanaka ,  Ryuichi Saito ,  Yasutoshi Kurihara ,  Tadao Kushima ,  Takashi Haramaki ,  Yoshihiko Koike ,  Takashi Hosokawa ,  Mamoru Sawahata ,  Masahiro Koizumi ,  Jin Onuki ,  Kazuhiro Suzuki ,  Isao Kobayashi ,  Hideo Shimizu ,  Yutaka Higashimura ,  Shigeki Sekine ,  Nobuya Koike ,  Hideya Kokubun

发明人： Kazuji Yamada ,  Akira Tanaka ,  Ryuichi Saito ,  Yasutoshi Kurihara ,  Tadao Kushima ,  Takashi Haramaki ,  Yoshihiko Koike ,  Takashi Hosokawa ,  Mamoru Sawahata ,  Masahiro Koizumi ,  Jin Onuki ,  Kazuhiro Suzuki ,  Isao Kobayashi ,  Hideo Shimizu ,  Yutaka Higashimura ,  Shigeki Sekine ,  Nobuya Koike ,  Hideya Kokubun

IPC分类号： H05K702

CPC分类号： H01L23/49562 ,  H01L23/049 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H02M7/003 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.

摘要翻译： 一种半导体器件，其中多个半导体元件被结合到绝缘体衬底上的至少一个电极图案上，所述绝缘体衬底在主表面上形成多个电极图案，所述半导体元件的每个电极电连接到所述电极图案， 绝缘体基板的另一表面被结合到散热基底上，散热基座的上表面覆盖有用于从外部环境切断半导体元件的构件，将绝缘体基板上的电极与电极电连接的端子 设置在切断部件外侧，散热基体的材料的线膨胀系数大于半导体元件的线膨胀系数，小于半导体元件的线膨胀系数的3倍，导热系数 大于100 W / mK，半音 电感元件布置在至少一个电极表面上，并且在至少两个区域中被绝缘体基底上的另一个电极表面分隔。

公开(公告)号：US5956231A

公开(公告)日：1999-09-21

申请号：US539075

申请日：1995-10-04

申请人： Kazuji Yamada ,  Akira Tanaka ,  Ryuichi Saito ,  Yasutoshi Kurihara ,  Tadao Kushima ,  Takashi Haramaki ,  Yoshihiko Koike ,  Takashi Hosokawa ,  Mamoru Sawahata ,  Masahiro Koizumi ,  Jin Onuki ,  Kazuhiro Suzuki ,  Isao Kobayashi ,  Hideo Shimizu ,  Yutaka Higashimura ,  Shigeki Sekine ,  Nobuya Koike ,  Hideya Kokubun

发明人： Kazuji Yamada ,  Akira Tanaka ,  Ryuichi Saito ,  Yasutoshi Kurihara ,  Tadao Kushima ,  Takashi Haramaki ,  Yoshihiko Koike ,  Takashi Hosokawa ,  Mamoru Sawahata ,  Masahiro Koizumi ,  Jin Onuki ,  Kazuhiro Suzuki ,  Isao Kobayashi ,  Hideo Shimizu ,  Yutaka Higashimura ,  Shigeki Sekine ,  Nobuya Koike ,  Hideya Kokubun

IPC分类号： H01L23/049 ,  H01L23/495 ,  H01L25/065 ,  H02M7/00 ,  H05K7/02 ,  H05K7/04

CPC分类号： H01L23/49562 ,  H01L23/049 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/18 ,  H02M7/003 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351

摘要： A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.

摘要翻译： 一种半导体器件，其中多个半导体元件被结合到绝缘体衬底上的至少一个电极图案上，所述绝缘体衬底在主表面上形成多个电极图案，所述半导体元件的每个电极电连接到所述电极图案， 绝缘体基板的另一表面被结合到散热基底上，散热基座的上表面覆盖有用于从外部环境切断半导体元件的构件，将绝缘体基板上的电极与电极电连接的端子 设置在切断部件外侧，散热基体的材料的线膨胀系数大于半导体元件的线膨胀系数，小于半导体元件的线膨胀系数的3倍，导热系数 大于100 W / mK，半音 电感元件布置在至少一个电极表面上，并且在至少两个区域中被绝缘体基底上的另一个电极表面分隔。

公开(公告)号：US08663135B2

公开(公告)日：2014-03-04

申请号：US12987432

申请日：2011-01-10

申请人： Takashi Hirata ,  Hideo Shimizu

发明人： Takashi Hirata ,  Hideo Shimizu

IPC分类号： A61H3/00

CPC分类号： A61H3/00 ,  A44B11/28 ,  A61H1/024 ,  A61H1/0244 ,  A61H2201/0192 ,  A61H2201/1215 ,  A61H2201/163 ,  A61H2201/1642 ,  A61H2201/165 ,  A61H2201/1676 ,  A61H2201/1697 ,  A61H2201/5061 ,  A61H2201/5069 ,  H01F7/0231

摘要： In a belt buckle device including a tongue piece (75, 76; 210; 310) connected to an end of a belt extending in a longitudinal direction and a hook member (68, 70; 220; 320) configured to be selectively connected to the tongue piece by engaging a first lateral bar of the tongue piece in a hook opening (111; 226; 326) defined by a hook portion (71, 72; 225; 324) thereof, a longitudinal dimension (B) between the free end of the tongue piece and a base end side of the first lateral bar is substantially equal to or smaller than a width (A) of the entrance of the hook opening, and the effective thickness (C) of the first lateral bar is greater than the width (A) of the entrance of the hook opening. Thus, the first lateral bar is held inside the hook opening as long as the tongue piece is kept in a flat position in a reliable manner. In particular, the first lateral bar can be freely introduced into the hook opening simply by raising the base end of the tongue piece while the first lateral bar is applied to the entrance of the hook opening so that the belt buckle device can be readily fastened even when the belt buckle device cannot be viewed from a proper viewing angle. Also, the belt buckle device can be readily fastened with a minimum dexterity requirement and very quickly.

摘要翻译： 在带扣装置中，包括连接到沿纵向延伸的带的端部的舌片（75,76; 210; 310）和钩构件（68,70; 220; 320），所述钩构件被配置为选择性地连接到 舌片通过将舌片的第一侧杆接合在由钩部分（71,72; 225; 324）限定的钩形开口（111; 226; 326）中，其纵向尺寸（B）在 舌片和第一侧杆的基端侧基本上等于或小于钩开口的入口的宽度（A），并且第一横杆的有效厚度（C）大于宽度 （A）吊钩开口的入口。 因此，只要舌片以可靠的方式保持在平坦位置，第一侧杆就保持在钩开口内。 特别地，第一侧杆可以简单地通过提升舌片的基端部而自由地引入钩形开口，同时第一侧杆施加到钩形开口的入口，使得带扣装置甚至可以容易地紧固 当皮带扣装置不能从正确的视角观察时。 此外，带扣装置可以以最小的灵巧要求容易地紧固并且非常快。

公开(公告)号：US08538017B2

公开(公告)日：2013-09-17

申请号：US13192122

申请日：2011-07-27

申请人： Tsukasa Endo ,  Hideo Shimizu ,  Yuichi Komano ,  Hanae Ikeda ,  Atsushi Shimbo

发明人： Tsukasa Endo ,  Hideo Shimizu ,  Yuichi Komano ,  Hanae Ikeda ,  Atsushi Shimbo

IPC分类号： H04L9/00

CPC分类号： H04L9/003 ,  H04L9/0631 ,  H04L2209/046 ,  H04L2209/24

摘要： According to one embodiment, in an encryption device, a segmentation unit segments masked plain data into pieces of first segmented data. A first processing unit generates pieces of second segmented data from the pieces of first segmented data. A nonlinear transform unit generates pieces of third segmented data transformed from the pieces of second segmented data. A data integration unit integrates fourth segmented data to generate masked encrypted data. An unmask processing unit generates encrypted data from the masked encrypted data. The exclusive OR of the pieces of second segmented data matches the exclusive OR of input data, subjected to nonlinear transform processing and calculated from the plain data, and the first mask. The exclusive OR of the pieces of third segmented data matches the exclusive OR of transform data, obtained when the nonlinear transform processing is performed on the input data, and the second mask.

摘要翻译： 根据一个实施例，在加密设备中，分割单元将屏蔽的普通数据分割成多个第一分段数据。 第一处理单元从第一分段数据生成第二分段数据。 非线性变换单元生成从第二分割数据变换的第三分段数据。 数据集成单元集成第四分段数据以生成被掩蔽的加密数据。 解密处理单元从掩蔽的加密数据生成加密数据。 第二分段数据的异或与进行非线性变换处理并从普通数据计算的输入数据的异或与第一掩码相匹配。 第三分段数据的异或与对输入数据执行非线性变换处理时获得的变换数据的异或与第二掩码相匹配。

公开(公告)号：US20130238931A1

公开(公告)日：2013-09-12

申请号：US13603707

申请日：2012-09-05

申请人： Toshihiro SUZUKI ,  Noboru Shibata ,  Hideo Shimizu

发明人： Toshihiro SUZUKI ,  Noboru Shibata ,  Hideo Shimizu

IPC分类号： G06F12/02 ,  G06F11/14

CPC分类号： G06F12/1408 ,  G06F11/1068 ,  G06F12/02 ,  G06F12/0246 ,  G06F21/602 ,  G06F21/79 ,  G06F2212/1044 ,  G06F2212/1052 ,  G06F2212/7203 ,  G09C1/00 ,  H04L9/0631 ,  H04L2209/12 ,  H04L2209/46

摘要： According to one embodiment, a nonvolatile semiconductor storage device includes an encrypting circuit for operating in a predetermined encrypting system, a memory cell array preliminarily storing complementary data to be used in the operation, and a page buffer having a first region for storing the data being read out from the memory cell array, and a second region used when executing the operation.

公开(公告)号：US08497400B2

公开(公告)日：2013-07-30

申请号：US12703079

申请日：2010-02-09

申请人： Hideo Shimizu ,  Daisuke Igarashi ,  Wataru Kuriyama ,  Yukinori Yusa

发明人： Hideo Shimizu ,  Daisuke Igarashi ,  Wataru Kuriyama ,  Yukinori Yusa

IPC分类号： C07C29/14 ,  C07C27/04 ,  B01J31/00

CPC分类号： C07C29/145 ,  B01J31/2409 ,  B01J31/2452 ,  B01J31/2457 ,  B01J2231/643 ,  B01J2531/0266 ,  B01J2531/16 ,  C07B35/02 ,  C07B53/00 ,  C07B2200/07 ,  C07C29/175 ,  C07C41/26 ,  C07C45/62 ,  C07C67/303 ,  C07C231/12 ,  C07C2601/14 ,  C07C2601/16 ,  C07D209/08 ,  C07D307/46 ,  C07F9/5045 ,  C07F9/65517 ,  C07C49/403 ,  C07C69/612 ,  C07C69/24 ,  C07C233/47 ,  C07C43/196 ,  C07C31/125 ,  C07C33/18 ,  C07C33/22 ,  C07C35/08 ,  C07C35/18

摘要： Provide that a useful catalyst for homogeneous hydrogenation, particularly a catalyst for homogeneous asymmetric hydrogenation for hydrogenation, particularly asymmetric hydrogenation, which is obtainable with comparative ease and is excellent in economically and workability, and a process for producing a hydrogenated compound of an unsaturated compound, particularly an optically active compound using said catalyst with a high yield and optical purity.

公开(公告)号：US08409743B2

公开(公告)日：2013-04-02

申请号：US12292806

申请日：2008-11-26

申请人： Wataru Okada ,  Hideo Shimizu ,  Shinsuke Nakamura ,  Tomoyuki Omura

发明人： Wataru Okada ,  Hideo Shimizu ,  Shinsuke Nakamura ,  Tomoyuki Omura

IPC分类号： H01M10/50

CPC分类号： H01M2/1077 ,  H01M2/0217 ,  H01M10/613 ,  H01M10/617 ,  H01M10/625 ,  H01M10/647 ,  H01M10/6557 ,  H01M10/6567 ,  H01M10/6569

摘要： A battery system includes a battery block, a cooling pipe, and a coolant feeding device. The battery block includes a plurality of rectangular batteries that have a width greater than a thickness and are securely arranged in array alignment by a battery holder. The cooling pipe cools the rectangular batteries of the battery block. The coolant feeding device feeds coolant to the cooling pipe. In the battery system, the cooling pipe is arranged on the surface of the battery block in a thermally-coupled state so that the rectangular batteries are cooled by the coolant, which is circulated through the cooling pipe.

公开(公告)号：US08409119B2

公开(公告)日：2013-04-02

申请号：US12785013

申请日：2010-05-21

申请人： Hideo Shimizu ,  Tatsuya Noda ,  Taiji Koyama

发明人： Hideo Shimizu ,  Tatsuya Noda ,  Taiji Koyama

IPC分类号： A61H1/02 ,  A61H1/00

CPC分类号： A61H3/008 ,  A61H1/0244 ,  A61H3/00 ,  A61H2201/1215 ,  A61H2201/163 ,  A61H2201/1642 ,  A61H2201/165 ,  A61H2201/1676 ,  B25J9/0006

摘要： A walking assistance device including a pelvic frame (10) extending from a lower back to each lateral side of a user, and a belly belt (20) for securing the pelvic frame in position. A power generator (30) is attached to each lateral side of the pelvic frame. A power transmitting arm (40) can be attached to an output member (33) of the power generator simply by hooking an upper part of a base end (41) of the power transmitting arm onto an upper groove (38) of the output member, and pushing a latch member or a slider (46) provided in a lower part of the base end onto a lower groove (39) of the output member. The user wearing the pelvic frame (10) can easily attach the power transmitting arm (40) to the output end of the power generator (30) by easily using a single hand without requiring help.

摘要翻译： 一种行走辅助装置，包括从使用者的下背部延伸到每个侧面的骨盆框架（10）和用于将骨盆框架固定就位的腹部带（20）。 发电机（30）安装在骨盆框架的每个侧面。 动力传递臂（40）可以简单地通过将动力传递臂的基端（41）的上部钩在输出构件的上槽（38）上而附接到发电机的输出构件（33） 并且将设置在基端的下部的闩锁构件或滑块（46）推到输出构件的下槽（39）上。 佩戴骨盆框架（10）的使用者可以容易地使用单手而不需要帮助就可以容易地将动力传递臂（40）附接到发电机（30）的输出端。